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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Mount	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Card	CAS Latency	Chip Configuration	Chip Density (bit)	Chip Density (byte)	Chip Package Type	Clock Frequency-Max (fCLK)	Data Bus Width (bit)	Device Core Size	ECC Support	ECCN (US)	HTS	Ihs Manufacturer	Interface Type	Lead Shape	Main Category	Manufacturer	Manufacturer Part Number	Max. Access Time (ns)	Maximum Clock Rate	Maximum Clock Rate (MHz)	Maximum Operating Supply Voltage (V)	Maximum Operating Temperature (°C)	Memory	Memory Types	Minimum Operating Supply Voltage (V)	Minimum Operating Temperature (°C)	Model	Module	Module Density	Module Sides	Mounting	Number of Elements	Number of Chip Banks	Number of Chip per Module	Number of Ranks	Number of Words	Number of Words Code	Operating Current (mA)	Operating Supply Voltage (Max)	Operating Supply Voltage (Min)	Operating Supply Voltage (Typ)	Operating Temp Range	Operating Temperature (Max.)	Operating Temperature (Min.)	Operating Temperature Classification	Operating Temperature-Max	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Height	Package Length	Package Shape	Package Style	Package Type	Package Width	Part Life Cycle Code	PC Type	PCB changed	Pins	Programmability	Rad Hardened	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	SPD EEPROM Support	Standard Package Name	Supplier Package	Supplier Temperature Grade	Supply Voltage-Nom (Vsup)	Total Density	Typical Operating Supply Voltage (V)	Packaging	Part Status	ECCN Code	Type	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Frequency	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Configuration	Voltage	Max Supply Voltage	Min Supply Voltage	Number of Ports	Speed	Operating Mode	Supply Current-Max	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Max Frequency	PLL	I/O Type	Memory IC Type	Capacity	Refresh Cycles	Access Mode	Features	Self Refresh	Module Type	Length	Width	Radiation Hardening	RoHS Status	Lead Free
Mfr Part No SDSDJ-2048-J	Western Digital	Datasheet	-	-	Min: 1 Mult: 1							SD Card				2G						EAR99			SD/SPI								3.6	85			2.7	-25					Socket																				2.1	32				24			9		Yes							SD	SD				3.3		Obsolete															9																																				RoHS Compliant
Mfr Part No KVR13LR9D8/4HC	Kingston Technology	Datasheet	-	-	Min: 1 Mult: 1								9	256Mx8	2G		FBGA		72		Yes	EAR99				No Lead						1333	1.45/1.575	85			1.28/1.425	0		DRAM Module	4Gbyte	Double	Socket		8	18	Dual																30	133.35						PC3-10600	240								No	DIM	RDIMM				1.35/1.5		Obsolete															240																	512Mx72							Yes							No	240RDIMM				Supplier Unconfirmed
Mfr Part No M471A1G43DB1-CRC00	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1								17	512Mx8	4G				64		No	4A994.a	8473.30.11.40									2400		95				0		DRAM Module	8Gbyte		Socket			16	Dual																								260										SODIMM	Commercial			1.2																	260																	1Gx64															204USODIMM
Mfr Part No KVR1066D3S8R7SK2/2GI	Kingston Technology	Datasheet	-	-	Min: 1 Mult: 1								7	128Mx8	1G		FBGA		72		Yes	EAR99				No Lead						1066	1.575	85			1.425	0		DRAM Module	2Gbyte	Double	Socket		8	18	Single																30	133.35						PC3-8500	240								No	DIM	RDIMM				1.5		Obsolete															240																	128Mx72x2							No							No	240RDIMM				Supplier Unconfirmed
Mfr Part No MT4HTF3264HY-667F1	Micron Technology	Datasheet	-	-	Min: 1 Mult: 1		Socket	NO	200	200	0.45 ns		5	32Mx16	512M			333 MHz	64		No	EAR99	8542.32.00.32	MICRON TECHNOLOGY INC		No Lead		Micron Technology Inc	MT4HTF3264HY-667F1			667	1.9	70			1.7	0		DRAM Module	256Mbyte	Single	Socket	4	4	4	Single	33554432 words	32000000	1000								70 °C	PLASTIC/EPOXY	DIMM		DIMM200,24	30(Max)	67.75(Max)	RECTANGULAR	MICROELECTRONIC ASSEMBLY		2.45(Max)	Obsolete	PC2-5300	200					5.84	Compliant	Yes	Yes	DIM	SODIMM	Commercial	1.8 V		1.8	Tray	Obsolete			70 °C	0 °C			CMOS	DUAL	NO LEAD			0.6 mm	unknown		200	R-PDMA-N200	Not Qualified	1.8 V		1.8 V	COMMERCIAL				1.9 V	1.7 V				1.4 mA	64 b	32Mx64	3-STATE		64	0.028 A	2147483648 bit	667 MHz	No	COMMON	DDR DRAM MODULE		8K			Yes	200SODIMM			No	RoHS Compliant
Mfr Part No KVR133X64C2/256	Kingston Technology	Datasheet	-	-	Min: 1 Mult: 1								2	32Mx8	256M		TSOP		64		No	EAR99				No Lead						133	3.6				3			DRAM Module	256Mbyte	Single	Socket		4	8																	29.21	133.35						PC-133	168								No	DIM	DIMM				3.3		Obsolete															168																	32Mx64							No							No	168DIMM				Supplier Unconfirmed
Mfr Part No KCP426NS6/4	Kingston Technology	Datasheet	-	-	Min: 1 Mult: 1								19						64		No	EAR99										2666		85				0		DRAM Module	4Gbyte		Socket				Single																							PC4-21300	288										UDIMM				1.2		Active															288																	512Mx64															288UDIMM				Supplier Unconfirmed
Mfr Part No M393A4K40BB2-CTD6Y	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1								19	2Gx4	8G		78FBGA		72		Yes	EAR99	8473.30.11.40			No Lead						2666	1.26				1.14			DRAM Module	32Gbyte	Double	Socket			36	Dual			2827													31.25	133.35				4.3(Max)			288								No	DIM	RDIMM				1.2		Active															288																	4Gx72							No							Yes	288RDIMM				RoHS Compliant
Mfr Part No TS32MSD64V3F5	Transcend Information	Datasheet	-	-	Min: 1 Mult: 1								2.5	32Mx8	256M		TSOP-II		64		No	EAR99				No Lead						333	2.7				2.3			DRAM Module	256Mbyte	Double	Socket			8																	31.75	67.6							200								Yes	DIM	SODIMM				2.5		Active															200																	32Mx64							No							Yes	200USODIMM				RoHS Compliant
Mfr Part No TS8GEMC210	Transcend Information	Datasheet	-	-	Min: 1 Mult: 1							Embedded Flash Drive				8G						EAR99			MMC	Ball							3.6	85			2.7	-25					Surface Mount																				0.92(Max)	13				11.5			153		Yes							BGA	BGA				3.3		Active															153																																				RoHS Compliant
Mfr Part No KVR800D2S6/1G	Kingston Technology	Datasheet	-	-	Min: 1 Mult: 1		Socket		200				6	128Mx8	1G				64		No	EAR99	8473.30.11.40			No Lead						800	1.9			DDR2	1.7			DRAM Module	1Gbyte	Double	Socket	8		8	Single																30	67.6							200						Compliant		No	DIM	SODIMM				1.8		Obsolete														800 MHz	200			1.8 V						1.8 V	1.9 V	1.7 V						128Mx64						800 MHz	No							No	200SODIMM				Yes with exemptions	Lead Free
Mfr Part No M474B1G73QH0-YK000	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1								11	512Mx8	4G		78FBGA		72		Yes	EAR99	8473.30.51.00			No Lead						1600	1.45/1.575	95			1.283/1.425	0		DRAM Module	8Gbyte		Socket			18	Dual			1125													30	67.6				3.8(Max)			204									DIM	USODIMM				1.35/1.5		Obsolete															204																	1Gx72															204USODIMM
Mfr Part No EVS32M16T-5 BITR	Teledyne e2v	Datasheet	-	-	Min: 1 Mult: 1								3	32Mx16	512M		66TSOP-II		16		No											167	2.7	85			2.3	-40		DRAM Module	1Gbit		Surface Mount		4	2																	1.8(Min)	22.62(Max)							66								No		TSOP-II	Industrial			2.5																	66																	64Mx16							No							Yes					Supplier Unconfirmed
