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Specialized (1062)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact plating | Surface Mount | Number of pins | Number of Terminals | Access Time-Max | Capacitors series | Case - inch | Case - mm | Connector | Connector pinout layout | Contacts pitch | Date Of Intro | Dielectric strength | Dimensions | Electrical mounting | Gross weight | Ihs Manufacturer | Kind of capacitor | Kind of connector | Moisture Sensitivity Levels | Mounting | Mounting method | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Row pitch | Spatial orientation | Supply Voltage-Nom (Vsup) | Transport packaging size/quantity | Type of capacitor | Type of connector | Operating temperature | Tolerance | JESD-609 Code | Pbfree Code | ECCN Code | Connector type | Terminal Finish | Additional Feature | HTS Code | Capacitance | Pitch | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Depth | Reach Compliance Code | Current rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Number of contacts | Dielectric | Supply Voltage-Max (Vsup) | Contact resistance | Temperature Grade | Supply Voltage-Min (Vsup) | Insulation resistance | Voltage | Operating Mode | Supply Current-Max | Organization | Seated Height-Max | Memory Width | Density | Standby Current-Max | Memory Density | Memory IC Type | Rated voltage | Profile | Features | Operating voltage | Mixed Memory Type | Temperature | Degree of protection | Height | Length | Width | Plating thickness | Flammability rating |
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![]() | Mfr Part No W29N01HZSINF | Winbond | Datasheet | - | - | Min: 1 Mult: 1 | 12X20mm2 | TSOPI - 48 | 40MHz | 1.7 ~ 1.95V | 1Gb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W29N02KZBIBF | Winbond | Datasheet | - | - | Min: 1 Mult: 1 | 9X11mm2 | VFBGA - 63 | 40MHz | 1.7 ~ 1.95V | 2Gb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W29N04GVBIAA | Winbond | Datasheet | - | - | Min: 1 Mult: 1 | 9X11mm2 | VFBGA - 63 | 40MHz | 2.7 ~ 3.6V | 4Gb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W29N04GVSIAA | Winbond | Datasheet | - | - | Min: 1 Mult: 1 | 12X20mm2 | TSOPI - 48 | 40MHz | 2.7 ~ 3.6V | 4Gb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NM1282KSLAXAL-3B | Nanya Technology Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 162 | NANYA TECHNOLOGY CORP | 67108864 words | 64000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Yes | 1.8 V | EAR99 | NAND IS ORGANISED AS 256M X 8 AND ALSO OPERATES WITH 1.2V NOMINAL SUPPLY | 8542.32.00.71 | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | R-PBGA-B162 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 64MX32 | 1 mm | 32 | 2147483648 bit | MEMORY CIRCUIT | 10.5 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MR2A16AVYS35 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | tinned | YES | 6 | 44 | socket | 2x3 | 1.27mm | 2018-08-17 | THT | 0.41 g | NXP SEMICONDUCTORS | female | 262144 words | 256000 | 105 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2-44 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | 1.27mm | straight | 3.3 V | pin strips | -40...163°C | EAR99 | 8542.32.00.71 | DUAL | GULL WING | 1 | 0.8 mm | unknown | 1.5A | R-PDSO-G44 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 256KX16 | 1.2 mm | 16 | 4194304 bit | MEMORY CIRCUIT | 125V | bronze | 18.41 mm | 10.16 mm | 4µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST32HF324C-70-4C-LBK | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | GCM | 0402 | 1005 | 500 (50 Hz, 1 min.) V | 0.03 g | SILICON STORAGE TECHNOLOGY INC | MLCC | SMD | soldering | 2097152 words | 2000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 34.4*23.3*24.5/100 | ceramic | -40 …+105 °C | ±5% | No | EAR99 | F - socket | STATIC RAM IS ORGANIZED AS 256K X 16 | 8542.32.00.71 | 11pF | 2.77 mm | BOTTOM | BALL | 240 | 1 | 1 mm | 16.3 | unknown | 48 | R-PBGA-B48 | Not Qualified | 9 in two rows | C0G (NP0) | 3.3 V | ≤20 mΩ | COMMERCIAL | 2.7 V | ≥1000 (at Uinsp.dc=500 V) MΩ | ASYNCHRONOUS | 2MX16 | 1.4 mm | 16 | 33554432 bit | MEMORY CIRCUIT | screw mounting | 100V | IP67 | 21.10 ±0.25 | 12 mm | 10 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST32HF802-70-4C-L3KE | Greenliant Systems Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | GREENLIANT SYSTEMS LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LFBGA | , | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | 3 V | EAR99 | SRAM IS ORGANIZED AS 128K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B48 | 3.3 V | 2.7 V | ASYNCHRONOUS | 512KX16 | 1.4 mm | 16 | 8388608 bit | MEMORY CIRCUIT | FLASH+SRAM | 8 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No THGBM3G4D1FBAIG | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 153 | TOSHIBA CORP | 2147483648 words | 2000000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3.3 V | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.5 mm | unknown | 153 | R-PBGA-B153 | 3.6 V | OTHER | 2.7 V | SYNCHRONOUS | 2GX8 | 1.2 mm | 8 | 17179869184 bit | MEMORY CIRCUIT | 13 mm | 11.