The category is 'Embedded - PLDs (Programmable Logic Device)'
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- Base Part Number
- Moisture Sensitivity Level (MSL)
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- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No PZ3064DS10A44 | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | XILINX INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | No | e0 | TIN LEAD | YES | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 30 | S-PQCC-J44 | Not Qualified | INDUSTRIAL | 11.5 ns | EE PLD | 64 | YES | YES | |||||||||||||||||||||
| Mfr Part No XH95216-7PQ160C | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | XILINX INC | 3 | 133 | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Transferred | QFP | No | 5 V | e0 | No | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 0.65 mm | compliant | 160 | S-PQFP-G160 | Not Qualified | 0 DEDICATED INPUTS, 133 I/O | 3.94 mm | MASK PLD | MACROCELL | 28 mm | 28 mm | ||||||||||||||||||||
| Mfr Part No XCR3384XL-7.5CSG280I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 280 | XILINX INC | 3 | 216 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3.6 V | 2.7 V | 3.3 V | e1 | Yes | 3A991.D | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | 280 | S-PBGA-B280 | Not Qualified | INDUSTRIAL | 7.5 ns | 216 I/O | 1.2 mm | EE PLD | MACROCELL | 16 mm | 16 mm | |||||||||||||
| Mfr Part No XCR3384XL-7.5CSG280I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 280 | ADVANCED MICRO DEVICES INC | 3 | 216 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Yes | 3.6 V | 2.7 V | 3.3 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B280 | Not Qualified | INDUSTRIAL | 7.5 ns | 216 I/O | 1.2 mm | EE PLD | MACROCELL | 16 mm | 16 mm | ||||||||||||||||||
 | Mfr Part No XC7354-12WC68I | AMD Xilinx | Datasheet | 528 | - | Min: 1 Mult: 1 | YES | 68 | 66.7 MHz | XILINX INC | 1 | 42 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | LCC | No | 5.5 V | 4.5 V | 5 V | 54 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 108 FLIP-FLOPS | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 68 | S-CQCC-J68 | Not Qualified | INDUSTRIAL | 27 ns | 8 DEDICATED INPUTS, 42 I/O | 4.826 mm | UV PLD | MACROCELL | 54 | NO | 8 | NO | 24.13 mm | 24.13 mm | |||||||||||
| Mfr Part No PAL16R6B-2CJ | Vantis Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | 25 MHz | VANTIS CORP | 70 °C | CERAMIC | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T20 | 6 | Not Qualified | COMMERCIAL | 25 ns | PAL-TYPE | 10 | OT PLD | REGISTERED | 64 | ||||||||||||||||||||||
 | Mfr Part No PAL16R6B-2CJ | AMD | Datasheet | 659 | - | Min: 1 Mult: 1 | NO | 20 | 25 MHz | ADVANCED MICRO DEVICES INC | 2 | 75 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | POWER-UP RESET; REGISTER PRELOAD; 1 EXTERNAL CLOCK | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 20 | R-CDIP-T20 | 6 | Not Qualified | COMMERCIAL EXTENDED | 25 ns | PAL-TYPE | 10 | 8 DEDICATED INPUTS, 2 I/O | 5.08 mm | OT PLD | MIXED | 8 | 64 | 24.257 mm | 7.62 mm | ||||||||||
| Mfr Part No PZ5128IS15BP | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | XILINX INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Obsolete | No | 5 V | YES | 8542.39.00.01 | QUAD | GULL WING | 240 | 0.5 mm | unknown | 30 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 17.5 ns | EE PLD | 128 | YES | YES | |||||||||||||||||||||
| Mfr Part No PZ5128IS15BP | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | PHILIPS SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 17.5 ns | EE PLD | 128 | YES | YES | ||||||||||||||||||||||
 | Mfr Part No PZ5128IS15BP | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 63 MHz | NXP SEMICONDUCTORS | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | 14 X 14 X 1 MM, PLASTIC, SOT-386-1, TQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | 5.5 V | 4.5 V | 5 V | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | 100 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 17.5 ns | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | MACROCELL | 2 | 14 mm | 14 mm | ||||||||||||||||||
| Mfr Part No PAL14L4NC | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | NATIONAL SEMICONDUCTOR CORP | 75 °C | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | ACTIVE LOW OUTPUT | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T20 | 4 | Not Qualified | COMMERCIAL EXTENDED | 35 ns | PAL-TYPE | 14 | 14 DEDICATED INPUTS, 0 I/O | 5.08 mm | OT PLD | COMBINATORIAL | 14 | 16 | 26.075 mm | 7.62 mm | ||||||||||||||
 | Mfr Part No CY7C332-25WC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 35.7 MHz | CYPRESS SEMICONDUCTOR CORP | 12 | 75 °C | CERAMIC, GLASS-SEALED | WDIP | 0.300 INCH, WINDOWED, CERDIP-28 | DIP28,.3 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 12 I/O MACROCELLS; 2 EXTERNAL CLOCKS; VARIABLE PRODUCT TERMS; SHARED INPUT/CLOCK | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | 28 | R-GDIP-T28 | 12 | Not Qualified | COMMERCIAL EXTENDED | 25 ns | PAL-TYPE | 25 | 10 DEDICATED INPUTS, 12 I/O | 5.08 mm | UV PLD | MACROCELL | 10 | 192 | 37.0205 mm | 7.62 mm | ||||||||||
| Mfr Part No M4-64/32-15VC48 | Vantis Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 37 MHz | VANTIS CORP | 32 | 70 °C | PLASTIC/EPOXY | QFP | QFP48,.35SQ,20 | SQUARE | FLATPACK | Transferred | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 64 MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK; PROGRAMMABLE POLARITY | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G48 | Not Qualified | COMMERCIAL | 15 ns | 0 DEDICATED INPUTS, 32 I/O | EE PLD | MACROCELL | 64 | YES | YES | |||||||||||||||||||
| Mfr Part No XC95180-10HQG208 | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | XILINX INC | 3 | 168 | PLASTIC/EPOXY | HFQFP | HFQFP, | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | Yes | 3.3 V | e3 | MATTE TIN | CONFIGURABLE 3.3V OR 5V I/O OPERATION; INSYSTEM PROGRAMMABLE | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | FLASH PLD | MACROCELL | 28 mm | 28 mm | |||||||||||||||||||||
 | Mfr Part No XCR3256XL-7.5CS280C | AMD Xilinx | Datasheet | 343 | - | Min: 1 Mult: 1 | YES | 280 | 167 MHz | XILINX INC | 3 | 160 | 70 °C | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | No | 3.6 V | 3 V | 3.3 V | e0 | No | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | 280 | S-PBGA-B280 | Not Qualified | COMMERCIAL | 7.5 ns | 160 I/O | 1.2 mm | EE PLD | MACROCELL | 16 mm | 16 mm | ||||||||||||||
| Mfr Part No XCR3256XL-7.5CS280C | AMD | Datasheet | 343 | - | Min: 1 Mult: 1 | YES | 280 | 167 MHz | ADVANCED MICRO DEVICES INC | 3 | 160 | 70 °C | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | No | 3.6 V | 3 V | 3.3 V | e0 | TIN LEAD | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B280 | Not Qualified | COMMERCIAL | 7.5 ns | 160 I/O | 1.2 mm | EE PLD | MACROCELL | 16 mm | 16 mm | ||||||||||||||||||
 | Mfr Part No P3Z22V10-DA-T | AMD Xilinx | Datasheet | 456 | - | Min: 1 Mult: 1 | YES | 28 | 80 MHz | XILINX INC | 10 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | 3.63 V | 2.97 V | 3.3 V | PROGRAMMABLE OUTPUT POLARITY; SYNCHRONOUS PRESET; ASYNCHRONOUS RESET | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 28 | S-PQCC-J28 | Not Qualified | COMMERCIAL | 10 ns | 11 DEDICATED INPUTS, 10 I/O | 4.57 mm | EE PLD | MACROCELL | 11 | 11.5062 mm | 11.5062 mm | ||||||||||||||||||
| Mfr Part No P3Z22V10-DA-T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 83 MHz | NXP SEMICONDUCTORS | 10 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Transferred | 3.6 V | 3 V | 3.3 V | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J28 | Not Qualified | COMMERCIAL | 10 ns | 11 DEDICATED INPUTS, 10 I/O | 4.57 mm | EE PLD | MACROCELL | 11 | 11.5062 mm | 11.5062 mm | |||||||||||||||||||||
 | Mfr Part No PALCE610H-15PC | AMD | Datasheet | 400 | - | Min: 1 Mult: 1 | NO | 24 | 50 MHz | ADVANCED MICRO DEVICES INC | 16 | 75 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 16 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET; 2 EXTERNAL CLOCKS | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 24 | R-PDIP-T24 | 16 | Not Qualified | COMMERCIAL EXTENDED | 15 ns | PAL-TYPE | 20 | 4 DEDICATED INPUTS, 16 I/O | 5.08 mm | EE PLD | MACROCELL | 4 | 160 | 30.734 mm | 7.62 mm | ||||||||||
| Mfr Part No PALCE610H-15PC | Vantis Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 76.1 MHz | VANTIS CORP | 16 | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | 16 | Not Qualified | COMMERCIAL | 15 ns | PAL-TYPE | 20 | 4 DEDICATED INPUTS, 16 I/O | EE PLD | MACROCELL | 4 | 160 |
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PZ3064DS10A44
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XH95216-7PQ160C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XCR3384XL-7.5CSG280I
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XCR3384XL-7.5CSG280I
AMD
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC7354-12WC68I
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PAL16R6B-2CJ
Vantis Corporation
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PAL16R6B-2CJ
AMD
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ5128IS15BP
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ5128IS15BP
Philips Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ5128IS15BP
NXP Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PAL14L4NC
Texas Instruments
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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CY7C332-25WC
Cypress Semiconductor
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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M4-64/32-15VC48
Vantis Corporation
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC95180-10HQG208
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XCR3256XL-7.5CS280C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XCR3256XL-7.5CS280C
AMD
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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P3Z22V10-DA-T
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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P3Z22V10-DA-T
NXP Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PALCE610H-15PC
AMD
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PALCE610H-15PC
Vantis Corporation
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire