The category is 'Memory'
Memory (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Brand | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Data Rate | Memory Interface | Architecture | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Product Category | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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![]() | Mfr Part No GS81302T07GE-350I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-165 | GSI Technology | DDR | 10 | Parallel | GSI Technology | 350 MHz | 350 MHz | 1.9 V | + 85 C | DDR-II | 1.7 V | - 40 C | Yes | Surface Mount | SMD/SMT | 8 Bit | 16 MWords | Details | FBGA | 1.9 V | 1.7 V | Synchronous | SigmaDDR-II+ | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS81302T07GE | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 810 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS882Z36CGD-250I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-165 | GSI Technology | 72 | Parallel | GSI Technology | 250 MHz | + 85 C | SDR | - 40 C | Yes | SMD/SMT | Details | 3.6 V | 2.3 V | NBT SRAM | Tray | GS882Z36CGD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 175 mA, 215 mA | 5.5 ns | 256 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS81302DT38E-500I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | QDR | 10 | GSI TECHNOLOGY | Parallel | GSI Technology | GS81302DT38E-500I | 500 MHz | 500 MHz | + 85 C | QDR-II | - 40 C | Yes | Surface Mount | SMD/SMT | 36 Bit | 4 MWords | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Not Recommended | BGA | NOT SPECIFIED | 5.06 | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS81302DT38E | No | 3A991.B.2.B | SigmaQuad-II+ | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | INDUSTRIAL | 1.7 V | 144 Mbit | 2 | SYNCHRONOUS | 1.67 A | Pipelined | 4 M x 36 | 1.5 mm | 36 | 20 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | QDR SRAM | SRAM | 17 mm | 15 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS74116AX-10E | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-48 | GSI Technology | 135 | Parallel | GSI Technology | SMD/SMT | N | 3.6 V | 3 V | GS74116AX | Asynchronous | Memory & Data Storage | 4 Mbit | 105 mA | 10 ns | 256 k x 16 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS88018CGT-250I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | GSI Technology | SDR | 72 | Parallel | GSI Technology | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 18 Bit | 512 kWords | Details | TQFP | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS88018CGT | Pipeline/Flow Through | Memory & Data Storage | 100 | 9 Mbit | 2 | 165 mA, 200 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 18 | 19 Bit | SRAM | 9 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS81302T37E-350I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-165 | GSI Technology | DDR | 10 | Parallel | GSI Technology | 350 MHz | 350 MHz | 1.9 V | + 85 C | DDR-II | 1.7 V | - 40 C | Yes | Surface Mount | SMD/SMT | 36 Bit | 4 MWords | FBGA | 1.9 V | 1.7 V | Synchronous | SigmaDDR-II+ | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS81302T37E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 905 mA | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8673ED18BGK-625I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | BGA-260 | YES | 260 | GSI Technology | QDR | 8 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8673ED18BGK-625I | 625 MHz | 625/400 MHz | 1.4 V | + 100 C | DDR | 1.3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 18 Bit | 4 MWords | 4000000 | PLASTIC/EPOXY | HBGA | HBGA, | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Active | NOT SPECIFIED | 5.73 | Details | Yes | BGA | 1.4 V | 1.3 V | 1.35 V | Synchronous | SigmaQuad-IIIe | 1.3500 V | Industrial grade | -40 to 85 °C | Tray | GS8673ED18BGK | 3A991.B.2.B | SigmaQuad-IIIe B4 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 260 | R-PBGA-B260 | 1.4 V | 1.3 V | 72 Mbit | SYNCHRONOUS | 2.11 A | 1.25 Gb/s | Pipelined | 4 M x 18 | 2.3 mm | 18 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8642Z72C-250M | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 14 | Parallel | GSI Technology | 250 MHz | 153.8@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | + 125 C | 2.3, 3 V | - 55 C | Surface Mount | SMD/SMT | 72 Bit | 1 MWords | FBGA | 3.6 V | 2.3 V | Synchronous | NBT SRAM | 2.5, 3.3 V | Military grade | -55 to 125 °C | GS8642Z72C | NBT Pipeline/Flow Through | Memory & Data Storage | 209 | 72 Mbit | 8 | 500 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 72 | 20 Bit | SRAM | 72 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS71108AGU-10 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | YES | 48 | 10 ns | GSI TECHNOLOGY | GSI Technology | GS71108AGU-10 | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | BGA | NOT SPECIFIED | 5.21 | Yes | 3.3 V | e1 | Yes | 3A991.B.2.B | TIN SILVER COPPER | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 128KX8 | 1.2 mm | 8 | 1048576 bit | PARALLEL | STANDARD SRAM | 8 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No W25Q20EWSNIG | Winbond Electronics | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tray | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | R-PDSO-G8 | Not Qualified | 1.95V | 1.8V | 1.65V | SPI, Serial | 2Mb 256K x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 2MX1 | 1 | 800μs | 0.0000075A | 2097152 bit | 1.8V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1.75mm | 4.85mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CAT25010YI-G | ON Semiconductor | Datasheet | 38 | - | Min: 1 Mult: 1 | 20 Weeks | Gold | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | Industrial grade | -40°C~85°C TA | Tube | 2008 | e4 | yes | Active | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 8 | 5V | SPI, Serial | 1Kb 128 x 8 | 2mA | 20MHz | 75 ns | EEPROM | SPI | 8 | 5ms | 1 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | No | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 93C76C-E/P | Microchip Technology | Datasheet | 768 |