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CDP1824 | Harris Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMS4461-15NL | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 150 ns | ROCHESTER ELECTRONICS LLC | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.4 | DIP24,.4 | RECTANGULAR | IN-LINE | Active | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | 64KX4 | 4 | 262144 bit | MEMORY CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MSM514212-34ZS | OKI Electric Industry Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | OKI ELECTRIC INDUSTRY CO LTD | 5048 words | 5048 | 70 °C | PLASTIC/EPOXY | ZIP | ZIP, | RECTANGULAR | IN-LINE | Obsolete | ZIP | 5 V | EAR99 | 8542.32.00.71 | ZIG-ZAG | THROUGH-HOLE | 1 | 1.27 mm | unknown | 28 | R-PZIP-T28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | SYNCHRONOUS | 5048X8 | 10.16 mm | 8 | 40384 bit | MEMORY CIRCUIT | 36 mm | 2.8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MSM514212-34ZS | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 34 ns | LAPIS SEMICONDUCTOR CO LTD | 70 °C | PLASTIC/EPOXY | ZIP | ZIP, ZIP28,.1 | ZIP28,.1 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | ZIG-ZAG | THROUGH-HOLE | 1.27 mm | unknown | R-PZIP-T28 | Not Qualified | COMMERCIAL | 0.03 mA | 0.03 A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S71PL064JB0BFWQB0 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 65 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 9 X 7 MM, 1.20 MM PITCH, LEAD FREE, FBGA-56 | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | Yes | EAR99 | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 56 | R-PBGA-B56 | Not Qualified | 3.6 V | COMMERCIAL EXTENDED | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | MEMORY CIRCUIT | FLASH+PSRAM | 9 mm | 7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MM5240AA/J | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | NATIONAL SEMICONDUCTOR CORP | 70 °C | -25 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-XDIP-T24 | Not Qualified | OTHER | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MM5240AA/J | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | NATIONAL SEMICONDUCTOR CORP | 70 °C | -25 °C | CERAMIC | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T24 | Not Qualified | OTHER | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS75V16F64GS32-7070DI | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 65 | 70 ns | INTEGRATED SILICON SOLUTION INC | 4194304 words | 4000000 | 85 °C | -30 °C | PLASTIC/EPOXY | LFBGA | 9 X 9 MM, 0.80 MM PITCH, FBGA-65 | BGA65,10X10,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | No | 2.9 V | e0 | No | EAR99 | TIN LEAD | ALSO CONTAINS 32MBIT PSEUDO SRAM | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 65 | S-PBGA-B65 | Not Qualified | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 0.053 mA | 4MX16 | 1.34 mm | 16 | 0.005 A | 67108864 bit | MEMORY CIRCUIT | FLASH+SRAM | 9 mm | 9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S72NS512RD0AHGL03 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | SPANSION INC | , | Obsolete | Yes | EAR99 | 8542.32.00.71 | 260 | unknown | 40 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SY6923PPC | Silergy Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC17S150XLSOG20C | AMD Xilinx | Datasheet | 421 | - | Min: 1 Mult: 1 | YES | 20 | XILINX INC | 3 | 1040128 words | 1040128 | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 1040128X1 | 2.65 mm | 1 | 1040128 bit | MEMORY CIRCUIT | 12.8 mm | 7.5 mm |
W29N01HZSINF
Winbond
Package:Specialized
Price: please inquire
W29N02KZBIBF
Winbond
Package:Specialized
Price: please inquire
W29N04GVBIAA
Winbond
Package:Specialized
Price: please inquire
W29N04GVSIAA
Winbond
Package:Specialized
Price: please inquire
NM1282KSLAXAL-3B
Nanya Technology Corporation
Package:Specialized
Price: please inquire
MR2A16AVYS35
NXP Semiconductors
Package:Specialized
Price: please inquire
SST32HF324C-70-4C-LBK
Silicon Storage Technology
Package:Specialized
Price: please inquire
SST32HF802-70-4C-L3KE
Greenliant Systems Ltd
Package:Specialized
Price: please inquire
THGBM3G4D1FBAIG
Toshiba America Electronic Components
Package:Specialized
Price: please inquire
CDP1824
Harris Semiconductor
Package:Specialized
Price: please inquire
TMS4461-15NL
Rochester Electronics LLC
Package:Specialized
Price: please inquire
MSM514212-34ZS
OKI Electric Industry Co Ltd
Package:Specialized
Price: please inquire
MSM514212-34ZS
LAPIS Semiconductor Co Ltd
Package:Specialized
Price: please inquire
S71PL064JB0BFWQB0
Spansion
Package:Specialized
Price: please inquire
MM5240AA/J
National Semiconductor Corporation
Package:Specialized
Price: please inquire
MM5240AA/J
Texas Instruments
Package:Specialized
Price: please inquire
IS75V16F64GS32-7070DI
Integrated Silicon Solution Inc
Package:Specialized
Price: please inquire
S72NS512RD0AHGL03
Spansion
Package:Specialized
Price: please inquire
SY6923PPC
Silergy Corporation
Package:Specialized
Price: please inquire
XC17S150XLSOG20C
AMD Xilinx
Package:Specialized
Price: please inquire
