The category is 'Embedded - Microcontrollers - Application Specific'
- All Manufacturers
- Applications
- Interface
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Core Processor
- RoHS Status
- Factory Lead Time
- Program Memory Type
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Number of Bits | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | External Data Bus Width | Output Clock Frequency-Max | Bus Compatibility | Time-Min | Interrupt Capability | Volatile | Information Access Method | Display Configuration | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No THGBM5G5A1JBAIRYMJ | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MK1418STR | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | INTEGRATED CIRCUIT SYSTEMS INC | 70 °C | PLASTIC/EPOXY | LSOP | LSOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | Transferred | SOIC | No | 5.5 V | 4.5 V | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.5494 mm | 14.318 MHz | 24.576 MHz | 4.8895 mm | 3.937 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU6CG-1FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | ||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-1FBVB900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA900,30X30,40 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No SYM53C180 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 192 | BROADCOM LTD | PLASTIC/EPOXY | BGA | UNSPECIFIED | BALL | Obsolete | EAR99 | 8542.39.00.01 | QUAD | BUTT | compliant | X-PBGA-B192 | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TMPZ84C20AM-8 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 8 MHz | TOSHIBA CORP | 16 | 70 °C | -10 °C | PLASTIC/EPOXY | SSOP | 0.450 INCH, PLASTIC, SSOP-40 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | SSOP | 5.25 V | 4.75 V | 5 V | EAR99 | 8542.39.00.01 | DUAL | GULL WING | 0.8 mm | unknown | 40 | R-PDSO-G40 | Not Qualified | COMMERCIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 10 mA | 2.8 mm | 8 | 17.5 mm | 8.8 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-1LFFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No IMISC471AYBD | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PCF2116CU/10 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | 0.225 MHz | NXP SEMICONDUCTORS | 85 °C | -40 °C | UNSPECIFIED | DIE | DIE, | UNSPECIFIED | UNCASED CHIP | Obsolete | WAFER | 6 V | 2.5 V | 5 V | 8542.31.00.01 | UPPER | NO LEAD | unknown | X-XUUC-N | Not Qualified | INDUSTRIAL | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | 1.1 mA | 1 | 8 | I2C | 32 X 60 DOTS | |||||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-1SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-1SFVC784I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||||||||||||||||||||||
![]() | Mfr Part No ML60851DTBZ03A | OKI Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-L1SFVC784I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.742 V | 0.698 V | 0.72 V | TIN SILVER COPPER | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-L1SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.742 V | 0.698 V | 0.72 V | e1 | TIN SILVER COPPER | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||
![]() | Mfr Part No S-3511AEFS | ABLIC Inc. | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.032 MHz | SEIKO INSTRUMENTS USA INC | 70 °C | -20 °C | PLASTIC/EPOXY | SOP | SOP, SSOP8,.25 | SSOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5.5 V | 1.7 V | 3 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | TIMER, REAL TIME CLOCK | 1.3 mm | SECONDS | Y | YES | SERIAL, 3-WIRE | 4.4 mm | 3.1 mm | ||||||||||||||||
![]() | Mfr Part No HCMP1852P | Hughes Microelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | HUGHES MICROELECTRONICS | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 10.5 V | 4 V | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | INDUSTRIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 8 | 5.72 mm | 8 | 32.258 mm | 15.24 mm | |||||||||||||||||||
![]() | Mfr Part No TLC34058-110FN | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 110 MHz | TEXAS INSTRUMENTS INC | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.25 V | 4.75 V | 5 V | No | 3A001.A.3 | 8542.31.00.01 | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | not_compliant | NOT SPECIFIED | 84 | S-PQCC-J84 | Not Qualified | COMMERCIAL | DISPLAY CONTROLLER, PALETTE DAC | 4.57 mm | 2 | 8 | 1280 X 1024 PIXELS | 29.3116 mm | 29.3116 mm | ||||||||||||||||||
![]() | Mfr Part No PCF2127T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 0.032 MHz | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Active | 4.2 V | 1.8 V | 3.3 V | EAR99 | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G16 | INDUSTRIAL | TIMER, REAL TIME CLOCK | 2.65 mm | SERIAL(I2C), SERIAL(SPI) | 10.3 mm | 7.5 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No S-3510ACFJ | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.032 MHz | SEIKO EPSON CORP | 70 °C | -20 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | Obsolete | 5.5 V | 1.7 V | 3 V | EAR99 | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G8 | Not Qualified | COMMERCIAL | TIMER, REAL TIME CLOCK | 1.75 mm | SERIAL, 3-WIRE | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No PSD312-20L | Waferscale Integration Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | WAFERSCALE INTEGRATION INC | 19 | 70 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | QUAD | J BEND | 1.27 mm | unknown | S-CQCC-J44 | Not Qualified | COMMERCIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 95 mA | 4.57 mm | 16 | 16.485 mm | 16.485 mm |
THGBM5G5A1JBAIRYMJ
Toshiba America Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MK1418STR
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-1FBVB900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-1FBVB900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SYM53C180
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TMPZ84C20AM-8
Toshiba America Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-1LFFVC900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
IMISC471AYBD
Cypress Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCF2116CU/10
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-1SFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-1SFVC784I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ML60851DTBZ03A
OKI Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-L1SFVC784I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-L1SFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
S-3511AEFS
ABLIC Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
HCMP1852P
Hughes Microelectronics
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TLC34058-110FN
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCF2127T
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
S-3510ACFJ
Seiko Epson Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PSD312-20L
Waferscale Integration Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
