The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
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- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Active Read Current - Max | Clock Frequency-Max (fCLK) | Data Retention | Date Of Intro | Factory Pack Quantity | Ihs Manufacturer | Interface Type | Maximum Clock Frequency | Maximum Operating Temperature | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Packaging | JESD-609 Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No S29PL127J60BFI00 | Spansion | Datasheet | 504 | - | Min: 1 Mult: 1 | YES | 80 | 60 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8 X 11 MM, LEAD FREE, FBGA-80 | BGA80,8X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | TOP AND BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 80 | R-PBGA-B80 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.07 mA | 8MX16 | 1 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,254 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 11 mm | 8 mm | ||||||||||||||||||||||||||
 | Mfr Part No S29GL512N10TAI01 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | BOTTOM/TOP | YES | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29AL004D70TAI020 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | INDUSTRIAL | 0.035 mA | 256KX16 | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29AL004D70TAI020 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 256KX16 | 1.2 mm | 16 | 4194304 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX25UW51245GXDI00/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M25P40-VMW6TP | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 75 MHz | NUMONYX | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.3 V | SYNCHRONOUS | 0.015 mA | 512KX8 | 2.5 mm | 8 | 4194304 bit | SERIAL | FLASH | 2.7 V | 15 ms | 5.62 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX30UF4G18AC-XKI/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL01GS11TFA023 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | 2017-05-03 | CYPRESS SEMICONDUCTOR CORP | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | R-PDSO-G56 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.08 mA | 128MX8 | 1.2 mm | 8 | 1073741824 bit | AEC-Q100 | PARALLEL | FLASH | 3 V | BOTTOM/TOP | 18.4 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M10TAIR1 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | ADVANCED MICRO DEVICES INC | Obsolete | EAR99 | 8542.32.00.51 | unknown | FLASH | 3 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 25CS640-H/SN | Microchip Technology | Datasheet | 588 |
| Min: 1 Mult: 1 | SOIC-8 | 5 mA | 200 Year | 100 | SPI | 20 MHz | + 150 C | - 40 C | SMD/SMT | 5.5 V | 2.5 V | Tube | 2.5 V to 5.5 V | 64 kbit | 8 k x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25CS640T-H/SN | Microchip Technology | Datasheet | 2871 |
| Min: 1 Mult: 1 | SOIC-8 | 5 mA | 200 Year | 3300 | SPI | 20 MHz | + 150 C | - 40 C | SMD/SMT | 5.5 V | 1.7 V | Reel | 1.7 V to 5.5 V | 64 kbit | 8 k x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC17256D-SO8C | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 200 ns | 12 MHz | XILINX INC | 3 | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | GULL WING | 225 | 1 | 1.27 mm | not_compliant | 30 | R-PDSO-G8 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.01 mA | 256KX8 | 3-STATE | 8 | 0.00005 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PM25LQ040-EWE | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | INTEGRATED SILICON SOLUTION INC | 524288 words | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | VSOP | VSOP, TSOP8,.25 | TSOP8,.25 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Active | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G8 | Not Qualified | 3.6 V | AUTOMOTIVE | 2.3 V | SYNCHRONOUS | 0.012 mA | 512KX8 | 0.9 mm | 8 | 0.00003 A | 4194304 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX26LV800BTC-70 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 512KX16 | 1.2 mm | 16 | 0.0001 A | 8388608 bit | PARALLEL | FLASH | 3 V | 2000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | BOTTOM | 18.4 mm | 12 mm | |||||||||||||||||||||||||||||||
| Mfr Part No N82HS321CF | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 25 ns | PHILIPS COMPONENTS | 4096 words | 4000 | 75 °C | CERAMIC, GLASS-SEALED | , | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-GDIP-T24 | Not Qualified | 5.25 V | COMMERCIAL EXTENDED | 4.75 V | ASYNCHRONOUS | 4KX8 | 3-STATE | 8 | 32768 bit | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MSM27C231ZB-NTS-K | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 150 ns | LAPIS SEMICONDUCTOR CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G32 | Not Qualified | COMMERCIAL | 0.02 mA | 256KX8 | 3-STATE | 8 | 0.00001 A | 2097152 bit | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K9F1G16D0M-YCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 2.7 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.02 mA | 64MX16 | 16 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | NO | NO | YES | 1K | 64K | 1K words | YES | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX29F040CQI-55G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | Yes | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | QUAD | J BEND | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 512KX8 | 3.55 mm | 8 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | YES | YES | YES | 8 | 64K | 14.05 mm | 11.43 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No GD25Q128BZIG | ELM Technology Corp | Datasheet | - | - | Min: 1 Mult: 1 | ELM TECHNOLOGY CORP | Contact Manufacturer | EAR99 | 8542.32.00.51 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M90FAIR4 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Transferred | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.4 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | 13 mm | 11 mm |
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S29PL127J60BFI00
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL512N10TAI01
AMD
Package:Memory - Modules
Price: please inquire
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S29AL004D70TAI020
AMD
Package:Memory - Modules
Price: please inquire
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S29AL004D70TAI020
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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MX25UW51245GXDI00/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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M25P40-VMW6TP
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
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MX30UF4G18AC-XKI/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL01GS11TFA023
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29GL064M10TAIR1
AMD
Package:Memory - Modules
Price: please inquire
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25CS640-H/SN
Microchip Technology
Package:Memory - Modules
0.654182
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25CS640T-H/SN
Microchip Technology
Package:Memory - Modules
0.704724
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XC17256D-SO8C
AMD Xilinx
Package:Memory - Modules
Price: please inquire
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PM25LQ040-EWE
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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MX26LV800BTC-70
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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N82HS321CF
YAGEO Corporation
Package:Memory - Modules
Price: please inquire
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MSM27C231ZB-NTS-K
LAPIS Semiconductor Co Ltd
Package:Memory - Modules
Price: please inquire
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K9F1G16D0M-YCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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MX29F040CQI-55G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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GD25Q128BZIG
ELM Technology Corp
Package:Memory - Modules
Price: please inquire
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S29GL064M90FAIR4
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire