The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory IC Type
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Write Cycle Time-Max (tWC) | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No AM29LV320ML101REI | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.08 mA | 2MX16 | 1.2 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 64 | 64K | 4/8 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm | ||||||||
| Mfr Part No AM29LV320ML101REI | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.08 mA | 2MX16 | 1.2 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 64 | 64K | 4/8 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm | ||||||||||
| Mfr Part No S29GL128N11FFIS43 | Spansion | Datasheet | 150 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLMAG1JETD-B041009 | Samsung Electronics Co. Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX25L6473EM2R-12G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | MACRONIX INTERNATIONAL CO LTD | 8388608 words | 8000000 | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Active | 3 V | EAR99 | ALSO ORGANISED AS 64M X1 | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | R-PDSO-G8 | 3.6 V | 2.7 V | SYNCHRONOUS | 8MX8 | 2.16 mm | 8 | 67108864 bit | SERIAL | FLASH | 3 V | 2 | 5.28 mm | 5.23 mm | ||||||||||||||||||||||||||||||
| Mfr Part No HM1-6641-9 | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | INTERSIL CORP | 512 words | 512 | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T24 | Not Qualified | INDUSTRIAL | 512X8 | 8 | 4096 bit | OTP ROM | ||||||||||||||||||||||||||||||||||||
| Mfr Part No TH58NVG1S3AFT00 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 45 ns | TOSHIBA CORP | 268435456 words | 256000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.03 mA | 256MX8 | 8 | 0.00005 A | 2147483648 bit | PARALLEL | FLASH | NO | NO | YES | 2K | 128K | 2K words | YES | |||||||||||||||||||||||||||||
| Mfr Part No S29GL512N11FAI020 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FBGA-64 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.4 mm | 16 | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | 13 mm | 11 mm | |||||||||||||||||||||||
| Mfr Part No KLUCZ-65.241 | 4Carmedia | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX27C256MC-90 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | TIN LEAD | QUICK PULSE PROGRAMMING ALGORITHM | 8542.32.00.71 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.04 mA | 32KX8 | 3-STATE | 8 | 0.0001 A | 262144 bit | PARALLEL | COMMON | OTP ROM | 12.5 V | |||||||||||||||||||||
| Mfr Part No S29NS032J0LBJW000 | Spansion | Datasheet | 9100 | - | Min: 1 Mult: 1 | YES | 44 | 70 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 44 | R-PBGA-B44 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 0.06 mA | 2MX16 | 1 mm | 16 | 0.00004 A | 33554432 bit | PARALLEL | FLASH | 1.8 V | 80 ms | YES | YES | YES | 4,63 | 8K,32K | YES | TOP | YES | 7.7 mm | 6.2 mm | |||||||
| Mfr Part No S29GL064M90TFIR6 | Spansion | Datasheet | 438 | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 0.5 mm | unknown | 40 | R-PDSO-G48 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 32K | 4 words | YES | ||||||||||||||||||||
| Mfr Part No S29GL064N90TFI40 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 3 V | e3 | EAR99 | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 12 mm | ||||||||||||||||||||||||
| Mfr Part No S29GL064N90TFI40 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142EC, TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | TSOP1 | Yes | 3 V | e3 | Yes | EAR99 | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 12 mm | |||||||||||||||||||||
| Mfr Part No S29GL064M90BAIR30 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 90 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 12 X 11 MM, FBGA-63 | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | not_compliant | 63 | R-PBGA-B63 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | TOP | YES | 12 mm | 11 mm | |||||||
| Mfr Part No S29GL064M90BAIR30 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 90 ns | ADVANCED MICRO DEVICES INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B63 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | TOP | YES | ||||||||||||||||||||||
| Mfr Part No S29PL127J60BFI00 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | 60 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8 X 11 MM, LEAD FREE, FBGA-80 | BGA80,8X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | Yes | 3 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | TOP AND BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 40 | R-PBGA-B80 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.07 mA | 8MX16 | 1 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,254 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 11 mm | 8 mm | |||||||||
| Mfr Part No S29GL512N10TAI01 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | SPANSION INC | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.06 mA | 32MX16 | 1.2 mm | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm | ||||||||
| Mfr Part No SDSDQAE-256G-K | Western Digital Corp | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29AL004D70TAI020 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SPANSION INC | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 256KX16 | 1.2 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | 18.4 mm | 12 mm |
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AM29LV320ML101REI
Spansion
Package:Memory - Modules
Price: please inquire
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AM29LV320ML101REI
AMD
Package:Memory - Modules
Price: please inquire
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S29GL128N11FFIS43
Spansion
Package:Memory - Modules
Price: please inquire
-
KLMAG1JETD-B041009
Samsung Electronics Co. Ltd
Package:Memory - Modules
Price: please inquire
-
MX25L6473EM2R-12G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
-
HM1-6641-9
Intersil Corporation
Package:Memory - Modules
Price: please inquire
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TH58NVG1S3AFT00
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
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S29GL512N11FAI020
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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KLUCZ-65.241
4Carmedia
Package:Memory - Modules
Price: please inquire
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MX27C256MC-90
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29NS032J0LBJW000
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL064M90TFIR6
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL064N90TFI40
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29GL064N90TFI40
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL064M90BAIR30
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL064M90BAIR30
AMD
Package:Memory - Modules
Price: please inquire
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S29PL127J60BFI00
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29GL512N10TAI01
Spansion
Package:Memory - Modules
Price: please inquire
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SDSDQAE-256G-K
Western Digital Corp
Package:Memory - Modules
Price: please inquire
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S29AL004D70TAI020
Spansion
Package:Memory - Modules
Price: please inquire