The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | External Data Bus Width | Output Clock Frequency-Max | Bus Compatibility | Length | Width |
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![]() | Mfr Part No P1817BF-08ST | Pulsecore Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | PULSECORE SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | SOP | SOIC-8 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | 5.5 V | 2.7 V | 3.3 V | DUAL | GULL WING | NOT SPECIFIED | 1.27 mm | unknown | NOT SPECIFIED | R-PDSO-G8 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, VIDEO | 1.8 mm | 20 MHz | 20 MHz | 4.92 mm | 3.95 mm | ||||||||||||||||||
![]() | Mfr Part No ISP1583ET2 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 12 MHz | NXP SEMICONDUCTORS | SOT543-1 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY | Transferred | BGA | 3.6 V | 3 V | 3.3 V | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | unknown | 64 | S-PBGA-B64 | Not Qualified | INDUSTRIAL | BUS CONTROLLER, UNIVERSAL SERIAL BUS | 1.5 mm | 8 | 16 | 6 mm | 6 mm | |||||||||||||||
![]() | Mfr Part No ISP1583ET2 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | STMICROELECTRONICS | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA64,10X10,20 | BGA64,10X10,20 | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | Yes | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | compliant | S-PBGA-B64 | Not Qualified | INDUSTRIAL | 60 mA | |||||||||||||||||||||||||
![]() | Mfr Part No R65/41EB | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | CONEXANT SYSTEMS | 70 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | COMMERCIAL | |||||||||||||||||||||||||
![]() | Mfr Part No XCZU11EG-3FFVC1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1156 | SQUARE | GRID ARRAY | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 35 mm | 35 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU11EG-3FFVC1156I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 35 mm | 35 mm | |||||||||||||||||||
![]() | Mfr Part No PL-25A1 | Prolific Technology | Datasheet | - | - | Min: 1 Mult: 1 | PROLIFIC TECHNOLOGY INC | , | Contact Manufacturer | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ICS9150F-02 | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 1997-09-18 | INTEGRATED DEVICE TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | SSOP | SSOP-56 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | SSOP | No | 3.7 V | 3 V | 3.3 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 0.635 mm | compliant | 56 | R-PDSO-G56 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.794 mm | 14.318 MHz | 66.6 MHz | 18.415 mm | 7.5 mm | ||||||||||||
![]() | Mfr Part No PLL702-01XC | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | MICROCHIP TECHNOLOGY INC | 70 °C | PLASTIC | SSOP | SSOP-28 | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Active | 3.63 V | 2.25 V | 3.3 V | EAR99 | 8542.39.00.01 | DUAL | GULL WING | 0.65 mm | compliant | R-PDSO-G28 | COMMERCIAL | CLOCK GENERATOR, OTHER | 2 mm | 14.318 MHz | 133 MHz | 10.2 mm | 5.3 mm | |||||||||||||||||||
![]() | Mfr Part No PT7C4512W | Pericom Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | PERICOM SEMICONDUCTOR CORP | , | Transferred | SOIC | EAR99 | 8542.39.00.01 | unknown | 8 | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU3EG-2LSFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||||||||||||||||
![]() | Mfr Part No ICS8MH0-150.000AJT | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | INTEGRATED DEVICE TECHNOLOGY INC | Obsolete | No | EAR99 | 8542.39.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC9855VF | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | INTEGRATED DEVICE TECHNOLOGY INC | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | MAPBGA-100 | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.465 V | 3.135 V | 3.3 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 1 mm | not_compliant | 100 | S-PBGA-B100 | Not Qualified | INDUSTRIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 200 mA | 1.7 mm | 250 MHz | 200 MHz | 11 mm | 11 mm | ||||||||||
![]() | Mfr Part No MPC9855VF | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | FREESCALE SEMICONDUCTOR INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 11 X 11 MM, 1 MM PITCH, MAPBGA-100 | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | Transferred | BGA | No | 3.465 V | 3.135 V | 3.3 V | e0 | EAR99 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 30 | 100 | S-PBGA-B100 | Not Qualified | INDUSTRIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 200 mA | 1.7 mm | 250 MHz | 200 MHz | 11 mm | 11 mm | ||||||||
![]() | Mfr Part No XCZU19EG-3FFVD1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1760 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1760 | SQUARE | GRID ARRAY | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1760 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | 42.5 mm | 42.5 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU19EG-3FFVD1760I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1760 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | 42.5 mm | 42.5 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU6EG-2LFFVB1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1156 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||||||||||||||||||||
![]() | Mfr Part No XQ7Z030-1RF900Q | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | 125 °C | -40 °C | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | No | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | S-PBGA-B900 | Not Qualified | AUTOMOTIVE | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | ||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-2LFFVC900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||
![]() | Mfr Part No MD2202-D32-V3-X-P | SanDisk Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | SANDISK CORP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 3.6 V | 3 V | 3.3 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | unknown | NOT SPECIFIED | 32 | R-PDIP-T32 | Not Qualified | INDUSTRIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 8 |
P1817BF-08ST
Pulsecore Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ISP1583ET2
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ISP1583ET2
STMicroelectronics
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
R65/41EB
Conexant Systems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU11EG-3FFVC1156I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU11EG-3FFVC1156I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PL-25A1
Prolific Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ICS9150F-02
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PLL702-01XC
Microchip Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PT7C4512W
Pericom Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU3EG-2LSFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ICS8MH0-150.000AJT
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MPC9855VF
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MPC9855VF
Freescale Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU19EG-3FFVD1760I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU19EG-3FFVD1760I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6EG-2LFFVB1156E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XQ7Z030-1RF900Q
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-2LFFVC900E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MD2202-D32-V3-X-P
SanDisk Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
