The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory IC Type
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No S29JL032H70TAI220 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DDD, TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||||||||||||||
| Mfr Part No S29GL064M10TFIR40 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP56,.8,20 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | |||||||||||||||||||||||||||||
 | Mfr Part No MT28F800B3WG-8B | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 80 ns | MICRON TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, PLASTIC, TSOP1-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.015 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | NO | NO | YES | 1,2,1,7 | 16K,8K,96K,128K | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||||
 | Mfr Part No AM29LV008BT-120EE | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 120 ns | SPANSION INC | 3 | 1048576 words | 1000000 | 125 °C | -55 °C | PLASTIC/EPOXY | TSSOP | MO-142BCD, TSOP-40 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3 V | e0 | 3A001.A.2.C | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 40 | R-PDSO-G40 | Not Qualified | 3.6 V | MILITARY | 2.7 V | ASYNCHRONOUS | 0.03 mA | 1MX8 | 1.2 mm | 8 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 0.00012 ms | 20 | 1 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 10 mm | ||||||||||||
| Mfr Part No IS25WP016-JULA3 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | INTEGRATED SILICON SOLUTION INC | 2097152 words | 2000000 | 125 °C | -40 °C | PLASTIC/EPOXY | HVSON | VSON, | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Active | Yes | 1.8 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | R-PDSO-N8 | 1.95 V | AUTOMOTIVE | 1.65 V | SYNCHRONOUS | 2MX8 | 3-STATE | 0.6 mm | 8 | 16777216 bit | AEC-Q100 | SERIAL | FLASH | 1.8 V | QSPI | 20 | HARDWARE/SOFTWARE | 3 mm | 2 mm | |||||||||||||||||||||||||||
 | Mfr Part No PF48F4400P0VTQ0A | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 88 | 88 ns | INTEL CORP | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 8 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, SCSP-88 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | 1.8 V | e1 | Yes | EAR99 | NOR TYPE | TIN SILVER COPPER | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | NOT SPECIFIED | 88 | R-PBGA-B88 | Not Qualified | 2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 32MX16 | 1.2 mm | 16 | 536870912 bit | PARALLEL | FLASH | 1.8 V | TOP | 11 mm | 8 mm | |||||||||||||||||||||||||
| Mfr Part No EN25P16-50VIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | EON SILICON SOLUTION INC | , | Obsolete | EAR99 | 8542.32.00.51 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX27C1100PC-12 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 120 ns | MACRONIX INTERNATIONAL CO LTD | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | QUICK PULSE PROGRAMMING ALGORITHM | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-PDIP-T40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.04 mA | 64KX16 | 3-STATE | 4.9022 mm | 16 | 0.0001 A | 1048576 bit | PARALLEL | COMMON | OTP ROM | 8 | 52.07 mm | 15.24 mm | |||||||||||||||||||||||||
| Mfr Part No MX25U5121EOI-14G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 70 MHz | MACRONIX INTERNATIONAL CO LTD | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | Yes | 1.8 V | e6 | EAR99 | NOR TYPE | TIN BISMUTH | CAN BE ORGNISED AS 512 MBIT X 1 | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.65 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 2 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | 0.025 mA | 128KX4 | 1.2 mm | 4 | 0.00001 A | 524288 bit | SERIAL | FLASH | 1.8 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 4.4 mm | 3 mm | |||||||||||||||||||
| Mfr Part No SST39VF010-70-4C-W | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S25FL128POXMFI003 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 104 MHz | SPANSION INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | Yes | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1.27 mm | compliant | 40 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.026 mA | 16MX8 | 8 | 0.00002 A | 134217728 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||
 | Mfr Part No SST29VF040-55-4I-NHE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Transferred | QFJ | Yes | 3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 512KX8 | 3.55 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | YES | YES | 4K | 128 | 13.97 mm | 11.43 mm | ||||||||||||||||||||||
| Mfr Part No EN25S40A-104XIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | EON SILICON SOLUTION INC | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, HALOGEN FREE, ROHS AND REACH COMPLIANT, USON-8 | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | Yes | 1.8 V | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | R-PDSO-N8 | 1.95 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | 0.018 mA | 512KX8 | 3-STATE | 0.6 mm | 8 | 0.00001 A | 4194304 bit | SERIAL | FLASH | 1.8 V | QSPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 3 mm | 2 mm | |||||||||||||||||||||||
