The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No K4U6E3S4AA-MGCR | Samsung | Datasheet | 130 |
| Min: 1 Mult: 1 | Tray | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K3LK2K20BM-BGCN | Samsung | Datasheet | 43 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M29W160ET70N6 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | NUMONYX | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 12 X 20 MM, PLASTIC, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | TSOP | No | 3 V | EAR99 | NOR TYPE | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 1MX16 | 1.2 mm | 16 | 0.0001 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | YES | TOP | YES | 18.4 mm | 12 mm | |||||||||||||||||
| Mfr Part No PM49FL004T-33JCE | BHC Components / KEMET | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PM49FL004T-33JCE | Programmable Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | PROGRAMMABLE MICROELECTRONICS CORP | 524288 words | 512000 | 85 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Transferred | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | QUAD | J BEND | 1.27 mm | unknown | R-PQCC-J32 | Not Qualified | OTHER | 0.02 mA | 512KX8 | 8 | 0.0005 A | 4194304 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 4K | TOP | |||||||||||||||||||||||||||||||||
| Mfr Part No RC28F128J3F75 | Alliance Memory Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 75 ns | ALLIANCE MEMORY INC | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Active | 3 V | NOR TYPE | BOTTOM | BALL | 1 | 1 mm | unknown | R-PBGA-B64 | 3.6 V | 2.7 V | ASYNCHRONOUS | 0.07 mA | 128MX1 | OPEN-DRAIN | 1.2 mm | 1 | 0.002 A | 134217728 bit | PARALLEL | FLASH | 3 V | 100000 Write/Erase Cycles | 0.000075 ms | YES | NO | NO | 128 | 64K | YES | YES | 13 mm | 10 mm | ||||||||||||||||||||||||
| Mfr Part No RC28F128J3F75 | Micron Technology Inc | Datasheet | 320 | - | Min: 1 Mult: 1 | YES | 64 | 75 ns | MICRON TECHNOLOGY INC | 1 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | No | 3 V | e0 | No | EAR99 | NOR TYPE | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.32.00.51 | BOTTOM | BALL | 235 | 1 | 1 mm | unknown | 30 | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.054 mA | 8MX16 | 1.2 mm | 16 | 0.00012 A | 134217728 bit | PARALLEL | FLASH | 2.7 V | 8 | NO | NO | YES | 128 | 128K | 4/8 words | YES | YES | 13 mm | 10 mm | ||||||||||||
| Mfr Part No S34ML04G100TFI00 | Spansion | Datasheet | 8 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q256JVFIN | Winbond Electronics Corp | Datasheet | 14 |
| Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS25LP064D-QBLA3-TR | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MZ7L3480HCHQ-00A07 | Samsung Electronics Co. Ltd | Datasheet | 96 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MZ7L3240HCHQ-00A07 | Samsung Electronics Co. Ltd | Datasheet | 1280 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 27C512-15FA | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 150 ns | NXP SEMICONDUCTORS | 65536 words | 64000 | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP-28 | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-CDIP-T28 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.015 mA | 64KX8 | 8 | 524288 bit | PARALLEL | UVPROM | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL512N11TFI023 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | SPANSION INC | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 3 V | e3 | Yes | 3A991.B.1.A | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.2 mm | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | 18.4 mm | 14 mm | ||||||||||||
| Mfr Part No S29GL512N11TFI023 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142EC, TSOP-56 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G56 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.2 mm | 16 | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 14 mm | ||||||||||||||||||||||||||
| Mfr Part No S29GL512N11TFI023 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | ADVANCED MICRO DEVICES INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.09 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||||||||||
 | Mfr Part No PC28F640P30BF65 | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 65 ns | MICRON TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | 10 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | Yes | 1.8 V | e1 | Yes | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | 64 | R-PBGA-B64 | 2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS/SYNCHRONOUS | 0.028 mA | 4MX16 | 3-STATE | 1.2 mm | 16 | 0.000035 A | 67108864 bit | PARALLEL | FLASH | 1.8 V | NO | NO | YES | 4,63 | 16K,64K | 8 words | BOTTOM | YES | 13 mm | 10 mm | ||||||||||||||||
 | Mfr Part No S29PL064J55BFI12 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA48,6X8,32 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | e1 | Yes | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 4MX16 | 1 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,126 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | ||||||||||||
 | Mfr Part No S25FL040A0LVFI001 | Spansion | Datasheet | 120 | - | Min: 1 Mult: 1 | YES | 8 | 50 MHz | SPANSION INC | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.150 INCH, LEAD FREE, PLASTIC, MS-012AA, SOP-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | unknown | 40 | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.013 mA | 512KX8 | 3-STATE | 1.75 mm | 8 | 0.000005 A | 4194304 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | |||||||||||||||
| Mfr Part No S29PL032J70BAW12 | Spansion | Datasheet | 862 | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | 8.15 X 6.15 MM, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | No | 3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 0.07 mA | 2MX16 | 1 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,62 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm |
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K4U6E3S4AA-MGCR
Samsung
Package:Memory - Modules
13.638780
-
K3LK2K20BM-BGCN
Samsung
Package:Memory - Modules
107.797241
-
M29W160ET70N6
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
-
PM49FL004T-33JCE
BHC Components / KEMET
Package:Memory - Modules
Price: please inquire
-
PM49FL004T-33JCE
Programmable Microelectronics Corp
Package:Memory - Modules
Price: please inquire
-
RC28F128J3F75
Alliance Memory Inc
Package:Memory - Modules
Price: please inquire
-
RC28F128J3F75
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
-
S34ML04G100TFI00
Spansion
Package:Memory - Modules
Price: please inquire
-
W25Q256JVFIN
Winbond Electronics Corp
Package:Memory - Modules
2.443044
-
IS25LP064D-QBLA3-TR
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
-
MZ7L3480HCHQ-00A07
Samsung Electronics Co. Ltd
Package:Memory - Modules
Price: please inquire
-
MZ7L3240HCHQ-00A07
Samsung Electronics Co. Ltd
Package:Memory - Modules
Price: please inquire
-
27C512-15FA
NXP Semiconductors
Package:Memory - Modules
Price: please inquire
-
S29GL512N11TFI023
Spansion
Package:Memory - Modules
Price: please inquire
-
S29GL512N11TFI023
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
S29GL512N11TFI023
AMD
Package:Memory - Modules
Price: please inquire
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PC28F640P30BF65
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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S29PL064J55BFI12
Spansion
Package:Memory - Modules
Price: please inquire
-
S25FL040A0LVFI001
Spansion
Package:Memory - Modules
Price: please inquire
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S29PL032J70BAW12
Spansion
Package:Memory - Modules
Price: please inquire