The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No M29DW323DT70ZE6T | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | STMICROELECTRONICS | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 2MX16 | 1.2 mm | 16 | 0.0001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | TOP | YES | 8 mm | 6 mm | |||||||||||||||
| Mfr Part No M29DW323DT70ZE6T | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | MICRON TECHNOLOGY INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | No | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 2MX16 | 1.2 mm | 16 | 0.0001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | TOP | YES | 8 mm | 6 mm | ||||||||||||||||||||
| Mfr Part No N82HS321A | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 35 ns | NXP SEMICONDUCTORS | 4096 words | 4000 | PLASTIC/EPOXY | QCCN | QCCN, | UNSPECIFIED | CHIP CARRIER | Obsolete | 5 V | EAR99 | 8542.32.00.71 | QUAD | NO LEAD | 1 | unknown | X-PQCC-N28 | Not Qualified | 5.25 V | 4.75 V | ASYNCHRONOUS | 4KX8 | 8 | 32768 bit | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No H9HCNNNBKMMLHR-NME | SK HYNIX | Datasheet | 1801 | - | Min: 1 Mult: 1 | Bag-packed | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K4U8E3S4AD-GFCL | Samsung | Datasheet | 6400 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M386AAG40AM3-CWE | Samsung | Datasheet | - | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BL24C512A-NTRC | BL(Shanghai Belling) | Datasheet | 3009 | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K4A8G165WC-BCPB | Samsung | Datasheet | 15 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M10TFIR20 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | ||||||||||||||||||||||||||||||
| Mfr Part No W25Q80DVDAIG | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 104 MHz | WINBOND ELECTRONICS CORP | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | NOT SPECIFIED | R-PDIP-T8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 1MX8 | 3-STATE | 5.33 mm | 8 | 0.000005 A | 8388608 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 9.27 mm | 7.62 mm | ||||||||||||||||||||||
| Mfr Part No GD25Q16BPIG | ELM Technology Corp | Datasheet | - | - | Min: 1 Mult: 1 | ELM TECHNOLOGY CORP | , | Contact Manufacturer | EAR99 | 8542.32.00.51 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX27C4000QC-10 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 100 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 70 °C | -10 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 512KX8 | 3-STATE | 3.55 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 14.05 mm | 11.43 mm | |||||||||||||||||||||||||
| Mfr Part No S29GL032M10TAIR2 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | ADVANCED MICRO DEVICES INC | Obsolete | EAR99 | 8542.32.00.51 | unknown | FLASH | 3 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL032M10TAIR2 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 0.5 mm | not_compliant | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 2MX16 | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 64 | 64K | 4/8 words | YES | YES | |||||||||||||||||||||||||
 | Mfr Part No MBM29LV160B-12PBT | FUJITSU Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 120 ns | FUJITSU LTD | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | PLASTIC, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | No | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | SECTOR ERASE; 100000 PROGRAM/ERASE CYCLES; BOTTOM BOOT; CAN BE ORGANIZED AS 1M X 16 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 1MX16 | 1.2 mm | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | YES | BOTTOM | YES | 9 mm | 8 mm | |||||||||||||||
| Mfr Part No AT24C512AN | HGSEMI | Datasheet | - | - | Min: 1 Mult: 1 | Tube-packed | true | 512Kbit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KH25U25639FZ4I-10G | MXIC(Macronix) | Datasheet | 16740 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS25WP128F-JMLE | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 166 MHz | INTEGRATED SILICON SOLUTION INC | 16777216 words | 16000000 | 105 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | Yes | 1.8 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | R-PDSO-G16 | 1.95 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | 0.03 mA | 16MX8 | 3-STATE | 2.65 mm | 8 | 0.00001 A | 134217728 bit | SERIAL | FLASH | 1.8 V | QSPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 10.31 mm | 7.49 mm | |||||||||||||||||||||||
| Mfr Part No MX29F002NBQC-70 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | MACRONIX INTERNATIONAL CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 256KX8 | 3.55 mm | 8 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | BOTTOM | 14.05 mm | 11.43 mm | |||||||||||||||||||
 | Mfr Part No S29GL064M90FAIR40 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FORTIFIED, BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.4 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | 13 mm | 11 mm |
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M29DW323DT70ZE6T
STMicroelectronics
Package:Memory - Modules
Price: please inquire
-
M29DW323DT70ZE6T
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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N82HS321A
NXP Semiconductors
Package:Memory - Modules
Price: please inquire
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H9HCNNNBKMMLHR-NME
SK HYNIX
Package:Memory - Modules
Price: please inquire
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K4U8E3S4AD-GFCL
Samsung
Package:Memory - Modules
24.923980
-
M386AAG40AM3-CWE
Samsung
Package:Memory - Modules
Price: please inquire
-
BL24C512A-NTRC
BL(Shanghai Belling)
Package:Memory - Modules
Price: please inquire
-
K4A8G165WC-BCPB
Samsung
Package:Memory - Modules
5.801827
-
S29GL064M10TFIR20
AMD
Package:Memory - Modules
Price: please inquire
-
W25Q80DVDAIG
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
-
GD25Q16BPIG
ELM Technology Corp
Package:Memory - Modules
Price: please inquire
-
MX27C4000QC-10
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL032M10TAIR2
AMD
Package:Memory - Modules
Price: please inquire
-
S29GL032M10TAIR2
Spansion
Package:Memory - Modules
Price: please inquire
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MBM29LV160B-12PBT
FUJITSU Limited
Package:Memory - Modules
Price: please inquire
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AT24C512AN
HGSEMI
Package:Memory - Modules
Price: please inquire
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KH25U25639FZ4I-10G
MXIC(Macronix)
Package:Memory - Modules
6.309815
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IS25WP128F-JMLE
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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MX29F002NBQC-70
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL064M90FAIR40
Spansion
Package:Memory - Modules
Price: please inquire