The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No FT24C128A-TSR-T | FMD(Fremont Micro Devices) | Datasheet | - | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M393B2G70EB0-YMA | Samsung | Datasheet | 400 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M474A4G43AB1-CVF | Samsung | Datasheet | 69 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M393A1K43BB0-CPB | Samsung | Datasheet | 400 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE28F128J3D75D | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 75 ns | NUMONYX | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 14 X 20 MM, TSOP-56 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | PARALLEL | FLASH | 2.7 V | 8 | 18.4 mm | 14 mm | |||||||||||||||||||||||||||
| Mfr Part No AT29624-0WRD-1 | Microchip Technology Inc | Datasheet | 80100 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No N25Q064A11EF840E | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 108 MHz | MICRON TECHNOLOGY INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | VDFN-8 | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | 1.8 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 1 | 1.27 mm | unknown | R-PDSO-N8 | 2 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 8MX8 | 3-STATE | 1 mm | 8 | 67108864 bit | SERIAL | FLASH | 1.8 V | QSPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 8 mm | 6 mm | ||||||||||||||||||||||||||||
| Mfr Part No MBM29PL64LM90PCN | FUJITSU Semiconductor Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 90 ns | FUJITSU LTD | 4194304 words | 4000000 | 70 °C | -20 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 14 mm | |||||||||||||||||||||||||||||
| Mfr Part No MBM29PL64LM90PCN | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 90 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 70 °C | -20 °C | PLASTIC/EPOXY | TSOP1 | PLASTIC, TSOP1-56 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 14 mm | |||||||||||||||||||||||||
 | Mfr Part No K9F1216U0A-DIB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 3.3 V | EAR99 | CONTAINS ADDITIONAL 16M BIT NAND FLASH | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 63 | R-PBGA-B63 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 32MX16 | 1 mm | 16 | 536870912 bit | PARALLEL | FLASH | 2.7 V | 11 mm | 9 mm | ||||||||||||||||||||||||||||||
| Mfr Part No MR27V852EJA | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 42 | 100 ns | LAPIS SEMICONDUCTOR CO LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ42,.44 | SOJ42,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | J BEND | 1 | 1.27 mm | unknown | 42 | R-PDSO-J42 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.08 mA | 512KX16 | 3-STATE | 3.75 mm | 16 | 0.00005 A | 8388608 bit | PARALLEL | COMMON | OTP ROM | 8 | 27.3 mm | 10.16 mm | ||||||||||||||||||||||||
| Mfr Part No AM28F010-200LI | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 200 ns | ROCHESTER ELECTRONICS LLC | 131072 words | 128000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, | RECTANGULAR | CHIP CARRIER | Contact Manufacturer | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | BULK ERASE | 8542.32.00.51 | QUAD | NO LEAD | 1 | 1.27 mm | unknown | R-CQCC-N32 | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 128KX8 | 2.54 mm | 8 | 1048576 bit | PARALLEL | FLASH | 12 V | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||
| Mfr Part No AM28F010-200LI | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 200 ns | ADVANCED MICRO DEVICES INC | 131072 words | 128000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | CERAMIC, LCC-32 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | BULK ERASE | 8542.32.00.51 | QUAD | NO LEAD | 1 | 1.27 mm | unknown | 32 | R-CQCC-N32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 128KX8 | 3-STATE | 2.54 mm | 8 | 0.0001 A | 1048576 bit | PARALLEL | FLASH | 12 V | 10000 Write/Erase Cycles | NO | NO | YES | 13.97 mm | 11.43 mm | |||||||||||||||||
| Mfr Part No ID240L02 | Sharp Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | 200 ns | SHARP CORP | 10485760 words | 10000000 | 60 °C | UNSPECIFIED | PC CARD-68 | UNSPECIFIED | MICROELECTRONIC ASSEMBLY | Obsolete | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | UNSPECIFIED | UNSPECIFIED | 1 | unknown | X-XXMA-X68 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 10MX16 | 16 | 167772160 bit | PARALLEL | FLASH | 5 V | 8 | |||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064A90TFIR73 | Spansion | Datasheet | 332 | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142EC, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 3.3 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 32K | 4 words | YES | YES | 18.4 mm | 12 mm | ||||||||||||
| Mfr Part No SST39LF100-45-4C-WIE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 45 ns | SILICON STORAGE TECHNOLOGY INC | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP40,.56,20 | TSSOP40,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | R-PDSO-G40 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 64KX16 | 1.2 mm | 16 | 0.00002 A | 1048576 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 32 | 2K | 12.4 mm | 10 mm | |||||||||||||||||||||
 | Mfr Part No SST29VF040-55-4C-NHE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Transferred | QFJ | Yes | 3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 512KX8 | 3.55 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | YES | YES | 4K | 128 | 13.97 mm | 11.43 mm | |||||||||||||||||||||
 | Mfr Part No M29W400DT55ZE6 | STMicroelectronics | Datasheet | 93 | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | STMICROELECTRONICS | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 256KX16 | 1.2 mm | 16 | 0.0001 A | 4194304 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | 8 mm | 6 mm | |||||||||||||||
| Mfr Part No M29W400DT55ZE6 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | NUMONYX | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 256KX16 | 1.2 mm | 16 | 0.0001 A | 4194304 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | 8 mm | 6 mm | |||||||||||||||
| Mfr Part No SDINBDG4-8G-XAT | SanDisk Corporation | Datasheet | 1214 |
| Min: 1 Mult: 1 |
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FT24C128A-TSR-T
FMD(Fremont Micro Devices)
Package:Memory - Modules
Price: please inquire
-
M393B2G70EB0-YMA
Samsung
Package:Memory - Modules
6.002660
-
M474A4G43AB1-CVF
Samsung
Package:Memory - Modules
36.618321
-
M393A1K43BB0-CPB
Samsung
Package:Memory - Modules
44.374007
-
TE28F128J3D75D
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
-
AT29624-0WRD-1
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
-
N25Q064A11EF840E
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
-
MBM29PL64LM90PCN
FUJITSU Semiconductor Limited
Package:Memory - Modules
Price: please inquire
-
MBM29PL64LM90PCN
Spansion
Package:Memory - Modules
Price: please inquire
-
K9F1216U0A-DIB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
-
MR27V852EJA
LAPIS Semiconductor Co Ltd
Package:Memory - Modules
Price: please inquire
-
AM28F010-200LI
Rochester Electronics LLC
Package:Memory - Modules
Price: please inquire
-
AM28F010-200LI
AMD
Package:Memory - Modules
Price: please inquire
-
ID240L02
Sharp Corp
Package:Memory - Modules
Price: please inquire
-
S29GL064A90TFIR73
Spansion
Package:Memory - Modules
Price: please inquire
-
SST39LF100-45-4C-WIE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
-
SST29VF040-55-4C-NHE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
-
M29W400DT55ZE6
STMicroelectronics
Package:Memory - Modules
Price: please inquire
-
M29W400DT55ZE6
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
-
SDINBDG4-8G-XAT
SanDisk Corporation
Package:Memory - Modules
14.314331