The category is 'Memory'
Memory (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Page Size | Refresh Cycles | I2C Control Byte | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No K4S281632I-UC75 | Samsung | Datasheet | 18 | - | Min: 1 Mult: 1 | YES | 54 | 5.4 ns | 133 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4S281632I-UC75 | 3 | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP54,.46,32 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | NOT SPECIFIED | 8.33 | Yes | 3.3 V | e6 | Yes | Tin/Bismuth (Sn97Bi3) | AUTO/SELF REFRESH | DRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.8 mm | compliant | R-PDSO-G54 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 1 | SYNCHRONOUS | 0.2 mA | 8MX16 | 3-STATE | 1.2 mm | 16 | 0.002 A | 134217728 bit | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S25FL256LAGBHV020 | Cypress Semiconductor Corp | Datasheet | 28 |
| Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 24-TBGA | YES | Non-Volatile | -40°C~105°C TA | Tray | 2016 | FL-L | Active | 3 (168 Hours) | 24 | IT ALSO HAVE MEMORY WIDTH X 1 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3V | 1mm | NOT SPECIFIED | R-PBGA-B24 | 3.6V | 2.7V | 256Mb 32M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI | 64MX4 | 4 | 268435456 bit | SERIAL | 3V | 2 | 1.2mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1368C-166AXC | Cypress Semiconductor Corp | Datasheet | 7 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2006 | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | PIPELINED ARCHITECTURE | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | unknown | 20 | CY7C1368 | 100 | Not Qualified | 3.3V | 3.6V | 3.135V | 8Mb 256K x 32 | 4 | 180mA | 166MHz | 3.5ns | SRAM | Parallel | 256KX32 | 3-STATE | 32 | 18b | 8 Mb | COMMON | Synchronous | 32b | 1.6mm | 20mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 25AA040AXT-I/ST | Microchip Technology | Datasheet | 38 |
| Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 25AA040A | 8 | 5V | SPI, Serial | 4Kb 512 x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 4 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR24T32FV-WE2 | ROHM Semiconductor | Datasheet | 72 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Tin | Surface Mount | Surface Mount | 8-LSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | Active | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 0.65mm | NOT SPECIFIED | BR24T32 | Not Qualified | 5.5V | 1.6V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.35mm | 4.4mm | 3mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT25XE011-XMHN-T | Adesto Technologies | Datasheet | 4 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TC | Cut Tape (CT) | 2013 | e4 | yes | Active | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.65V~3.6V | DUAL | NOT SPECIFIED | 1 | 1.8V | 0.65mm | NOT SPECIFIED | 3.6V | 1.65V | SPI, Serial | 1Mb 128K x 8 | SYNCHRONOUS | 104MHz | 8 ns | FLASH | SPI | 1MX1 | 1 | 12μs, 3ms | 8 Mb | 256B | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 25AA256T-E/MF | Microchip Technology | Datasheet | 4 |
| Min: 1 Mult: 1 | 5 Weeks | Surface Mount | Surface Mount | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2013 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA256 | 8 | Not Qualified | 5.5V | 2/5V | SPI, Serial | 256Kb 32K x 8 | 6mA | SYNCHRONOUS | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1mm | 5.99mm | 4.92mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S71WS256PC0HH3YR3 | Cypress Semiconductor Corp | Datasheet | 28 |
| Min: 1 Mult: 1 | 26 Weeks | Surface Mount | 84-TFBGA | YES | Non-Volatile | -25°C~85°C TA | Tape & Reel (TR) | WS-P | Active | 3 (168 Hours) | 84 | 3A991.B.1.A | 8542.32.00.71 | 1.7V~1.95V | BOTTOM | 1 | 1.8V | 0.8mm | R-PBGA-B84 | 1.8V | 1.95V | 1.7V | 256Mbit Flash 64Mbit RAM | 80MHz | FLASH, RAM | Parallel | 16MX16 | 16 | 268435456 bit | 80 ns | 1.2mm | 11.6mm | 8mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No RC28F128P33B85A | Micron Technology Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 64-TBGA | 64 | 64-EasyBGA (8x10) | Non-Volatile | -40°C~85°C TC | Tray | 2007 | StrataFlash™ | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.3V~3.6V | 28F128P33 | 2.3V | Parallel, Serial | 3.6V | 2.3V | 128Mb 8M x 16 | 28mA | 52MHz | 85ns | FLASH | Parallel | 85ns | 23b | 128 Mb | Asynchronous | 16b | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR25L640FJ-WE2 | ROHM Semiconductor | Datasheet | 3932 | - | Min: 1 Mult: 1 | 13 Weeks | Copper, Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e2 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | TIN COPPER | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 10 | BR25L640 | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 3mA | 5MHz | 70 ns | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1.65mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C026A-15AXI | Cypress Semiconductor Corp | Datasheet | 18 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 100-LQFP | 100 | Volatile | -40°C~85°C TA | Tray | 1997 | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | QUAD | 260 | 1 | 5V | 0.5mm | 40 | CY7C026 | 100 | 5V | 5V | 256Kb 16K x 16 | 2 | 305mA | SRAM | Parallel | 16KX16 | 3-STATE | 16 | 15ns | 14b | 256 kb | 0.0015A | 15 ns | COMMON | Asynchronous | 16b | 2V | 1.6mm | 14mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No GD25Q16CTIG | GigaDevice Semiconductor (HK) Limited | Datasheet | 800 |
