The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No TBP38S030-25N | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 25 ns | TEXAS INSTRUMENTS INC | 32 words | 32 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | R-PDIP-T16 | Not Qualified | COMMERCIAL | 0.125 mA | 32X8 | 8 | OTP ROM | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PA28F008S3-150 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 150 ns | INTEL CORP | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | 13.30 X 28.20 MM, PLASTIC, SOP-44 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | USER-SELECTABLE 3.3V OR 12V VPP | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.04 mA | 1MX8 | 2.95 mm | 8 | 0.00001 A | 8388608 bit | PARALLEL | FLASH | 2.7 V | NO | NO | YES | 16 | 64K | YES | 28.2 mm | 13.3 mm | |||||||||||||||||||
| Mfr Part No S29GL128M10TFIR10 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 3.3 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 8MX16 | 1.2 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 64K | 4/8 words | YES | YES | 18.4 mm | 14 mm | ||||||||||||
| Mfr Part No S29GL128M10TFIR10 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 8MX16 | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 64K | 4/8 words | YES | YES | ||||||||||||||||||||||||||||||
 | Mfr Part No AT27LV512R-25RC | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 250 ns | ATMEL CORP | 2 | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | GULL WING | 225 | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.02 mA | 64KX8 | 3-STATE | 2.79 mm | 8 | 0.00002 A | 524288 bit | PARALLEL | COMMON | OTP ROM | 18.25 mm | 8.74 mm | |||||||||||||||||||||||
 | Mfr Part No W25P16VSSI | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 25 MHz | WINBOND ELECTRONICS CORP | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.3 | SOP8,.3 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | not_compliant | 8 | S-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.032 mA | 2MX8 | 3-STATE | 2.16 mm | 8 | 0.000005 A | 16777216 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 5.27 mm | 5.27 mm | ||||||||||||||||||||
 | Mfr Part No S29WS128J0PBFW110 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 55 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | 8 X 11.60 MM, LEAD FREE, FBGA-84 | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | Not Qualified | 1.95 V | OTHER | 1.65 V | ASYNCHRONOUS | 0.054 mA | 8MX16 | 1 mm | 16 | 0.00005 A | 134217728 bit | PARALLEL | FLASH | 1.8 V | YES | YES | YES | 16,254 | 4K,32K | YES | BOTTOM/TOP | YES | 11.6 mm | 8 mm | |||||||||||||
| Mfr Part No SST39SF020A-45-4C-NHE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 45 ns | SILICON STORAGE TECHNOLOGY INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | Yes | 5 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 260 | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.035 mA | 256KX8 | 3.556 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | FLASH | 5 V | YES | YES | YES | 64 | 4K | 13.97 mm | 11.43 mm | ||||||||||||||||||||
| Mfr Part No MX66L1G45GXDI-10G/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K4T1G164QJ | Samsung | Datasheet | 15 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX25L51245GMQ-08G | MXIC(Macronix) | Datasheet | 15 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BL24CM1A-SFRC | BL(Shanghai Belling) | Datasheet | 48000 | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K4B4G1646E-BYK000 | Samsung Electro-Mechanics | Datasheet | 1460 |
| Min: 1 Mult: 1 | Tray | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FT24C32A-ELR-T | FMD(Fremont Micro Devices) | Datasheet | - | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M378A2G43AB3-CWE | Samsung | Datasheet | 10 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX25L3206EM2I-12G/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SST27VF020-70-3C-NH | Silicon Storage Technology | Datasheet | 848 | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 3 V | EAR99 | 8542.32.00.51 | QUAD | J BEND | 240 | 1 | 1.27 mm | unknown | 10 | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 256KX8 | 3.556 mm | 8 | 2097152 bit | PARALLEL | FLASH | 12 V | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||
 | Mfr Part No SST37VF040-90-3C-PH | Silicon Storage Technology | Datasheet | 4 | - | Min: 1 Mult: 1 | NO | 32 | 90 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 512KX8 | 5.08 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | NO | NO | NO | 41.91 mm | 15.24 mm | |||||||||||||||||||||||
| Mfr Part No S29AL008D90TFI013 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142BDD, TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 512KX16 | 1.2 mm | 16 | 8388608 bit | PARALLEL | FLASH | 3 V | 8 | TOP | 18.4 mm | 12 mm | ||||||||||||||||||||||||
 | Mfr Part No S29AL008D90TFI013 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142BDD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 3.3 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 12 mm |
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TBP38S030-25N
Texas Instruments
Package:Memory - Modules
Price: please inquire
-
PA28F008S3-150
Intel Corporation
Package:Memory - Modules
Price: please inquire
-
S29GL128M10TFIR10
Spansion
Package:Memory - Modules
Price: please inquire
-
S29GL128M10TFIR10
AMD
Package:Memory - Modules
Price: please inquire
-
AT27LV512R-25RC
Atmel Corporation
Package:Memory - Modules
Price: please inquire
-
W25P16VSSI
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
-
S29WS128J0PBFW110
Spansion
Package:Memory - Modules
Price: please inquire
-
SST39SF020A-45-4C-NHE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
-
MX66L1G45GXDI-10G/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
-
K4T1G164QJ
Samsung
Package:Memory - Modules
15.677353
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MX25L51245GMQ-08G
MXIC(Macronix)
Package:Memory - Modules
6.783433
-
BL24CM1A-SFRC
BL(Shanghai Belling)
Package:Memory - Modules
Price: please inquire
-
K4B4G1646E-BYK000
Samsung Electro-Mechanics
Package:Memory - Modules
3.228789
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FT24C32A-ELR-T
FMD(Fremont Micro Devices)
Package:Memory - Modules
Price: please inquire
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M378A2G43AB3-CWE
Samsung
Package:Memory - Modules
5.047803
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MX25L3206EM2I-12G/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
-
SST27VF020-70-3C-NH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
-
SST37VF040-90-3C-PH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
-
S29AL008D90TFI013
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
S29AL008D90TFI013
Spansion
Package:Memory - Modules
Price: please inquire