| Min: 1 Mult: 1 | 7 Weeks | Tin | Through Hole | Through Hole | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2004 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 93C76C | 8 | 5V | 5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 16 | 2ms | 8 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | HARDWARE/SOFTWARE | 8 | 5.334mm | 9.27mm | 7.62mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No IS42S16800F-6TLI | ISSI, Integrated Silicon Solution Inc | Datasheet | 1200 | - | Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 54-TSOP (0.400, 10.16mm Width) | 54 | Volatile | Industrial grade | -40°C~85°C TA | Tray | Active | 3 (168 Hours) | 54 | EAR99 | AUTO/SELF REFRESH | 3V~3.6V | DUAL | 1 | 3.3V | 0.8mm | 54 | Not Qualified | 3.3V | 3.6V | 3V | 128Mb 8M x 16 | 1 | 120mA | SYNCHRONOUS | 166MHz | 5.4ns | DRAM | Parallel | 16b | 8MX16 | 3-STATE | 16 | 12b | 128 Mb | 0.002A | COMMON | 4096 | 1248FP | 1248 | 1.2mm | 22.22mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No S34ML02G100BHB000 | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | 63-VFBGA | YES | 63 | Non-Volatile | Automotive grade | -40°C~105°C TA | Tray | 2016 | ML-1 | Discontinued | 3 (168 Hours) | 63 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3.3V | 0.8mm | NOT SPECIFIED | 3.6V | 2.7V | 2Gb 256M x 8 | ASYNCHRONOUS | FLASH | Parallel | 256MX8 | 8 | 25ns | 2147483648 bit | AEC-Q100 | 3V | 1mm | 11mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8673ET18BGK-550 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | BGA-260 | YES | 260 | 0.4 ns | GSI Technology | DDR | 8 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8673ET18BGK-550 | 550 MHz | 550/375 MHz | 1.4 V | + 85 C | DDR-III | 1.25 V | 0 C | Yes | Surface Mount | SMD/SMT | 18 Bit | 4 MWords | 4000000 | 85 °C | PLASTIC/EPOXY | HBGA | HBGA, | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Active | NOT SPECIFIED | 5.72 | Details | Yes | BGA | 1.4 V | 1.25 V | 1.3 V | Synchronous | SigmaDDR-IIIe | 1.3500 V | Commercial grade | 0 to 70 °C | Tray | GS8673ET18BGK | 3A991.B.2.B | SigmaDDR-IIIe B2 | IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 260 | R-PBGA-B260 | 1.4 V | OTHER | 1.25 V | 72 Mbit | SYNCHRONOUS | 1.49 A | Pipelined | 4 M x 18 | 2.3 mm | 18 | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8182T19BD-300 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No S25FL128SAGMFIG10 | Cypress Semiconductor Corp | Datasheet | 69 |
| Min: 1 Mult: 1 | 13 Weeks | Tin | Surface Mount | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | FL-S | e3 | Active | 3 (168 Hours) | 16 | ALSO CONFIGURABLE AS 128M X 1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | Not Qualified | 3V | 3.6V | 2.7V | SPI, Serial | 128Mb 16M x 8 | 90mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8 | 1b | 128 Mb | 0.0001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | 2.65mm | 10.3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No CY7C15632KV18-450BZXI | Cypress Semiconductor Corp | Datasheet | 36 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | Surface Mount | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e1 | Active | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C15632 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 780mA | 450MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 20b | 72 Mb | 0.34A | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr Part No CY7C1668KV18-450BZXC | Cypress Semiconductor Corp | Datasheet | 1732 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | Surface Mount | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2014 | e1 | Active | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 40 | CY7C1668 | 165 | 1.8V | 144Mb 8M x 18 | 1 | 790mA | 450MHz | 450 ps | SRAM | Parallel | 18 | 22b | 144 Mb | Synchronous | 18b | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS81302TT19E-450 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-165 | GSI Technology | DDR | 10 | Parallel | GSI Technology | 450 MHz | 450 MHz | + 70 C | DDR-II | 0 C | Yes | Surface Mount | SMD/SMT | 18 Bit | 8 MWords | N | FBGA | 1.9 V | 1.7 V | Synchronous | SigmaDDR-II+ | 1.8000 V | Commercial grade | 0 to 85 °C | Tray | GS81302TT19E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 1 A | Pipelined | 8 M x 18 | SRAM | 144 Mbit | Commercial | SRAM |
GS81302T07GE-350I
GSI Technology
Package:Memory
Price: please inquire
GS882Z36CGD-250I
GSI Technology
Package:Memory
Price: please inquire
GS81302DT38E-500I
GSI Technology
Package:Memory
Price: please inquire
GS74116AX-10E
GSI Technology
Package:Memory
Price: please inquire
GS88018CGT-250I
GSI Technology
Package:Memory
Price: please inquire
GS81302T37E-350I
GSI Technology
Package:Memory
Price: please inquire
GS8673ED18BGK-625I
GSI Technology
Package:Memory
Price: please inquire
GS8642Z72C-250M
GSI Technology
Package:Memory
Price: please inquire
GS71108AGU-10
GSI Technology
Package:Memory
Price: please inquire
W25Q20EWSNIG
Winbond Electronics
Package:Memory
Price: please inquire
CAT25010YI-G
ON Semiconductor
Package:Memory
Price: please inquire
93C76C-E/P
Microchip Technology
Package:Memory
0.667361
IS42S16800F-6TLI
ISSI, Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
S34ML02G100BHB000
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
GS8673ET18BGK-550
GSI Technology
Package:Memory
Price: please inquire
GS8182T19BD-300
GSI Technology
Package:Memory
Price: please inquire
S25FL128SAGMFIG10
Cypress Semiconductor Corp
Package:Memory
0.215965
CY7C15632KV18-450BZXI
Cypress Semiconductor Corp
Package:Memory
36.667863
CY7C1668KV18-450BZXC
Cypress Semiconductor Corp
Package:Memory
323.380545
GS81302TT19E-450
GSI Technology
Package:Memory
Price: please inquire
