The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact plating | Contact Plating | Surface Mount | Number of pins | Material | Number of Terminals | ADC (12bit) CH | Base Product Number | Base/Housing Material | Body Orientation | Brand | Clock Frequency-Max | CMOS Interface | Connector | Connector pinout layout | Contact Materials | Contacts pitch | Crypto | Date Of Intro | DRAM size | Electrical mounting | eMMC I/F | Factory Pack QuantityFactory Pack Quantity | Gross weight | Ihs Manufacturer | Kind of connector | Manufacturer | Mfr | Moisture Sensitive | Mounting | NAND Flash Boot | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Part Package Code | Product Series | Product Status | Real-Time Clock (RTC) | RoHS | Rohs Code | Row pitch | SD / SDIO | SD Memory Boot | Shipping Restrictions | Spatial orientation | SPI Flash Boot | Stack DDR Size | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Thread | Timer (32-bit) | Transport packaging size/quantity | Type of connector | UART | Operating temperature | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Type | Terminal Finish | Gender | Additional Feature | HTS Code | Subcategory | Pitch | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Number of Contacts | Temperature Grade | Number of Ports | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Supply Current-Max | Bit Size | Data Bus Width | Seated Height-Max | Address Bus Width | Product Type | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Rated voltage | Number of GPIO | Profile | SPI | CAN | PWM | Saturation Current | Operating Voltage | Product Category | Shaft diameter | Product Length | Length | Width | Plating thickness | Flammability rating |
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![]() | Mfr Part No TS80C188EB-8 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | INTEL CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.7X.9,32 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8MHZ, 16MHZ SPEED VERSION NOT AVAILABLE FOR 5V OPTION | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | compliant | 80 | R-PQFP-G80 | Not Qualified | INDUSTRIAL | 8 MHz | MICROPROCESSOR | 45 mA | 16 | 20 | NO | YES | 8 | FIXED POINT | NO | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FH8065301729501 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | 2 | socket | 2x1 | 2.54mm | 2018-07-27 | THT | 0.11 g | INTEL CORP | female | Active | 2.54mm | straight | pin strips | -40...163°C | 8542.31.00.01 | compliant | 1.5A | MICROPROCESSOR | 60V | beryllium copper | 0.254µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FS32R264JCK0MMM | NXP Semiconductors | Datasheet | 6312 | - | Min: 1 Mult: 1 | gold-plated | 6 | socket | 1x6 | 2.54mm | THT | 0.57 g | NXP SEMICONDUCTORS | female | , | Obsolete | straight | pin strips | -40...163°C | 8542.31.00.01 | unknown | 1.5A | MICROCONTROLLER, RISC | 60V | beryllium copper | 0.75µm | UL94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 8155PP5 | Exar Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 576 | EXAR CORP | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA576,30X30,50 | BGA576,30X30,50 | SQUARE | GRID ARRAY | Obsolete | No | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B576 | Not Qualified | COMMERCIAL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC603RMGU10LC | Atmel Corporation | Datasheet | 592 | - | Min: 1 Mult: 1 | YES | 255 | 75 MHz | ATMEL CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA255,16X16,50 | BGA255,16X16,50 | SQUARE | GRID ARRAY | Transferred | BGA | No | 2.625 V | 2.375 V | 2.5 V | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | MILITARY | 233 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 21 mm | 21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC603RMGU14LC | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | YES | 255 | 300 MHz | E2V TECHNOLOGIES PLC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 2.625 V | 2.375 V | 2.5 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | MILITARY | 300 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 21 mm | 21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No E3845 | Intel Corporation | Datasheet | 3 | - | Min: 1 Mult: 1 | INTEL CORP | , | Active | 8542.31.00.01 | compliant | MICROPROCESSOR | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC860SRVZQU66D | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | 32 Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NUC980DF71YC | Nuvoton | Datasheet | 400 |
| Min: 1 Mult: 1 | 8 | 2 | √ | 128MB | √ | √ | LQFP216 | NUC980 Industrial control IoT series | √ | 2 | √ | √ | 128MB | 128 | 10 | -40~+85˚C | 300MHz | ARM9 | 104 | 3 | 4 | 8 | 3~3.6V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NUC980DK61Y | Nuvoton | Datasheet | - | - | Min: 1 Mult: 1 | 8 | 2 | √ | 64MB | √ | √ | LQFP128 | NUC980 Industrial control IoT series | √ | 2 | √ | √ | 64MB | 64 | 10 | -40~+85˚C | 300MHz | ARM9 | 92 | 3 | - | 8 | 3~3.6V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM58522BB1KF10G | Broadcom Limited | Datasheet | 115 |
| Min: 1 Mult: 1 | Bulk | * | Obsolete | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC850SRCZT66BU | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | Brass | 256 | 33 MHz | 1.35 | MOTOROLA INC | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,50 | BGA256,16X16,50 | SQUARE | GRID ARRAY | Transferred | BGA | 3.465 V | 3.135 V | 3.3 V | M5 | 28.5*21*19/5000 | 3A991.A.2 | Threaded bushing with hole series BN1035 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 256 | S-PBGA-B256 | Not Qualified | 66 MHz | MICROPROCESSOR, RISC | 32 | 2.35 mm | 26 | YES | YES | 32 | FIXED POINT | YES | 5.5 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TDA2SGBRQABCQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 760 | TEXAS INSTRUMENTS INC | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-760 | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | Yes | 1.2 V | 1.11 V | 1.15 V | e1 | Yes | 5A992.C | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B760 | AUTOMOTIVE | SoC | 2.96 mm | AEC-Q100 | 3 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC603RMGU6LC | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | YES | 255 | 166 MHz | E2V TECHNOLOGIES PLC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 2.625 V | 2.375 V | 2.5 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | MILITARY | 166 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 21 mm | 21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TSPC603RMGU6LC | Atmel Corporation | Datasheet | 388 | - | Min: 1 Mult: 1 | YES | 255 | 66.7 MHz | ATMEL CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA255,16X16,50 | BGA255,16X16,50 | SQUARE | GRID ARRAY | Transferred | BGA | No | 2.625 V | 2.375 V | 2.5 V | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | Not Qualified | MILITARY | 166 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 21 mm | 21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBMPPC750GXECB5H83T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBM25PPC750FX-GR0533V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DNCE2530G | MaxLinear | Datasheet | - | - | Min: 1 Mult: 1 | MaxLinear | 600 | MaxLinear | Yes | 911323 | Details | This product may require additional documentation to export from the United States. | Tray | Embedded Processors & Controllers | CPU - Central Processing Units | CPU - Central Processing Units | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MIMX8UX5CVLFZAC | NXP | Datasheet | 30 |
| Min: 1 Mult: 1 | MIMX8UX5 | NXP Semiconductors | 60 | NXP | NXP USA Inc. | Yes | Tray | 935407702557 | Active | Details | Tray | i.MX 8QuadXPlus | Microprocessors - MPU | Microprocessors - MPU | Microprocessors - MPU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MIMX8DX5AVLFZACR | NXP | Datasheet | 8000 | - | Min: 1 Mult: 1 | Gold | 37 | Nylon | Straight | NXP Semiconductors | Phosphor Bronze | 500 | NXP | Yes | Through Hole | 935380417518 | Details | Solder | -55 to 105 °C | Reel | i.MX 8DualXPlus | D-Subminiature | Receptacle | Microprocessors - MPU | 2.7700 mm | 37 POS | 1 | Microprocessors - MPU | Microprocessors - MPU | 69.32 mm |
TS80C188EB-8
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
FH8065301729501
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
FS32R264JCK0MMM
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
8155PP5
Exar Corporation
Package:Embedded - Microprocessors
Price: please inquire
TSPC603RMGU10LC
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
TSPC603RMGU14LC
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
E3845
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
TSPC860SRVZQU66D
Teledyne LeCroy
Package:Embedded - Microprocessors
Price: please inquire
NUC980DF71YC
Nuvoton
Package:Embedded - Microprocessors
13.285092
NUC980DK61Y
Nuvoton
Package:Embedded - Microprocessors
Price: please inquire
BCM58522BB1KF10G
Broadcom Limited
Package:Embedded - Microprocessors
15.658309
XPC850SRCZT66BU
Motorola Mobility LLC
Package:Embedded - Microprocessors
Price: please inquire
TDA2SGBRQABCQ1
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
TSPC603RMGU6LC
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
TSPC603RMGU6LC
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
IBMPPC750GXECB5H83T
IBM
Package:Embedded - Microprocessors
Price: please inquire
IBM25PPC750FX-GR0533V
IBM
Package:Embedded - Microprocessors
Price: please inquire
DNCE2530G
MaxLinear
Package:Embedded - Microprocessors
Price: please inquire
MIMX8UX5CVLFZAC
NXP
Package:Embedded - Microprocessors
63.832131
MIMX8DX5AVLFZACR
NXP
Package:Embedded - Microprocessors
Price: please inquire
