The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory IC Type
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No EN29GL064H-70ZIP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 70 ns | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | 3 V | EAR99 | HIGHEST ADDRESS SECTOR PROTECTED | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | R-PDSO-G56 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 14 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No XC1765EPC2OC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | 250 ns | 10 MHz | ADVANCED MICRO DEVICES INC | 65536 words | 32000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Active | No | 5 V | QUAD | J BEND | 1 | 1.27 mm | compliant | S-PQCC-J20 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.01 mA | 32KX8 | 3-STATE | 8 | 0.00005 A | 262144 bit | PARALLEL | COMMON | OTP ROM | |||||||||||||||||||||||||||||||||||
| Mfr Part No F49B002UA-70N | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3.55 mm | 8 | 0.00005 A | 2097152 bit | PARALLEL | FLASH | 5 V | YES | YES | YES | 1,2,1,1 | 16K,8K,96K,128K | TOP | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||
| Mfr Part No MX29LW160BTI-70 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | MACRONIX INTERNATIONAL CO LTD | , | Obsolete | EAR99 | 8542.32.00.51 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS25LQ020B-JULA3-TR | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | 2018-06-22 | INTEGRATED SILICON SOLUTION INC | 262144 words | 256000 | 125 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | R-PDSO-N8 | 3.6 V | AUTOMOTIVE | 2.3 V | SYNCHRONOUS | 256KX8 | 0.6 mm | 8 | 2097152 bit | AEC-Q100 | SERIAL | FLASH | 3 V | QSPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3 mm | 2 mm | |||||||||||||||||||||||||
| Mfr Part No SN74S188N | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 65 ns | TEXAS INSTRUMENTS INC | 32 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 3.3 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | not_compliant | NOT SPECIFIED | R-PDIP-T16 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 32KX8 | 8 | 262144 bit | PARALLEL | OTP ROM | |||||||||||||||||||||||||||||||||||
| Mfr Part No NAND02GW3B2DZA6F | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 20 ns | STMICROELECTRONICS | 268435456 words | 256000000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA63,10X12,32 | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Transferred | Yes | EAR99 | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B63 | Not Qualified | INDUSTRIAL | 0.03 mA | 256MX8 | 8 | 0.00005 A | 2147483648 bit | PARALLEL | FLASH | NO | NO | YES | 2K | 128K | 2K words | YES | ||||||||||||||||||||||||||||||||
| Mfr Part No SST39VF400A-90-4C-BK | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SILICON STORAGE TECHNOLOGY INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA48,6X8,32 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B48 | Not Qualified | COMMERCIAL | 0.03 mA | 256KX16 | 16 | 0.00002 A | 4194304 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 2K | YES | |||||||||||||||||||||||||||||||
| Mfr Part No SST25VF512-20-4C-S | Microchip Technology Inc | Datasheet | 960 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX29F002BQC-55 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | MACRONIX INTERNATIONAL CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.05 mA | 256KX8 | 3.55 mm | 8 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | BOTTOM | 14.05 mm | 11.43 mm | |||||||||||||||||||
| Mfr Part No SNV2S/2000G | Kingston Technology Company | Datasheet | 2355 |
| Min: 1 Mult: 1 | 4 Weeks, 2 Days | NO | KINGSTON TECHNOLOGY COMPANY INC | 2199023255552 words | 2000000000000 | 70 °C | UNSPECIFIED | SMA | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Active | NOR TYPE | SINGLE | NO LEAD | 1 | unknown | R-XSMA-N | 2TX8 | 8 | 17592186044416 bit | FLASH MODULE | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TC54H1024AP-85 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 85 ns | TOSHIBA CORP | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Active | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-PDIP-T40 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 64KX16 | 4.8 mm | 16 | 1048576 bit | PARALLEL | OTP ROM | 50.7 mm | 15.24 mm | ||||||||||||||||||||||||||||||
| Mfr Part No PM25LQ080-BCE | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | INTEGRATED SILICON SOLUTION INC | 1 | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | SQUARE | SMALL OUTLINE | Active | Yes | 3 V | e3 | EAR99 | NOR TYPE | Matte Tin (Sn) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 10 | S-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.3 V | SYNCHRONOUS | 1MX8 | 2.16 mm | 8 | 8388608 bit | SERIAL | FLASH | 3 V | 5.28 mm | 5.28 mm | ||||||||||||||||||||||||||||
| Mfr Part No S29AL004D70BAI022 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | FBGA-48 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | R-PBGA-B48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 256KX16 | 1 mm | 16 | 4194304 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 8.15 mm | 6.15 mm | ||||||||||||||||||||||||||
| Mfr Part No S29AL004D70BAI022 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B48 | Not Qualified | INDUSTRIAL | 0.035 mA | 256KX16 | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | ||||||||||||||||||||||||||||
 | Mfr Part No S29AL004D70BAI022 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SPANSION INC | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8.15 X 6.15 MM, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 256KX16 | 1 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | 8.15 mm | 6.15 mm | ||||||||||||
| Mfr Part No SDINBDG4-8G-XAT | Western Digital Corp | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX26LV800BXBC-55 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA48,6X8,32 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 512KX16 | 1.2 mm | 16 | 0.0001 A | 8388608 bit | PARALLEL | FLASH | 3 V | 2000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | BOTTOM | 8 mm | 6 mm | |||||||||||||||||
| Mfr Part No S29GL064M90BAIR00 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 90 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 12 X 11 MM, FBGA-63 | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | not_compliant | 63 | R-PBGA-B63 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 8MX8 | 1.2 mm | 8 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 64K | 8 words | YES | BOTTOM/TOP | YES | 12 mm | 11 mm | ||||||||||||||
| Mfr Part No IS29GL128-70SLA3H | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 70 ns | INTEGRATED SILICON SOLUTION INC | 134217728 words | 128000000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | Yes | 3 V | e3 | EAR99 | TIN | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | R-PDSO-G56 | 3.6 V | AUTOMOTIVE | 2.7 V | ASYNCHRONOUS | 128MX1 | 1.2 mm | 1 | 134217728 bit | AEC-Q100 | PARALLEL | FLASH | 3 V | 18.4 mm | 14 mm |
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EN29GL064H-70ZIP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
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XC1765EPC2OC
AMD
Package:Memory - Modules
Price: please inquire
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F49B002UA-70N
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
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MX29LW160BTI-70
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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IS25LQ020B-JULA3-TR
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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SN74S188N
Texas Instruments
Package:Memory - Modules
Price: please inquire
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NAND02GW3B2DZA6F
STMicroelectronics
Package:Memory - Modules
Price: please inquire
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SST39VF400A-90-4C-BK
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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SST25VF512-20-4C-S
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
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MX29F002BQC-55
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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SNV2S/2000G
Kingston Technology Company
Package:Memory - Modules
315.048649
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TC54H1024AP-85
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
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PM25LQ080-BCE
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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S29AL004D70BAI022
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29AL004D70BAI022
AMD
Package:Memory - Modules
Price: please inquire
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S29AL004D70BAI022
Spansion
Package:Memory - Modules
Price: please inquire
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SDINBDG4-8G-XAT
Western Digital Corp
Package:Memory - Modules
Price: please inquire
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MX26LV800BXBC-55
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL064M90BAIR00
Spansion
Package:Memory - Modules
Price: please inquire
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IS29GL128-70SLA3H
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire