The category is 'Embedded - Microprocessors'

  • All Manufacturers
  • Package / Case
  • Packaging
  • Moisture Sensitivity Level (MSL)
  • RoHS Status
  • Core Processor
  • Graphics Acceleration
  • Number of Cores/Bus Width
  • Operating Temperature
  • Part Status
  • RAM Controllers
  • Series
  • USB

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Contact plating

Contact Plating

Surface Mount

Number of pins

Material

Number of Terminals

ADC (12bit) CH

Base Product Number

Base/Housing Material

Body Orientation

Brand

Clock Frequency-Max

CMOS Interface

Connector

Connector pinout layout

Contact Materials

Contacts pitch

Crypto

Date Of Intro

DRAM size

Electrical mounting

eMMC I/F

Factory Pack QuantityFactory Pack Quantity

Gross weight

Ihs Manufacturer

Kind of connector

Manufacturer

Mfr

Moisture Sensitive

Mounting

NAND Flash Boot

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part # Aliases

Part Life Cycle Code

Part Package Code

Product Series

Product Status

Real-Time Clock (RTC)

RoHS

Rohs Code

Row pitch

SD / SDIO

SD Memory Boot

Shipping Restrictions

Spatial orientation

SPI Flash Boot

Stack DDR Size

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Termination Method

Thread

Timer (32-bit)

Transport packaging size/quantity

Type of connector

UART

Operating temperature

Operating Temperature

Packaging

Series

JESD-609 Code

Pbfree Code

Part Status

ECCN Code

Type

Terminal Finish

Gender

Additional Feature

HTS Code

Subcategory

Pitch

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Current rating

Frequency

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Number of Contacts

Temperature Grade

Number of Ports

Speed

uPs/uCs/Peripheral ICs Type

Core Processor

Supply Current-Max

Bit Size

Data Bus Width

Seated Height-Max

Address Bus Width

Product Type

Boundary Scan

Low Power Mode

Screening Level

External Data Bus Width

Format

Integrated Cache

Rated voltage

Number of GPIO

Profile

SPI

CAN

PWM

Saturation Current

Operating Voltage

Product Category

Shaft diameter

Product Length

Length

Width

Plating thickness

Flammability rating

TS80C188EB-8

Mfr Part No

TS80C188EB-8

Intel Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

80

INTEL CORP

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP, QFP80,.7X.9,32

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

Obsolete

QFP

No

5.5 V

4.5 V

5 V

e0

Tin/Lead (Sn/Pb)

8MHZ, 16MHZ SPEED VERSION NOT AVAILABLE FOR 5V OPTION

8542.31.00.01

QUAD

GULL WING

0.8 mm

compliant

80

R-PQFP-G80

Not Qualified

INDUSTRIAL

8 MHz

MICROPROCESSOR

45 mA

16

20

NO

YES

8

FIXED POINT

NO

FH8065301729501

Mfr Part No

FH8065301729501

Intel Corporation Datasheet

-

-

Min: 1

Mult: 1

gold-plated

2

socket

2x1

2.54mm

2018-07-27

THT

0.11 g

INTEL CORP

female

Active

2.54mm

straight

pin strips

-40...163°C

8542.31.00.01

compliant

1.5A

MICROPROCESSOR

60V

beryllium copper

0.254µm

UL94V-0

FS32R264JCK0MMM

Mfr Part No

FS32R264JCK0MMM

NXP Semiconductors Datasheet

6312
In Stock

-

Min: 1

Mult: 1

gold-plated

6

socket

1x6

2.54mm

THT

0.57 g

NXP SEMICONDUCTORS

female

,

Obsolete

straight

pin strips

-40...163°C

8542.31.00.01

unknown

1.5A

MICROCONTROLLER, RISC

60V

beryllium copper

0.75µm

UL94V-0

8155PP5

Mfr Part No

8155PP5

Exar Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

576

EXAR CORP

70 °C

PLASTIC/EPOXY

BGA

BGA, BGA576,30X30,50

BGA576,30X30,50

SQUARE

GRID ARRAY

Obsolete

No

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

S-PBGA-B576

Not Qualified

COMMERCIAL

TSPC603RMGU10LC

Mfr Part No

TSPC603RMGU10LC

Atmel Corporation Datasheet

592
In Stock

-

Min: 1

Mult: 1

YES

255

75 MHz

ATMEL CORP

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA, BGA255,16X16,50

BGA255,16X16,50

SQUARE

GRID ARRAY

Transferred

BGA

No

2.625 V

2.375 V

2.5 V

e0

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

255

S-CBGA-B255

Not Qualified

MILITARY

233 MHz

MICROPROCESSOR, RISC

32

3 mm

32

YES

YES

64

FLOATING POINT

YES

21 mm

21 mm

TSPC603RMGU14LC

Mfr Part No

TSPC603RMGU14LC

Teledyne e2v Datasheet

-

-

Min: 1

Mult: 1

YES

255

300 MHz

E2V TECHNOLOGIES PLC

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA,

SQUARE

GRID ARRAY

Obsolete

BGA

2.625 V

2.375 V

2.5 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

255

S-CBGA-B255

Not Qualified

MILITARY

300 MHz

MICROPROCESSOR, RISC

32

3 mm

32

YES

YES

64

FLOATING POINT

YES

21 mm

21 mm

E3845

Mfr Part No

E3845

Intel Corporation Datasheet

3
In Stock

-

Min: 1

Mult: 1

INTEL CORP

,

Active

8542.31.00.01

compliant

MICROPROCESSOR

TSPC860SRVZQU66D

Mfr Part No

TSPC860SRVZQU66D

Teledyne LeCroy Datasheet

-

-

Min: 1

Mult: 1

32 Bit

NUC980DF71YC

Mfr Part No

NUC980DF71YC

Nuvoton Datasheet

400
In Stock

  • 1: $13.285092
  • 10: $12.533105
  • 100: $11.823684
  • 500: $11.154419
  • View all price

Min: 1

Mult: 1

8

2

128MB

LQFP216

NUC980 Industrial control IoT series

2

128MB

128

10

-40~+85˚C

300MHz

ARM9

104

3

4

8

3~3.6V

NUC980DK61Y

Mfr Part No

NUC980DK61Y

Nuvoton Datasheet

-

-

Min: 1

Mult: 1

8

2

64MB

LQFP128

NUC980 Industrial control IoT series

2

64MB

64

10

-40~+85˚C

300MHz

ARM9

92

3

-

8

3~3.6V

BCM58522BB1KF10G

Mfr Part No

BCM58522BB1KF10G

Broadcom Limited Datasheet

115
In Stock

  • 1: $15.658309
  • 10: $14.771989
  • 100: $13.935838
  • 500: $13.147017
  • View all price

Min: 1

Mult: 1

Bulk

*

Obsolete

XPC850SRCZT66BU

Mfr Part No

XPC850SRCZT66BU

Motorola Mobility LLC Datasheet

-

-

Min: 1

Mult: 1

YES

Brass

256

33 MHz

1.35

MOTOROLA INC

PLASTIC/EPOXY

BGA

BGA, BGA256,16X16,50

BGA256,16X16,50

SQUARE

GRID ARRAY

Transferred

BGA

3.465 V

3.135 V

3.3 V

M5

28.5*21*19/5000

3A991.A.2

Threaded bushing with hole series BN1035

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

256

S-PBGA-B256

Not Qualified

66 MHz

MICROPROCESSOR, RISC

32

2.35 mm

26

YES

YES

32

FIXED POINT

YES

5.5 mm

23 mm

23 mm

TDA2SGBRQABCQ1

Mfr Part No

TDA2SGBRQABCQ1

Texas Instruments Datasheet

-

-

Min: 1

Mult: 1

YES

760

TEXAS INSTRUMENTS INC

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

FCBGA-760

SQUARE

GRID ARRAY, FINE PITCH

Obsolete

Yes

1.2 V

1.11 V

1.15 V

e1

Yes

5A992.C

TIN SILVER COPPER

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B760

AUTOMOTIVE

SoC

2.96 mm

AEC-Q100

3

23 mm

23 mm

TSPC603RMGU6LC

Mfr Part No

TSPC603RMGU6LC

Teledyne e2v Datasheet

-

-

Min: 1

Mult: 1

YES

255

166 MHz

E2V TECHNOLOGIES PLC

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA,

SQUARE

GRID ARRAY

Obsolete

BGA

2.625 V

2.375 V

2.5 V

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

255

S-CBGA-B255

Not Qualified

MILITARY

166 MHz

MICROPROCESSOR, RISC

32

3 mm

32

YES

YES

64

FLOATING POINT

YES

21 mm

21 mm

TSPC603RMGU6LC

Mfr Part No

TSPC603RMGU6LC

Atmel Corporation Datasheet

388
In Stock

-

Min: 1

Mult: 1

YES

255

66.7 MHz

ATMEL CORP

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA, BGA255,16X16,50

BGA255,16X16,50

SQUARE

GRID ARRAY

Transferred

BGA

No

2.625 V

2.375 V

2.5 V

e0

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

255

S-CBGA-B255

Not Qualified

MILITARY

166 MHz

MICROPROCESSOR, RISC

32

3 mm

32

YES

YES

64

FLOATING POINT

YES

21 mm

21 mm

IBMPPC750GXECB5H83T

Mfr Part No

IBMPPC750GXECB5H83T

IBM Datasheet

-

-

Min: 1

Mult: 1

Bulk

*

Active

IBM25PPC750FX-GR0533V

Mfr Part No

IBM25PPC750FX-GR0533V

IBM Datasheet

-

-

Min: 1

Mult: 1

Bulk

*

Active

DNCE2530G

Mfr Part No

DNCE2530G

MaxLinear Datasheet

-

-

Min: 1

Mult: 1

MaxLinear

600

MaxLinear

Yes

911323

Details

This product may require additional documentation to export from the United States.

Tray

Embedded Processors & Controllers

CPU - Central Processing Units

CPU - Central Processing Units

MIMX8UX5CVLFZAC

Mfr Part No

MIMX8UX5CVLFZAC

NXP Datasheet

30
In Stock

  • 1: $63.832131
  • 10: $60.218992
  • 100: $56.810370
  • 500: $53.594688
  • View all price

Min: 1

Mult: 1

MIMX8UX5

NXP Semiconductors

60

NXP

NXP USA Inc.

Yes

Tray

935407702557

Active

Details

Tray

i.MX 8QuadXPlus

Microprocessors - MPU

Microprocessors - MPU

Microprocessors - MPU

MIMX8DX5AVLFZACR

Mfr Part No

MIMX8DX5AVLFZACR

NXP Datasheet

8000
In Stock

-

Min: 1

Mult: 1

Gold

37

Nylon

Straight

NXP Semiconductors

Phosphor Bronze

500

NXP

Yes

Through Hole

935380417518

Details

Solder

-55 to 105 °C

Reel

i.MX 8DualXPlus

D-Subminiature

Receptacle

Microprocessors - MPU

2.7700 mm

37 POS

1

Microprocessors - MPU

Microprocessors - MPU

69.32 mm