The category is 'Embedded - Microcontrollers - Application Specific'

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  • Core Processor
  • RoHS Status
  • Factory Lead Time
  • Program Memory Type

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Surface Mount

Number of Terminals

Clock Frequency-Max

Ihs Manufacturer

Moisture Sensitivity Levels

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

JESD-609 Code

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Temperature Grade

uPs/uCs/Peripheral ICs Type

Supply Current-Max

Seated Height-Max

Address Bus Width

Primary Clock/Crystal Frequency-Nom

Boundary Scan

Low Power Mode

External Data Bus Width

Output Clock Frequency-Max

Number of Serial I/Os

Bus Compatibility

Data Transfer Rate-Max

Communication Protocol

Data Encoding/Decoding Method

Display Configuration

Length

Width

SED1522DOA

Mfr Part No

SED1522DOA

Epson Electronics America Inc Datasheet

-

-

Min: 1

Mult: 1

YES

100

0.021 MHz

S-MOS SYSTEMS

75 °C

-20 °C

UNSPECIFIED

DIE

DIE,

UNSPECIFIED

UNCASED CHIP

Obsolete

DIE

5.5 V

4.5 V

5 V

8542.31.00.01

UPPER

NO LEAD

unknown

100

X-XUUC-N100

Not Qualified

COMMERCIAL EXTENDED

DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER

1

8

80 FAMILY; 68 FAMILY

8 X 69 DOTS

LM8333

Mfr Part No

LM8333

National Semiconductor Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

49

NATIONAL SEMICONDUCTOR CORP

1

85 °C

-40 °C

UNSPECIFIED

TFBGA

TFBGA,

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Transferred

Yes

2.75 V

2.25 V

e1

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.5 mm

compliant

40

S-XBGA-B49

Not Qualified

INDUSTRIAL

MICROPROCESSOR CIRCUIT

1.1 mm

4 mm

4 mm

TDA8005AH/C129

Mfr Part No

TDA8005AH/C129

Philips Semiconductors Datasheet

-

-

Min: 1

Mult: 1

XCZU6CG-2SBVA484E

Mfr Part No

XCZU6CG-2SBVA484E

AMD Datasheet

-

-

Min: 1

Mult: 1

YES

484

ADVANCED MICRO DEVICES INC

4

100 °C

PLASTIC/EPOXY

FBGA

BGA-484

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Active

Yes

0.876 V

0.825 V

0.85 V

e1

TIN SILVER COPPER

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B484

OTHER

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

TA100T-Y240C2X01-00T-V43

Mfr Part No

TA100T-Y240C2X01-00T-V43

Microchip Technology Inc Datasheet

-

-

Min: 1

Mult: 1

XCZU7EG-2LFBVB900E

Mfr Part No

XCZU7EG-2LFBVB900E

AMD Datasheet

-

-

Min: 1

Mult: 1

YES

900

ADVANCED MICRO DEVICES INC

4

110 °C

PLASTIC/EPOXY

BGA

FCBGA-900

BGA900,30X30,40

SQUARE

GRID ARRAY

Active

Yes

0.85 V

e1

TIN SILVER COPPER

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B900

OTHER

PROGRAMMABLE SoC

2.88 mm

CAN, I2C, SPI, UART

31 mm

31 mm

PCM16C010VJG

Mfr Part No

PCM16C010VJG

National Semiconductor Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

100

NATIONAL SEMICONDUCTOR CORP

70 °C

PLASTIC/EPOXY

LFQFP

LFQFP, QFP100,.63SQ,20

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

No

5.25 V

4.75 V

5 V

e0

TIN LEAD

8542.31.00.01

QUAD

GULL WING

0.5 mm

unknown

S-PQFP-G100

Not Qualified

COMMERCIAL

MICROPROCESSOR CIRCUIT

6.5 mA

1.6 mm

14 mm

14 mm

NRF9161-LACA-R

Mfr Part No

NRF9161-LACA-R

Nordic Semiconductor Datasheet

-

-

Min: 1

Mult: 1

M-L-ET1310I-DT

Mfr Part No

M-L-ET1310I-DT

Broadcom Limited Datasheet

-

-

Min: 1

Mult: 1

BROADCOM LTD

,

Active

8542.31.00.01

compliant

XCZU9CG-L1SBVA484I

Mfr Part No

XCZU9CG-L1SBVA484I

AMD Datasheet

-

-

Min: 1

Mult: 1

YES

484

ADVANCED MICRO DEVICES INC

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA-484

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Active

Yes

0.742 V

0.698 V

0.72 V

e1

TIN SILVER COPPER

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

XCZU9CG-L1SBVA484I

Mfr Part No

XCZU9CG-L1SBVA484I

AMD Xilinx Datasheet

-

-

Min: 1

Mult: 1

YES

484

XILINX INC

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA484,22X22,32

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Transferred

Yes

0.742 V

0.698 V

0.72 V

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

IM6102IJL

Mfr Part No

IM6102IJL

General Electric Solid State Datasheet

-

-

Min: 1

Mult: 1

NO

40

GENERAL ELECTRIC SOLID STATE

85 °C

-40 °C

CERAMIC

DIP

DIP, DIP40,.6

DIP40,.6

RECTANGULAR

IN-LINE

Obsolete

No

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T40

Not Qualified

INDUSTRIAL

KS152JB3

Mfr Part No

KS152JB3

K-micro Datasheet

-

-

Min: 1

Mult: 1

KAWASAKI MICROELECTRONICS INC

,

Obsolete

8542.31.00.01

unknown

KS152JB3

Mfr Part No

KS152JB3

MegaChips Technology America Corporation Datasheet

-

-

Min: 1

Mult: 1

MEGACHIPS CORP

,

Obsolete

8542.31.00.01

unknown

XCZU6EG-2LFFVC900E

Mfr Part No

XCZU6EG-2LFFVC900E

AMD Datasheet

-

-

Min: 1

Mult: 1

YES

900

ADVANCED MICRO DEVICES INC

4

110 °C

PLASTIC/EPOXY

BGA

FCBGA-900

BGA900,30X30,40

SQUARE

GRID ARRAY

Active

Yes

0.85 V

e1

TIN SILVER COPPER

BOTTOM

BALL

1 mm

compliant

S-PBGA-B900

OTHER

PROGRAMMABLE SoC

3.42 mm

CAN, I2C, SPI, UART

31 mm

31 mm

PI7C8150MA-33

Mfr Part No

PI7C8150MA-33

Pericom Semiconductor Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

208

33 MHz

PERICOM SEMICONDUCTOR CORP

3

85 °C

PLASTIC/EPOXY

QFP

QFP,

SQUARE

FLATPACK

Obsolete

QFP

No

3.6 V

3 V

3.3 V

e0

EAR99

TIN LEAD

8542.31.00.01

QUAD

GULL WING

1 mm

compliant

208

S-PQFP-G208

Not Qualified

OTHER

BUS CONTROLLER, PCI

1.76 mm

32

32

17 mm

17 mm

ICS90C64N

Mfr Part No

ICS90C64N

Integrated Device Technology Inc Datasheet

-

-

Min: 1

Mult: 1

NO

20

INTEGRATED CIRCUIT SYSTEMS INC

70 °C

PLASTIC/EPOXY

DIP

DIP, DIP20,.3

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

No

5.5 V

4.5 V

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T20

Not Qualified

COMMERCIAL

CLOCK GENERATOR, VIDEO

30 mA

14.318 MHz

75 MHz

ADM6995L

Mfr Part No

ADM6995L

Intel Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

128

25 MHz

INTEL CORP

PLASTIC/EPOXY

FQFP

PLASTIC, QFP-128

RECTANGULAR

FLATPACK, FINE PITCH

Contact Manufacturer

1.9 V

1.7 V

1.8 V

ALSO REQUIRES 3.3V SUPPLY

8542.31.00.01

QUAD

GULL WING

0.5 mm

compliant

R-PQFP-G128

Not Qualified

SERIAL IO/COMMUNICATION CONTROLLER, LAN

3.4 mm

NO

NO

5

12.5 MBps

SYNC, BYTE; ETHERNET

NRZ; NRZI; BIPH-LEVEL (MANCHESTER)

20 mm

14 mm

ADM6995L

Mfr Part No

ADM6995L

Infineon Technologies AG Datasheet

-

-

Min: 1

Mult: 1

YES

128

25 MHz

INFINEON TECHNOLOGIES AG

PLASTIC/EPOXY

FQFP

PLASTIC, QFP-128

RECTANGULAR

FLATPACK, FINE PITCH

Transferred

QFP

1.9 V

1.7 V

1.8 V

ALSO REQUIRES 3.3V SUPPLY

8542.31.00.01

QUAD

GULL WING

0.5 mm

compliant

128

R-PQFP-G128

Not Qualified

SERIAL IO/COMMUNICATION CONTROLLER, LAN

3.4 mm

NO

NO

5

12.5 MBps

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

20 mm

14 mm

TMPZ84C40AP

Mfr Part No

TMPZ84C40AP

Toshiba America Electronic Components Datasheet

-

-

Min: 1

Mult: 1

NO

40

TOSHIBA CORP

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP, DIP40,.6

DIP40,.6

RECTANGULAR

IN-LINE

Active

No

5 V

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T40

Not Qualified

INDUSTRIAL