| Min: 1 Mult: 1 | 4 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~85°C TA | Tube | 2016 | Active | 3 (168 Hours) | 2.7V~3.6V | 16Mb 2M x 8 | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR93H86RF-WCE2 | ROHM Semiconductor | Datasheet | 2000 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 8-SOIC (0.173, 4.40mm Width) | YES | Non-Volatile | Automotive grade | -40°C~125°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 2.7V~5.5V | DUAL | NOT SPECIFIED | 1 | 4V | 1.27mm | NOT SPECIFIED | R-PDSO-G8 | Not Qualified | 5.5V | 2/5V | 2.7V | 16Kb 1K x 16 | SYNCHRONOUS | 1.25MHz | EEPROM | SPI | 1KX16 | 16 | 5ms | 0.000002A | 16384 bit | SERIAL | 3-WIRE | 1000000 Write/Erase Cycles | 10ms | 40 | SOFTWARE | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25X10BVSNIG | Winbond Electronics | Datasheet | 4 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 1Mb 128K x 8 | 16.5mA | 104MHz | 7 ns | FLASH | SPI | 1MX1 | 1 | 3ms | 24b | 1 Mb | 0.000005A | Synchronous | 1b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 1.72mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1041GE30-10BVXI | Cypress Semiconductor Corp | Datasheet | 33 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 48-VFBGA | YES | 48 | Volatile | -40°C~85°C TA | Tray | 2010 | Active | 3 (168 Hours) | 48 | 3A991.B.2.A | 8542.32.00.41 | 3V~3.6V | BOTTOM | 1 | 3V | 0.75mm | CY7C1041 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | 4Mb 256K x 16 | SRAM | Parallel | 256KX16 | 3-STATE | 16 | 10ns | 4194304 bit | 10 ns | COMMON | 1V | 1mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1021CV33-10ZC | Cypress Semiconductor Corp | Datasheet | 243 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | 0°C~70°C TA | Tray | 2002 | e0 | Obsolete | 3 (168 Hours) | 44 | Tin/Lead (Sn/Pb) | 3V~3.6V | DUAL | 240 | 1 | 3.3V | 0.8mm | not_compliant | 10GHz | 30 | CY7C1021 | 44 | Not Qualified | 3.3V | 3.63V | 2.97V | 1Mb 64K x 16 | 1 | 90mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 16b | 1 Mb | 0.005A | COMMON | Asynchronous | 16b | 3V | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT45DB021E-MHN-Y | Adesto Technologies | Datasheet | 40 |
| Min: 1 Mult: 1 | 8 Weeks | Gold | Surface Mount | Surface Mount | 8-UDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TC | Tray | 1997 | e4 | Active | 1 (Unlimited) | 8 | 1.65V~3.6V | DUAL | 260 | 1 | 1.8V | 1.27mm | NOT SPECIFIED | 8 | Not Qualified | 3.6V | 1.65V | SPI, Serial | 2Mb 264Bytes x 1024 pages | 16mA | 70MHz | 8 ns | FLASH | SPI | 8b | 2MX1 | 1 | 8μs, 3ms | 22b | 2 Mb | Synchronous | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 0.6mm | 6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 93LC66AT-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 2 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 93LC66AT-I/STG | 1 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Not Recommended | SOIC | 40 | 5.07 | Yes | 3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 512X8 | 1.2 mm | 8 | 0.000001 A | 4096 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 24LCS21AT-I/SNG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.1 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24LCS21AT-I/SNG | 1 | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOIC-8 | RECTANGULAR | SMALL OUTLINE | Not Recommended | SOIC | 40 | 7.32 | Yes | 3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | CMOS | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 128X8 | 1.75 mm | 8 | 1024 bit | SERIAL | EEPROM | I2C | 10 ms | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT28C256E-35UM/883 | Atmel | Datasheet | - | - | Min: 1 Mult: 1 |
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K4S281632I-UC75
Samsung
Package:Memory
Price: please inquire
-
S25FL256LAGBHV020
Cypress Semiconductor Corp
Package:Memory
9.813265
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CY7C1368C-166AXC
Cypress Semiconductor Corp
Package:Memory
1.055814
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25AA040AXT-I/ST
Microchip Technology
Package:Memory
0.616191
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BR24T32FV-WE2
ROHM Semiconductor
Package:Memory
Price: please inquire
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AT25XE011-XMHN-T
Adesto Technologies
Package:Memory
1.323361
-
25AA256T-E/MF
Microchip Technology
Package:Memory
1.799624
-
S71WS256PC0HH3YR3
Cypress Semiconductor Corp
Package:Memory
0.699052
-
RC28F128P33B85A
Micron Technology Inc.
Package:Memory
Price: please inquire
-
BR25L640FJ-WE2
ROHM Semiconductor
Package:Memory
Price: please inquire
-
CY7C026A-15AXI
Cypress Semiconductor Corp
Package:Memory
4.569124
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GD25Q16CTIG
GigaDevice Semiconductor (HK) Limited
Package:Memory
0.828203
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BR93H86RF-WCE2
ROHM Semiconductor
Package:Memory
Price: please inquire
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W25X10BVSNIG
Winbond Electronics
Package:Memory
Price: please inquire
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CY7C1041GE30-10BVXI
Cypress Semiconductor Corp
Package:Memory
5.048607
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CY7C1021CV33-10ZC
Cypress Semiconductor Corp
Package:Memory
0.208111
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AT45DB021E-MHN-Y
Adesto Technologies
Package:Memory
2.055113
-
93LC66AT-I/STG
Microchip
Package:Memory
Price: please inquire
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24LCS21AT-I/SNG
Microchip
Package:Memory
Price: please inquire
-
AT28C256E-35UM/883
Atmel
Package:Memory
Price: please inquire