The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory IC Type
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No N82HS321CF | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 25 ns | PHILIPS COMPONENTS | 4096 words | 4000 | 75 °C | CERAMIC, GLASS-SEALED | , | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-GDIP-T24 | Not Qualified | 5.25 V | COMMERCIAL EXTENDED | 4.75 V | ASYNCHRONOUS | 4KX8 | 3-STATE | 8 | 32768 bit | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No MSM27C231ZB-NTS-K | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 150 ns | LAPIS SEMICONDUCTOR CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G32 | Not Qualified | COMMERCIAL | 0.02 mA | 256KX8 | 3-STATE | 8 | 0.00001 A | 2097152 bit | COMMON | |||||||||||||||||||||||||||||||||||
| Mfr Part No K9F1G16D0M-YCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 2.7 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.02 mA | 64MX16 | 16 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | NO | NO | YES | 1K | 64K | 1K words | YES | ||||||||||||||||||||||||||||
| Mfr Part No MX29F040CQI-55G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | Yes | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | QUAD | J BEND | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 512KX8 | 3.55 mm | 8 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | YES | YES | YES | 8 | 64K | 14.05 mm | 11.43 mm | |||||||||||||||||
| Mfr Part No GD25Q128BZIG | ELM Technology Corp | Datasheet | - | - | Min: 1 Mult: 1 | ELM TECHNOLOGY CORP | Contact Manufacturer | EAR99 | 8542.32.00.51 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M90FAIR4 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Transferred | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.4 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | 13 mm | 11 mm | ||||||||||||
| Mfr Part No ES29LV800DT-70TC | Excel (Suzhou) Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | EXCEL SEMICONDUCTOR INC | 3 | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 240 | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.03 mA | 512KX16 | 16 | 0.00001 A | 8388608 bit | PARALLEL | FLASH | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | ||||||||||||||||||||||||
| Mfr Part No 82S185A/BVA | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 55 ns | PHILIPS COMPONENTS | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | , | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-CDIP-T18 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 2KX4 | 3-STATE | 4 | 8192 bit | PARALLEL | OTP ROM | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No 82S185A/BVA | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 55 ns | NXP SEMICONDUCTORS | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-GDIP-T18 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 2KX4 | 3-STATE | 5.08 mm | 4 | 8192 bit | PARALLEL | OTP ROM | 7.62 mm | |||||||||||||||||||||||||||||||
 | Mfr Part No MX27L256QC-20 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 200 ns | MACRONIX INTERNATIONAL CO LTD | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 3 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.01 mA | 32KX8 | 3-STATE | 3.55 mm | 8 | 0.00001 A | 262144 bit | PARALLEL | COMMON | OTP ROM | 12.75 V | 14.05 mm | 11.43 mm | |||||||||||||||||||||||
| Mfr Part No MZ-V9P2T0GW | Samsung Electronics Co. Ltd | Datasheet | 2292 |
| Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M11FAIS10 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SST45VF010-10-4C-SA | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 10 MHz | SILICON STORAGE TECHNOLOGY INC | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | 4.90 X 6 MM, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.03 mA | 1MX1 | 1.75 mm | 1 | 0.000015 A | 1048576 bit | SERIAL | FLASH | 2.7 V | SPI | 10000 Write/Erase Cycles | 100 | HARDWARE | 4.9 mm | 3.9 mm | ||||||||||||||||||||
 | Mfr Part No S29GL512N11FAI020 | Spansion | Datasheet | 720 | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | SPANSION INC | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3 V | e0 | No | 3A991.B.1.A | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.4 mm | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | 13 mm | 11 mm | |||||||||||
| Mfr Part No S29GL512N11FAI020 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | ADVANCED MICRO DEVICES INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA64,8X8,40 | BGA64,8X8,40 | SQUARE | GRID ARRAY | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | Not Qualified | INDUSTRIAL | 0.09 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | |||||||||||||||||||||||||
| Mfr Part No AM29SL800DT90WAF | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | Not Qualified | 2.2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 0.03 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 1.8 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 8.15 mm | 6.15 mm | ||||||||||
| Mfr Part No AM29F200BB-55SC | AMD | Datasheet | 1264 | - | Min: 1 Mult: 1 | YES | 44 | 55 ns | ADVANCED MICRO DEVICES INC | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP44,.63 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | No | 5 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | MINIMUM 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 2.8 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 20 | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | 28.2 mm | 13.3 mm | |||||||||||||
 | Mfr Part No AM29F200BB-55SC | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 55 ns | SPANSION INC | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP44,.63 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | MIN 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 2.8 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 20 | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | 28.2 mm | 13.3 mm | ||||||||||
| Mfr Part No X-7656-21407 | TE Connectivity | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No K9F3208U0B-TCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 35 ns | SAMSUNG SEMICONDUCTOR INC | 4194304 words | 4000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 3.3 V | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.8 mm | compliant | 44 | R-PDSO-G40 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 4MX8 | 1.2 mm | 8 | 33554432 bit | PARALLEL | FLASH | 2.7 V | 18.41 mm | 10.16 mm |
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N82HS321CF
YAGEO Corporation
Package:Memory - Modules
Price: please inquire
-
MSM27C231ZB-NTS-K
LAPIS Semiconductor Co Ltd
Package:Memory - Modules
Price: please inquire
-
K9F1G16D0M-YCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
-
MX29F040CQI-55G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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GD25Q128BZIG
ELM Technology Corp
Package:Memory - Modules
Price: please inquire
-
S29GL064M90FAIR4
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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ES29LV800DT-70TC
Excel (Suzhou) Semiconductor Co Ltd
Package:Memory - Modules
Price: please inquire
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82S185A/BVA
YAGEO Corporation
Package:Memory - Modules
Price: please inquire
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82S185A/BVA
NXP Semiconductors
Package:Memory - Modules
Price: please inquire
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MX27L256QC-20
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
-
MZ-V9P2T0GW
Samsung Electronics Co. Ltd
Package:Memory - Modules
307.327556
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S29GL064M11FAIS10
Spansion
Package:Memory - Modules
Price: please inquire
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SST45VF010-10-4C-SA
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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S29GL512N11FAI020
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL512N11FAI020
AMD
Package:Memory - Modules
Price: please inquire
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AM29SL800DT90WAF
Spansion
Package:Memory - Modules
Price: please inquire
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AM29F200BB-55SC
AMD
Package:Memory - Modules
Price: please inquire
-
AM29F200BB-55SC
Spansion
Package:Memory - Modules
Price: please inquire
-
X-7656-21407
TE Connectivity
Package:Memory - Modules
Price: please inquire
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K9F3208U0B-TCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire