The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory IC Type
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No SST37VF040-70-3C-PHE | Greenliant Systems Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 70 ns | GREENLIANT SYSTEMS LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T32 | Not Qualified | COMMERCIAL | 0.02 mA | 512KX8 | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | NO | NO | NO | ||||||||||||||||||||||||||||||||||
 | Mfr Part No SST37VF040-70-3C-PHE | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 70 ns | MICROCHIP TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | DIP | ROHS COMPLIANT, PLASTIC, MO-015AP, DIP-32 | RECTANGULAR | IN-LINE | Active | DIP | Yes | 3 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 32 | R-PDIP-T32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 512KX8 | 5.08 mm | 8 | 4194304 bit | PARALLEL | FLASH | 2.7 V | 41.91 mm | 15.24 mm | ||||||||||||||||||||||||||
 | Mfr Part No SST39VF320-70-4I-EKE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, LEAD FREE, MO-142DD, TSOP1-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | Yes | 3 V | e3 | EAR99 | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 2.7 V | 18.4 mm | 12 mm | ||||||||||||||||||||||||||
| Mfr Part No TC58NC7710GHB | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29AL008D70TAI010 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SPANSION INC | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142BDD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3.3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 12 mm | ||||||||||
| Mfr Part No S29AL008D70TAI010 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 512KX16 | 1.2 mm | 16 | 8388608 bit | PARALLEL | FLASH | 3 V | 8 | TOP | 18.4 mm | 12 mm | |||||||||||||||||||||||
 | Mfr Part No W25X80ALSNIG | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 50 MHz | WINBOND ELECTRONICS CORP | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.150 INCH, GREEN, PLASTIC, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.3 V | SYNCHRONOUS | 0.02 mA | 1MX8 | 3-STATE | 1.72 mm | 8 | 0.00001 A | 8388608 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 4.85 mm | 3.9 mm | ||||||||||||||||||||
| Mfr Part No K9F5616U0B-PCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3.3 V | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.02 mA | 16MX16 | 16 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | NO | NO | YES | 2K | 8K | 256 words | YES | ||||||||||||||||||||||||||||||
| Mfr Part No AM29F800T-120EC | AMD | Datasheet | 663 | - | Min: 1 Mult: 1 | YES | 48 | 120 ns | ADVANCED MICRO DEVICES INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 100K WRITE/ERASE CYCLES MIN | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 512KX16 | 3-STATE | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 12 mm | |||||||||||||
| Mfr Part No K9F2816U0C-YIB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | SLC NAND TYPE | TIN LEAD | CONTAINS ADDITIONAL 4M BIT NAND FLASH | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 8MX16 | 1.2 mm | 16 | 0.00005 A | 134217728 bit | PARALLEL | FLASH | 2.7 V | NO | NO | YES | 1K | 8K | 256 words | YES | 18.4 mm | 12 mm | |||||||||||||||
| Mfr Part No AM27C020-75PC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 70 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3-STATE | 5.715 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | 42.164 mm | 15.24 mm | |||||||||||||||||||||||
 | Mfr Part No CY7C243-20PC | Cypress Semiconductor | Datasheet | 4 | - | Min: 1 Mult: 1 | NO | 24 | 20 ns | CYPRESS SEMICONDUCTOR CORP | 4096 words | 4000 | 70 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 24 | R-PDIP-T24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.1 mA | 4KX8 | 3-STATE | 8 | 32768 bit | PARALLEL | COMMON | OTP ROM | ||||||||||||||||||||||||||||
| Mfr Part No HY27US08561A-TCB | SK Hynix Inc | Datasheet | 1600 | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SK HYNIX INC | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | No | EAR99 | SLC NAND TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 32MX8 | 1.2 mm | 8 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | 3.3 V | NO | NO | YES | 2K | 16K | 512 words | YES | 18.4 mm | 12 mm | ||||||||||||||||
| Mfr Part No MX27C4000AQC-90 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.04 mA | 512KX8 | 3-STATE | 3.55 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 14.05 mm | 11.43 mm | ||||||||||||||||||||||||
| Mfr Part No S29GL128S10TFIV2 | Cypress Semiconductor | Datasheet | 96 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MBM29DL163BE-70PBT | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SPANSION INC | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | PLASTIC, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.05 mA | 1MX16 | 1.2 mm | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,31 | 8K,64K | YES | BOTTOM | YES | 8 mm | 6 mm | ||||||||||||||
| Mfr Part No S29PL064J70BFI12 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA48,6X8,32 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | e1 | Yes | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 4MX16 | 1 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,126 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | ||||||||||
| Mfr Part No R5C833-TQFP128Q | onsemi | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX29F001TTC-12 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | MACRONIX INTERNATIONAL CO LTD | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP32,.8,20 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 1.2 mm | 8 | 0.000005 A | 1048576 bit | PARALLEL | FLASH | 5 V | YES | YES | YES | 1,2,2,1,1 | 8K,4K,8K,32K,64K | TOP | 18.4 mm | 8 mm | ||||||||||||||||||
| Mfr Part No GD5F2GQ4UBZIGY | GigaDevice Semiconductor (Beijing) Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 120 MHz | GIGADEVICE SEMICONDUCTOR INC | 536870912 words | 512000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, | RECTANGULAR | GRID ARRAY, THIN PROFILE | Contact Manufacturer | Yes | 3.3 V | EAR99 | IT ALSO HAVE MEMORY WIDTH X1 | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | unknown | NOT SPECIFIED | R-PBGA-B24 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 512MX4 | 1.2 mm | 4 | 2147483648 bit | SERIAL | FLASH | 3.3 V | 2 | 8 mm | 6 mm |
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SST37VF040-70-3C-PHE
Greenliant Systems Ltd
Package:Memory - Modules
Price: please inquire
-
SST37VF040-70-3C-PHE
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
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SST39VF320-70-4I-EKE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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TC58NC7710GHB
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
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S29AL008D70TAI010
Spansion
Package:Memory - Modules
Price: please inquire
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S29AL008D70TAI010
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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W25X80ALSNIG
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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K9F5616U0B-PCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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AM29F800T-120EC
AMD
Package:Memory - Modules
Price: please inquire
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K9F2816U0C-YIB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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AM27C020-75PC
AMD
Package:Memory - Modules
Price: please inquire
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CY7C243-20PC
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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HY27US08561A-TCB
SK Hynix Inc
Package:Memory - Modules
Price: please inquire
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MX27C4000AQC-90
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL128S10TFIV2
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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MBM29DL163BE-70PBT
Spansion
Package:Memory - Modules
Price: please inquire
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S29PL064J70BFI12
Spansion
Package:Memory - Modules
Price: please inquire
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R5C833-TQFP128Q
onsemi
Package:Memory - Modules
Price: please inquire
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MX29F001TTC-12
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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GD5F2GQ4UBZIGY
GigaDevice Semiconductor (Beijing) Inc
Package:Memory - Modules
Price: please inquire