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Specialized (1062)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Ihs Manufacturer	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Number of Ports	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	I/O Type	Memory IC Type	Refresh Cycles	Access Mode	Mixed Memory Type	Length	Width
Mfr Part No MM5240AA/J	National Semiconductor Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	24		NATIONAL SEMICONDUCTOR CORP				70 °C	-25 °C	CERAMIC	DIP		DIP24,.6	RECTANGULAR	IN-LINE	Obsolete		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE			2.54 mm	compliant			R-XDIP-T24	Not Qualified		OTHER
Mfr Part No MM5240AA/J	Texas Instruments	Datasheet	-	-	Min: 1 Mult: 1	NO	24		NATIONAL SEMICONDUCTOR CORP				70 °C	-25 °C	CERAMIC	DIP	DIP, DIP24,.6	DIP24,.6	RECTANGULAR	IN-LINE	Obsolete		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-XDIP-T24	Not Qualified		OTHER
Mfr Part No SST34HF1641C-70-4E-L1P	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SILICON STORAGE TECHNOLOGY INC		1048576 words	1000000	85 °C	-20 °C	PLASTIC/EPOXY	LFBGA	LFBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	No	3 V			EAR99		SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8	8542.32.00.71	BOTTOM	BALL	240	1	0.8 mm	unknown	10	56	R-PBGA-B56	Not Qualified	3.3 V	OTHER	2.7 V		ASYNCHRONOUS		1MX16		1.4 mm	16		16777216 bit		MEMORY CIRCUIT				10 mm	8 mm
Mfr Part No S71GL064A08BFW0B0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SPANSION INC	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER	SRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	56	R-PBGA-B56	Not Qualified	3.1 V	COMMERCIAL EXTENDED	2.7 V		ASYNCHRONOUS		4MX16		1.2 mm	16		67108864 bit		MEMORY CIRCUIT				9 mm	7 mm
Mfr Part No M36L0R7040U3ZA5U	SGS Thomson	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No S71PL032J40BAW0K2	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56	65 ns	SPANSION INC	3	2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA56,8X8,32	BGA56,8X8,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	3 V	e1		EAR99	TIN SILVER COPPER	PSRAM IS ORGANIZED AS 256K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		56	R-PBGA-B56	Not Qualified	3.6 V	COMMERCIAL EXTENDED	2.7 V		ASYNCHRONOUS		2MX16		1.2 mm	16		33554432 bit		MEMORY CIRCUIT			FLASH+PSRAM	9 mm	7 mm
Mfr Part No XC17S40PDG8I	AMD Xilinx	Datasheet	73 In Stock	-	Min: 1 Mult: 1	NO	8		XILINX INC	1	329312 words	329312	85 °C	-40 °C	PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes	5 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	Not Qualified	5.5 V	INDUSTRIAL	4.5 V		SYNCHRONOUS		329312X1		4.5974 mm	1		329312 bit		MEMORY CIRCUIT				9.3599 mm	7.62 mm
Mfr Part No M4-4103S-Z3	Moujen Switch	Datasheet	-	-	Min: 1 Mult: 1
Mfr Part No MAP168-45L	Waferscale Integration Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	44	45 ns	WAFERSCALE INTEGRATION INC				70 °C		CERAMIC	QCCJ		LDCC44,.7SQ	SQUARE	CHIP CARRIER	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	QUAD	J BEND			1.27 mm	unknown			S-XQCC-J44	Not Qualified		COMMERCIAL				0.143 mA					0.001 A
Mfr Part No MCM6605AL	Freescale Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	NO	22	300 ns	MOTOROLA SEMICONDUCTOR PRODUCTS		4096 words	4000	70 °C		CERAMIC	DIP	DIP, DIP22,.4	DIP22,.4	RECTANGULAR	IN-LINE	Obsolete		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-XDIP-T22	Not Qualified		COMMERCIAL					4KX1	3-STATE		1		4096 bit	SEPARATE		32
Mfr Part No MCM6605AL	Motorola Semiconductor Products	Datasheet	-	-	Min: 1 Mult: 1	NO	22	300 ns	MOTOROLA INC		4096 words	4000	70 °C		CERAMIC	DIP	DIP, DIP22,.4	DIP22,.4	RECTANGULAR	IN-LINE	Obsolete		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-XDIP-T22	Not Qualified		COMMERCIAL					4KX1	3-STATE		1		4096 bit	SEPARATE		32
