The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Cable external diameter | Cable features | Cable structure | Clock Frequency-Max (fCLK) | Core marking | Core structure | Earth core | Gross weight | Ihs Manufacturer | Kind of core | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package contents | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Shield structure | Supply Voltage-Nom (Vsup) | Type of wire | Version | Wire insulation material | Operating temperature | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Write Protection | Rated voltage | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of cores | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Core diameter | Saturation Current | Length | Width |
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 | Mfr Part No P25Q40SH-TSH-IR | PUYA??? | Datasheet | 8000 | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K4F8E3S4HD-GFCL | Samsung | Datasheet | 1600 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M29W160ET70N6 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | NUMONYX | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 12 X 20 MM, PLASTIC, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | TSOP | No | 3 V | EAR99 | NOR TYPE | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 1MX16 | 1.2 mm | 16 | 0.0001 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | YES | TOP | YES | 18.4 mm | 12 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No PM49FL004T-33JCE | BHC Components / KEMET | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PM49FL004T-33JCE | Programmable Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | PROGRAMMABLE MICROELECTRONICS CORP | 524288 words | 512000 | 85 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Transferred | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | QUAD | J BEND | 1.27 mm | unknown | R-PQCC-J32 | Not Qualified | OTHER | 0.02 mA | 512KX8 | 8 | 0.0005 A | 4194304 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 4K | TOP | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RC28F128J3F75 | Alliance Memory Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 75 ns | ALLIANCE MEMORY INC | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Active | 3 V | NOR TYPE | BOTTOM | BALL | 1 | 1 mm | unknown | R-PBGA-B64 | 3.6 V | 2.7 V | ASYNCHRONOUS | 0.07 mA | 128MX1 | OPEN-DRAIN | 1.2 mm | 1 | 0.002 A | 134217728 bit | PARALLEL | FLASH | 3 V | 100000 Write/Erase Cycles | 0.000075 ms | YES | NO | NO | 128 | 64K | YES | YES | 13 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RC28F128J3F75 | Micron Technology Inc | Datasheet | 320 | - | Min: 1 Mult: 1 | YES | 64 | 75 ns | MICRON TECHNOLOGY INC | 1 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | No | 3 V | e0 | No | EAR99 | NOR TYPE | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.32.00.51 | BOTTOM | BALL | 235 | 1 | 1 mm | unknown | 30 | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.054 mA | 8MX16 | 1.2 mm | 16 | 0.00012 A | 134217728 bit | PARALLEL | FLASH | 2.7 V | 8 | NO | NO | YES | 128 | 128K | 4/8 words | YES | YES | 13 mm | 10 mm | |||||||||||||||||||||||||||||
| Mfr Part No S34ML04G100TFI00 | Spansion | Datasheet | 8 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q256JVFIN | Winbond Electronics Corp | Datasheet | 14 |
| Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS25LP064D-QBLA3-TR | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MZ7L3480HCHQ-00A07 | Samsung Electronics Co. Ltd | Datasheet | 96 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MZ7L3240HCHQ-00A07 | Samsung Electronics Co. Ltd | Datasheet | 1280 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 27C512-15FA | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 150 ns | NXP SEMICONDUCTORS | 65536 words | 64000 | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP-28 | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-CDIP-T28 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.015 mA | 64KX8 | 8 | 524288 bit | PARALLEL | UVPROM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PM25LV010-33SCE | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 33 MHz | INTEGRATED SILICON SOLUTION INC | 131072 words | 128000 | 85 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G8 | Not Qualified | OTHER | 0.03 mA | 128KX8 | 8 | 0.00005 A | 1048576 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLMCG4JEUD-B04 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M29W128GL70ZA6E | STMicroelectronics | Datasheet | 1811 | - | Min: 1 Mult: 1 | YES | 64 | 70 ns | STMICROELECTRONICS | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Transferred | BGA | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 40 | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 8MX16 | 1.2 mm | 16 | 0.0001 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | 13 mm | 10 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064A10FAIR30 | Spansion | Datasheet | 1531 | - | Min: 1 Mult: 1 | YES | 64 | 100 ns | SPANSION INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE 8M X 8 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.4 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | TOP | YES | 3 | 13 mm | 11 mm | ||||||||||||||||||||||||||||
| Mfr Part No S29GL064A10FAIR30 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 100 ns | 6.4mm | twisted pair conductors | 12x2x28AWG | colours without colour repetition | stranded | none | 2525.8 g | CYPRESS SEMICONDUCTOR CORP | Cu | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 30.5m | 13 X 11 MM, FBGA-64 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | No | Al-PET foil, | 3.3 V | data transmission | Splice Free | PVC | max. 75°C | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 4MX16 | 1.4 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 50V | 8 | 24 | TOP | 28AWG | 3 | 13 mm | 11 mm | |||||||||||||||||||||||||||
 | Mfr Part No N28F020-120 | Intel Corporation | Datasheet | 391 | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | INTEL CORP | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | 0.450 X 0.550 INCH, PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 100000 ERASE/PROGRAM CYCLES | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3.55 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | FLASH | 12 V | 100000 Write/Erase Cycles | NO | NO | YES | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M471A5244CB0-CWE | Samsung | Datasheet | 110 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true |
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P25Q40SH-TSH-IR
PUYA???
Package:Memory - Modules
Price: please inquire
-
K4F8E3S4HD-GFCL
Samsung
Package:Memory - Modules
8.113962
-
M29W160ET70N6
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
-
PM49FL004T-33JCE
BHC Components / KEMET
Package:Memory - Modules
Price: please inquire
-
PM49FL004T-33JCE
Programmable Microelectronics Corp
Package:Memory - Modules
Price: please inquire
-
RC28F128J3F75
Alliance Memory Inc
Package:Memory - Modules
Price: please inquire
-
RC28F128J3F75
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
-
S34ML04G100TFI00
Spansion
Package:Memory - Modules
Price: please inquire
-
W25Q256JVFIN
Winbond Electronics Corp
Package:Memory - Modules
2.443044
-
IS25LP064D-QBLA3-TR
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
-
MZ7L3480HCHQ-00A07
Samsung Electronics Co. Ltd
Package:Memory - Modules
Price: please inquire
-
MZ7L3240HCHQ-00A07
Samsung Electronics Co. Ltd
Package:Memory - Modules
Price: please inquire
-
27C512-15FA
NXP Semiconductors
Package:Memory - Modules
Price: please inquire
-
PM25LV010-33SCE
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
-
KLMCG4JEUD-B04
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
-
M29W128GL70ZA6E
STMicroelectronics
Package:Memory - Modules
Price: please inquire
-
S29GL064A10FAIR30
Spansion
Package:Memory - Modules
Price: please inquire
-
S29GL064A10FAIR30
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
N28F020-120
Intel Corporation
Package:Memory - Modules
Price: please inquire
-
M471A5244CB0-CWE
Samsung
Package:Memory - Modules
42.582097