The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Length | Width |
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 | Mfr Part No IS29GL128-70FLA3H | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 70 ns | INTEGRATED SILICON SOLUTION INC | 134217728 words | 128000000 | 125 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | Yes | 3 V | e3 | EAR99 | TIN | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B64 | 3.6 V | AUTOMOTIVE | 2.7 V | ASYNCHRONOUS | 128MX1 | 1.4 mm | 1 | 134217728 bit | AEC-Q100 | PARALLEL | FLASH | 3 V | 13 mm | 11 mm | ||||||||||||||||||||||||||||||
| Mfr Part No S99-50019 | Spansion | Datasheet | 800 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AM29F004BB-70JF | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SPANSION INC | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LEAD FREE, PLASTIC, MO-052AE, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | Yes | 5 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | BOTTOM BOOT BLOCK | 8542.32.00.51 | QUAD | J BEND | 260 | 1 | 1.27 mm | unknown | 40 | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.04 mA | 512KX8 | 3.556 mm | 8 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 5 V | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | BOTTOM | 13.97 mm | 11.43 mm | |||||||||||||
| Mfr Part No ES29LV800DT-70WGI | Excel (Suzhou) Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | EXCEL SEMICONDUCTOR INC | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA48,6X8,32 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 260 | 0.8 mm | unknown | R-PBGA-B48 | Not Qualified | INDUSTRIAL | 0.03 mA | 512KX16 | 16 | 0.00001 A | 8388608 bit | PARALLEL | FLASH | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | ||||||||||||||||||||||||||
| Mfr Part No MZVL2512HCJQ-00B00 | Samsung Electronics Co. Ltd | Datasheet | 8004 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APS25608N-OBR-BD | AP Memory | Datasheet | 1375 |
| Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX25U8035ZUI-25G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 40 MHz | MACRONIX INTERNATIONAL CO LTD | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | VSON, SOLCC8,.16,32 | SOLCC8,.16,32 | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | Obsolete | SON | Yes | 1.8 V | EAR99 | NOR TYPE | ALSO CONFIGURABLE AS 8M X 1, 10 YEAR DATA RETENTION | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.8 mm | unknown | NOT SPECIFIED | 8 | S-PDSO-N8 | Not Qualified | 2 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | 0.022 mA | 2MX4 | 0.6 mm | 4 | 0.000005 A | 8388608 bit | SERIAL | FLASH | 1.8 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 4 mm | 4 mm | ||||||||||||||||||
| Mfr Part No SST45LF010-10-4C-SAE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 10 MHz | SILICON STORAGE TECHNOLOGY INC | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | 4.90 X 6 MM, MS-012AA, LEAD FREE, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.03 mA | 1MX1 | 1.75 mm | 1 | 0.000015 A | 1048576 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE | 4.9 mm | 3.9 mm | |||||||||||||||||||||||
| Mfr Part No K9F2816Q0C-HCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 40 ns | SAMSUNG SEMICONDUCTOR INC | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | FBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | 1.8 V | EAR99 | SLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B63 | Not Qualified | COMMERCIAL | 0.015 mA | 8MX16 | 16 | 0.00005 A | 134217728 bit | PARALLEL | FLASH | NO | NO | YES | 1K | 8K | 256 words | YES | ||||||||||||||||||||||||||||||||
 | Mfr Part No SST37VF040-70-3C-PHE | Silicon Storage Technology | Datasheet | 400 | - | Min: 1 Mult: 1 | NO | 32 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Transferred | DIP | Yes | 3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 512KX8 | 5.08 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | NO | NO | NO | 41.91 mm | 15.24 mm | |||||||||||||||||||||
| Mfr Part No MX29F200TTC-70 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | MACRONIX INTERNATIONAL CO LTD | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX16 | 1.2 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 12 mm | ||||||||||||||||
| Mfr Part No WF2M32-90HM5 | White Microelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 66 | 90 ns | WHITE MICROELECTRONICS | 2097152 words | 2000000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | 1.185 INCH, CERAMIC, HIP-66 | SQUARE | IN-LINE | Transferred | 5 V | NOR TYPE | ALSO CONFIGURABLE AS 8M X 8 | HEX | PIN/PEG | 1 | unknown | S-CHIP-P66 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 2MX32 | 3-STATE | 32 | 67108864 bit | PARALLEL | FLASH MODULE | 5 V | 16 | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No WF2M32-90HM5 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 66 | 90 ns | MICROSEMI CORP | 2097152 words | 2000000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | SQUARE | GRID ARRAY | Transferred | PGA | No | 5 V | e4 | 3A001.A.2.C | NOR TYPE | GOLD | CAN BE CONFIGURED AS 8M X 8 | 8542.32.00.51 | PERPENDICULAR | PIN/PEG | 1 | 2.54 mm | unknown | 66 | S-CPGA-P66 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 2MX32 | 6.22 mm | 32 | 67108864 bit | PARALLEL | FLASH MODULE | 5 V | 16 | 30.1 mm | 30.1 mm | |||||||||||||||||||||||||
| Mfr Part No M29W640GL90NB6E | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 90 ns | MICRON TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | R-PDSO-G56 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 14 mm | |||||||||||||||||||||||||||||
| Mfr Part No SST37VF040-70-3C-PH | Silicon Storage Technology | Datasheet | 104 | - | Min: 1 Mult: 1 | NO | 32 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 512KX8 | 5.08 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | NO | NO | NO | 41.91 mm | 15.24 mm | |||||||||||||||||||||
| Mfr Part No S29GL064M11BFIR0 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | ADVANCED MICRO DEVICES INC | , | Transferred | EAR99 | 8542.32.00.51 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX27C2000TI-90 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP32,.8,20 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 256KX8 | 3-STATE | 1.2 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | 18.4 mm | 8 mm | ||||||||||||||||||||||||
| Mfr Part No MX25R6435FM2JL0/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S25FL064P0XMFA001 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 104 MHz | 2016-08-18 | CYPRESS SEMICONDUCTOR CORP | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G16 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 8MX8 | 3-STATE | 2.65 mm | 8 | 67108864 bit | AEC-Q100 | SERIAL | FLASH | 3 V | QSPI | 10.3 mm | 7.5 mm | |||||||||||||||||||||||||||||
| Mfr Part No S25FL128POXMFI011 | Spansion | Datasheet | 1614 | - | Min: 1 Mult: 1 | YES | 16 | 104 MHz | SPANSION INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | Yes | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1.27 mm | compliant | 40 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.026 mA | 16MX8 | 8 | 0.00002 A | 134217728 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE |
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IS29GL128-70FLA3H
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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S99-50019
Spansion
Package:Memory - Modules
Price: please inquire
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AM29F004BB-70JF
Spansion
Package:Memory - Modules
Price: please inquire
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ES29LV800DT-70WGI
Excel (Suzhou) Semiconductor Co Ltd
Package:Memory - Modules
Price: please inquire
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MZVL2512HCJQ-00B00
Samsung Electronics Co. Ltd
Package:Memory - Modules
Price: please inquire
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APS25608N-OBR-BD
AP Memory
Package:Memory - Modules
3.144919
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MX25U8035ZUI-25G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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SST45LF010-10-4C-SAE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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K9F2816Q0C-HCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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SST37VF040-70-3C-PHE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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MX29F200TTC-70
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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WF2M32-90HM5
White Microelectronics
Package:Memory - Modules
Price: please inquire
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WF2M32-90HM5
Microsemi Corporation
Package:Memory - Modules
Price: please inquire
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M29W640GL90NB6E
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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SST37VF040-70-3C-PH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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S29GL064M11BFIR0
AMD
Package:Memory - Modules
Price: please inquire
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MX27C2000TI-90
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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MX25R6435FM2JL0/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S25FL064P0XMFA001
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S25FL128POXMFI011
Spansion
Package:Memory - Modules
Price: please inquire