| Mfr Part No EN25S40A-104XIP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | USON-8 | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Contact Manufacturer | Yes | 1.8 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | R-PDSO-N8 | 1.95 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | 0.018 mA | 512KX8 | 3-STATE | 0.6 mm | 8 | 0.00001 A | 4194304 bit | SERIAL | FLASH | 1.8 V | QSPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 3 mm | 2 mm | ||||||||||||||||||||||||
| Mfr Part No NX25P40-VNI | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 25 MHz | WINBOND ELECTRONICS CORP | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.150 INCH, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | not_compliant | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 512KX8 | 3-STATE | 1.72 mm | 8 | 0.000005 A | 4194304 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 4.85 mm | 3.9 mm | ||||||||||||||||||||
| Mfr Part No HY27UH088G2M-TCB | SK Hynix Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SK HYNIX INC | 1073741824 words | 1000000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | SLC NAND TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.06 mA | 1GX8 | 1.2 mm | 8 | 0.0002 A | 8589934592 bit | PARALLEL | FLASH | 3.3 V | NO | NO | YES | 8K | 128K | 2K words | YES | 18.4 mm | 12 mm | ||||||||||||||||||||
| Mfr Part No S25FL064P0XMFB001 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 104 MHz | 2016-08-18 | CYPRESS SEMICONDUCTOR CORP | 8388608 words | 8000000 | 105 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G16 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 8MX8 | 3-STATE | 2.65 mm | 8 | 67108864 bit | AEC-Q100 | SERIAL | FLASH | 3 V | QSPI | 10.3 mm | 7.5 mm | |||||||||||||||||||||||||||||||
 | Mfr Part No X76F400S8 | IC Microsystems Sdn Bhd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 512 words | 512 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | DATA RETENTION = 100 YEARS | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | SYNCHRONOUS | 0.003 mA | 512X8 | 1.75 mm | 8 | 0.000001 A | 4096 bit | SERIAL | FLASH | 5 V | 100000 Write/Erase Cycles | 10 ms | 100 | SOFTWARE | 4.89 mm | 3.9 mm | |||||||||||||||||||
| Mfr Part No SST28SF040-150-3C-NH | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 150 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | No | 5 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | QUAD | J BEND | 1.27 mm | unknown | R-PQCC-J32 | Not Qualified | COMMERCIAL | 0.04 mA | 512KX8 | 8 | 0.00002 A | 4194304 bit | PARALLEL | FLASH | 1000 Write/Erase Cycles | YES | YES | NO | 2K | 256 | ||||||||||||||||||||||||||||||||
| Mfr Part No S29AL004D90TFI013 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 3 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 256KX16 | 1.2 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 12 mm |
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S29JL032H70TAI220
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
S29GL064M10TFIR40
AMD
Package:Memory - Modules
Price: please inquire
-
MT28F800B3WG-8B
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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AM29LV008BT-120EE
Spansion
Package:Memory - Modules
Price: please inquire
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IS25WP016-JULA3
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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PF48F4400P0VTQ0A
Intel Corporation
Package:Memory - Modules
Price: please inquire
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EN25P16-50VIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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MX27C1100PC-12
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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MX25U5121EOI-14G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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SST39VF010-70-4C-W
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
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S25FL128POXMFI003
Spansion
Package:Memory - Modules
Price: please inquire
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SST29VF040-55-4I-NHE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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EN25S40A-104XIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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EN25S40A-104XIP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
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NX25P40-VNI
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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HY27UH088G2M-TCB
SK Hynix Inc
Package:Memory - Modules
Price: please inquire
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S25FL064P0XMFB001
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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X76F400S8
IC Microsystems Sdn Bhd
Package:Memory - Modules
Price: please inquire
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SST28SF040-150-3C-NH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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S29AL004D90TFI013
Spansion
Package:Memory - Modules
Price: please inquire