Mfr Part No S71VS064RB0AHT0L0	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	52		SPANSION INC				85 °C	-25 °C	PLASTIC/EPOXY		, BGA52,6X10,20	BGA52,6X10,20			Obsolete		Yes	1.8 V			EAR99			8542.32.00.71			260			unknown	40			Not Qualified		OTHER												MEMORY CIRCUIT			FLASH+PSRAM
Mfr Part No TC528267J-70	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	40	70 ns	TOSHIBA CORP		262144 words	256000	70 °C		PLASTIC/EPOXY	SOJ			RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ		5 V					RAS ONLY/CAS BEFORE RAS/HIDDEN/AUTO REFRESH		DUAL	J BEND		1	1.27 mm	unknown		40	R-PDSO-J40	Not Qualified	5.5 V	COMMERCIAL	4.5 V	2	ASYNCHRONOUS		256KX8	3-STATE	3.7 mm	8		2097152 bit		VIDEO DRAM	512	FAST EDO AND PIPELINED PAGE		26.04 mm	10.16 mm
Mfr Part No UPD27C1000D-20	Renesas Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1				RENESAS ELECTRONICS CORP								,				Obsolete						EAR99			8542.32.00.71						unknown
Mfr Part No S71VS256RD0ZHE400	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SPANSION INC		16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	TFBGA,		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V			EAR99		PSRAM IS ORGANIZED AS 8M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown	40	56	R-PBGA-B56	Not Qualified	1.95 V	OTHER	1.7 V		SYNCHRONOUS		16MX16		1.2 mm	16		268435456 bit		MEMORY CIRCUIT				9.2 mm	8 mm
Mfr Part No S71VS256RD0ZHEC00	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SPANSION INC		16 words	16	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	9.20 X 8 MM, 0.50 MM PITCH, LEAD FREE, VFBGA-56		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V			EAR99		PSRAM IS ORGANIZED AS 8M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	compliant	40	56	R-PBGA-B56	Not Qualified	1.95 V	OTHER	1.7 V		SYNCHRONOUS		16X16		1.2 mm	16		256 bit		MEMORY CIRCUIT				9.2 mm	8 mm
Mfr Part No S71JL064H80BAW110	AMD	Datasheet	627 In Stock	-	Min: 1 Mult: 1	YES	73	70 ns	ADVANCED MICRO DEVICES INC		4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	11.60 X 8 MM, FBGA-73	BGA73,10X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Transferred	BGA	Yes	3 V			EAR99		PSRAM IS ORGANIZED AS 512K X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8	8542.32.00.71	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant	NOT SPECIFIED	73	R-PBGA-B73	Not Qualified	3.3 V	OTHER	2.7 V		ASYNCHRONOUS	0.045 mA	4MX16		1.4 mm	16		67108864 bit		MEMORY CIRCUIT			FLASH+PSRAM	11.6 mm	8 mm
Mfr Part No S71JL064H80BAW110	Spansion	Datasheet	-	-	Min: 1 Mult: 1	YES	73		SPANSION INC	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	LFBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	No	3 V	e0		EAR99	TIN LEAD	PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		73	R-PBGA-B73	Not Qualified	3.3 V	OTHER	2.7 V		ASYNCHRONOUS		4MX16		1.4 mm	16		67108864 bit		MEMORY CIRCUIT				11.6 mm	8 mm
Mfr Part No XC17S10PDG8I	AMD Xilinx	Datasheet	184 In Stock	-	Min: 1 Mult: 1	NO	8		XILINX INC	1	95008 words	95008	85 °C	-40 °C	PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes	5 V	e3	Yes	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	Not Qualified	5.5 V	INDUSTRIAL	4.5 V		SYNCHRONOUS		95008X1		4.5974 mm	1		95008 bit		MEMORY CIRCUIT				9.3599 mm	7.62 mm
Mfr Part No SST34HF1641-70-4C-LFP	Silicon Storage Technology	Datasheet	-	-	Min: 1 Mult: 1	YES	56		SILICON STORAGE TECHNOLOGY INC		1048576 words	1000000	70 °C		PLASTIC/EPOXY	LFBGA	LFBGA, BGA56,8X8,32	BGA56,8X8,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA		3 V			EAR99		ALSO CONTAINS 256K X 16 SRAM	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown		56	R-PBGA-B56	Not Qualified	3.3 V	COMMERCIAL	2.7 V		ASYNCHRONOUS	0.075 mA	1MX16		1.4 mm	16		16777216 bit		MEMORY CIRCUIT			FLASH+SRAM	10 mm	8 mm

Specialized (1062)