Mfr Part No 5962-0622901VXC	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1									512Kx8	4M		68-MQFPT		32		No	4A994.a								25			3.6	125			3	-55		SRAM Module	16Mbit		Surface Mount			4				150													4.7(Max)	64.14(Max)				64.14(Max)			68									QFP	MQFP-T	Military			3.3		Active															68																	512Kx32														No					Supplier Unconfirmed
Mfr Part No KVR16N11/8	Kingston Technology	Datasheet	11 In Stock	1: $45.758437 10: $43.168336 100: $40.724846 500: $38.419666 View all price	Min: 1 Mult: 1	4 Weeks, 2 Days							11	512Mx8	4G		FBGA		64		No	EAR99	8473.30.11.40	KINGSTON TECHNOLOGY COMPANY INC		No Lead		Kingston Technology Company	KVR16N11/8			1600	1.575	85	8GB		1.425	0	ValueRAM	DRAM Module	8Gbyte	Double	Socket		8	16	Dual														DIMM-240		30	133.35					Contact Manufacturer	PC3-12800	240	240				5.63		No	No	DIM	DIMM				1.5		Active	EAR99	ValueRAM				8473.30.11.40							unknown		240								240-pin DIMM	1.5V				1600MHz				1Gx64							No			8 GB			Unbuffered	No	240DIMM				Yes with exemptions
Mfr Part No M393A1K43BB1-CTD6Q	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1								19	1Gx8	8G		78FBGA		72		Yes	EAR99	8542.32.00.71			No Lead						2666	1.26				1.14			DRAM Module	8Gbyte	Double	Socket			9	Single																31.25	133.35				4.3(Max)			288								No	DIM	RDIMM				1.2		Obsolete															288																	1Gx72							No							Yes	288RDIMM				RoHS Compliant
Mfr Part No TS8D30AR00LNS	Transcend Information	Datasheet	-	-	Min: 1 Mult: 1									512Mx8	4G		FBGA		64	64(b)	No	4A994.a	8473.30.11.40				DRAM Module				1600(MHz)	1600	1.575	85			1.425	0		DRAM Module	8Gbyte		Socket				Dual			1320	1.575(V)	1.425(V)	1.5(V)	0C to 85C	85C	0C	Commercial						30	133.35			UDIMM				240			No							UDIMM			8GByte(b)	1.5	Bulk	Active															240																	1Gx64															240UDIMM				RoHS Compliant
Mfr Part No KVR1333D3N9/8G	Kingston Technology	Datasheet	-	-	Min: 1 Mult: 1	4 Weeks, 2 Days		YES		240	0.255 ns		9	512Mx8	4G		FBGA	667 MHz	64		No	EAR99	8473.30.11.40	KINGSTON TECHNOLOGY COMPANY INC		No Lead		Kingston Technology Company	KVR1333D3N9/8G			1333	1.575	85			1.425	0		DRAM Module	8Gbyte	Double	Socket		8	16	Dual	1073741824 words	1000000000									85 °C	UNSPECIFIED	DIMM	DIMM, DIMM240,40	DIMM240,40	30	133.35	RECTANGULAR	MICROELECTRONIC ASSEMBLY			Contact Manufacturer	PC3-10600	240					5.69			No	DIM	DIMM		1.5 V		1.5		Active	EAR99				PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM	8473.30.11.40	CMOS	UNSPECIFIED	NO LEAD		1	1 mm	unknown		240	R-XXMA-N240	Not Qualified		1.575 V	1.5 V	OTHER	1.425 V					1		SYNCHRONOUS			1Gx64	3-STATE	30 mm	64		68719476736 bit		No	COMMON	DDR DRAM MODULE		8192	MULTI BANK PAGE BURST		No	240DIMM	133.35 mm			Yes with exemptions
Mfr Part No M471B1G73DB0-YK0	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1								11	512Mx8	4G				64		No	EAR99										1600								DRAM Module	8Gbyte		Socket			16	Dual																								204								No		USODIMM				1.35		Obsolete															204																	1Gx64							No							No	204USODIMM				RoHS Compliant
Mfr Part No M393A1G43DB0-CPB	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1			NO		288			15	512Mx8	4G		FBGA		72		Yes	EAR99		SAMSUNG SEMICONDUCTOR INC				Samsung Semiconductor	M393A1G43DB0-CPB			2133	1.26				1.14			DRAM Module	8Gbyte	Double	Socket			18	Dual	1073741824 words	1000000000	1750									UNSPECIFIED	DIMM	DIMM,		31.25	133.35	RECTANGULAR	MICROELECTRONIC ASSEMBLY		4.3(Max)	Active		288				NOT SPECIFIED	5.71		Yes	No	DIM	RDIMM		1.2 V		1.2		Obsolete	EAR99				AUTO/SELF REFRESH; WD-MAX		CMOS	DUAL	NO LEAD	NOT SPECIFIED	1	0.85 mm	compliant		288	R-XDMA-N288			1.26 V			1.14 V					1		SYNCHRONOUS			1Gx72		31.4 mm	72		77309411328 bit		No		DDR DRAM MODULE			DUAL BANK PAGE BURST		Yes	288RDIMM	133.35 mm	3.9 mm		RoHS Compliant