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Embedded - PLDs (Programmable Logic Device) (2797)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Clock Frequency-Max	Ihs Manufacturer	Moisture Sensitivity Levels	Number of I/O Lines	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Temperature Grade	Propagation Delay	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Screening Level	Output Function	Number of Macro Cells	JTAG BST	Number of Dedicated Inputs	In-System Programmable	Number of Product Terms	Length	Width
Mfr Part No PAL16R8DMJ/883B	AMD	Datasheet	498 In Stock	-	Min: 1 Mult: 1	NO	20	37 MHz	ADVANCED MICRO DEVICES INC			125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP, DIP20,.3	DIP20,.3	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5.5 V	4.5 V	5 V	e0		3A001.A.2.C	TIN LEAD		8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		20	R-GDIP-T20	8	Not Qualified	MILITARY	12 ns	PAL-TYPE	8	8 DEDICATED INPUTS, 0 I/O		OT PLD	38535Q/M;38534H;883B	REGISTERED			8		64
Mfr Part No XH95180-10HQG208I	AMD	Datasheet	-	-	Min: 1 Mult: 1	YES	208		ADVANCED MICRO DEVICES INC	3	168			PLASTIC/EPOXY	HFQFP	HEAT SINK, QFP-208		SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	Obsolete		Yes			5 V	e3			MATTE TIN			QUAD	GULL WING	245	0.5 mm	compliant	30		S-PQFP-G208		Not Qualified					0 DEDICATED INPUTS, 168 I/O	4.1 mm	MASK PLD		MACROCELL						28 mm	28 mm
Mfr Part No P3Z22V10-DDH	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	24	80 MHz	XILINX INC			70 °C		PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP24,.25	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete		No			3.3 V	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	DUAL	GULL WING		0.635 mm	unknown			R-PDSO-G24	10	Not Qualified	COMMERCIAL	10 ns	PAL-TYPE	22			EE PLD		MACROCELL					132
Mfr Part No P3Z22V10-DDH	NXP Semiconductors	Datasheet	-	-	Min: 1 Mult: 1	YES	24	83 MHz	NXP SEMICONDUCTORS		10	70 °C		PLASTIC/EPOXY	TSSOP	4.40 MM, PLASTIC, SOT-355-1, TSSOP-24	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	TSSOP		3.6 V	3 V	3.3 V						8542.39.00.01	DUAL	GULL WING		0.65 mm	unknown		24	R-PDSO-G24		Not Qualified	COMMERCIAL	10 ns			11 DEDICATED INPUTS, 10 I/O	1.1 mm	EE PLD		MACROCELL			11			7.8 mm	4.4 mm
Mfr Part No 5962-87539023A	Teledyne e2v	Datasheet	-	-	Min: 1 Mult: 1	YES	28	25 MHz	TELEDYNE E2V (UK) LTD		10	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	WQCCN		LCC28,.45SQ	SQUARE	CHIP CARRIER, WINDOW	Active			5.5 V	4.5 V	5 V	e0		3A001.A.2.C	TIN LEAD	10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS	8542.39.00.01	QUAD	NO LEAD		1.27 mm	compliant			S-CQCC-N28	10	Qualified	MILITARY	30 ns	PAL-TYPE	22	11 DEDICATED INPUTS, 10 I/O	2.8956 mm	UV PLD	38535Q/M;38534H;883B	MACROCELL			11		132	11.43 mm	11.43 mm
Mfr Part No 5962-87539023A	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	28	25 MHz	CYPRESS SEMICONDUCTOR CORP		10	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	WQCCN	WQCCN,		SQUARE	CHIP CARRIER, WINDOW	Obsolete	QLCC		5.5 V	4.5 V	5 V	e0		3A001.A.2.C	TIN LEAD	10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS	8542.39.00.01	QUAD	NO LEAD		1.27 mm	unknown		28	S-CQCC-N28		Not Qualified	MILITARY	30 ns			11 DEDICATED INPUTS, 10 I/O	2.8956 mm	UV PLD		MACROCELL			11			11.43 mm	11.43 mm
Mfr Part No PZ3128IS12BP-T	NXP Semiconductors	Datasheet	-	-	Min: 1 Mult: 1	YES	100	66 MHz	NXP SEMICONDUCTORS		80	85 °C	-40 °C	PLASTIC/EPOXY	TFQFP	TFQFP,		SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	Transferred			3.6 V	3 V	3.3 V						8542.39.00.01	QUAD	GULL WING		0.5 mm	unknown			S-PQFP-G100		Not Qualified	INDUSTRIAL	14.5 ns			2 DEDICATED INPUTS, 80 I/O	1.2 mm	EE PLD		MACROCELL			2			14 mm	14 mm
Mfr Part No PZ3128IS12BP-T	AMD Xilinx	Datasheet	634 In Stock	-	Min: 1 Mult: 1	YES	100	69 MHz	XILINX INC		80	85 °C	-40 °C	PLASTIC/EPOXY	TFQFP	TFQFP,		SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	Obsolete	QFP		3.63 V	2.97 V	3.3 V					128 MACROCELLS	8542.39.00.01	QUAD	GULL WING		0.5 mm	unknown		100	S-PQFP-G100		Not Qualified	INDUSTRIAL	14.5 ns			2 DEDICATED INPUTS, 80 I/O	1.2 mm	EE PLD		MACROCELL			2			14 mm	14 mm
Mfr Part No XC7272-30WC84I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	84		XILINX INC			85 °C	-40 °C	CERAMIC	QCCJ		LDCC84,1.2SQ	SQUARE	CHIP CARRIER	Obsolete		No			5 V					NO	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown			S-XQCC-J84		Not Qualified	INDUSTRIAL	48 ns					UV PLD			72	NO		NO
Mfr Part No XC7272A-16WC84I	AMD Xilinx	Datasheet	524 In Stock	-	Min: 1 Mult: 1	YES	84	55 MHz	XILINX INC	1	42	85 °C	-40 °C	CERAMIC, METAL-SEALED COFIRED	WQCCJ	WQCCJ, LDCC84,1.2SQ	LDCC84,1.2SQ	SQUARE	CHIP CARRIER, WINDOW	Obsolete	QFJ	No	5.5 V	4.5 V	5 V					PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		84	S-CQCC-J84		Not Qualified	INDUSTRIAL	25 ns			12 DEDICATED INPUTS, 42 I/O	4.826 mm	UV PLD		MACROCELL	72	NO	12	NO		29.21 mm	29.21 mm
Mfr Part No PZ5032-6A44-T	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	44	105 MHz	XILINX INC		32	70 °C		PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	LPCC		5.25 V	4.75 V	5 V					32 MACROCELLS	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		Not Qualified	COMMERCIAL	8 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD		MACROCELL			2			16.5862 mm	16.5862 mm
Mfr Part No AMPAL16H8LDC	AMD	Datasheet	78 In Stock	-	Min: 1 Mult: 1	NO	20		ADVANCED MICRO DEVICES INC		6	75 °C		CERAMIC, GLASS-SEALED	DIP	DIP, DIP20,.3	DIP20,.3	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5.25 V	4.75 V	5 V	e0			TIN LEAD		8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		20	R-GDIP-T20	8	Not Qualified	COMMERCIAL EXTENDED	35 ns	PAL-TYPE	16	10 DEDICATED INPUTS, 6 I/O		OT PLD		COMBINATORIAL			10		64
Mfr Part No PZ5128NS10BE	Philips Semiconductors	Datasheet	-	-	Min: 1 Mult: 1	YES	128		PHILIPS SEMICONDUCTORS			85 °C	-40 °C	PLASTIC/EPOXY	QFP		QFP128,.63X.87,20	RECTANGULAR	FLATPACK	Transferred		No			5 V	e0			Tin/Lead (Sn/Pb)	YES	8542.39.00.01	QUAD	GULL WING		0.5 mm	unknown			R-PQFP-G128		Not Qualified	INDUSTRIAL	12 ns					EE PLD			128	YES		YES
Mfr Part No EPM2210F324I4N	Altera Corporation	Datasheet	240 In Stock	-	Min: 1 Mult: 1	YES	324		ALTERA CORP	3	272			PLASTIC/EPOXY	BGA	BGA, BGA324,18X18,40	BGA324,18X18,40	SQUARE	GRID ARRAY	Transferred	BGA	Yes	2.625 V	2.375 V	2.5 V	e1	Yes	3A991.D	TIN SILVER COPPER	IT CAN ALSO OPERATE AT 3.3V	8542.39.00.01	BOTTOM	BALL	245	1 mm	compliant		324	S-PBGA-B324		Not Qualified		9.1 ns			0 DEDICATED INPUTS, 272 I/O	2.2 mm	FLASH PLD		MACROCELL	1700	YES		YES		19 mm	19 mm
Mfr Part No EPM2210F324I4N	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	324	172.4 MHz	INTEL CORP		272	100 °C	-40 °C	PLASTIC/EPOXY	BGA	19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324	BGA324,18X18,40	SQUARE	GRID ARRAY	Active		Yes	2.625 V	2.375 V	2.5 V	e1		3A991.D	TIN SILVER COPPER	IT CAN ALSO OPERATE AT 3.3V	8542.39.00.01	BOTTOM	BALL		1 mm	compliant			S-PBGA-B324	272	Not Qualified		9.1 ns		272	0 DEDICATED INPUTS, 272 I/O	2.2 mm	FLASH PLD		MACROCELL	1700	YES		YES		19 mm	19 mm
Mfr Part No XH95432-10HQ304C	AMD Xilinx	Datasheet	592 In Stock	-	Min: 1 Mult: 1	YES	304		XILINX INC	3	232			PLASTIC/EPOXY	HFQFP	HEAT SINK, QFP-304		SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	Transferred	QFP	No			5 V	e0	No	3A991.D	TIN LEAD		8542.39.00.01	QUAD	GULL WING		0.5 mm	compliant		304	S-PQFP-G304		Not Qualified					0 DEDICATED INPUTS, 232 I/O	4.5 mm	MASK PLD		MACROCELL						40 mm	40 mm
Mfr Part No 5962-8983904RA	Teledyne e2v	Datasheet	-	-	Min: 1 Mult: 1	NO	20	58.8 MHz	TELEDYNE E2V (UK) LTD		8	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP		DIP20,.3	RECTANGULAR	IN-LINE	Active			5.5 V	4.5 V	5 V	e0		3A001.A.2.C	TIN LEAD	1 EXTERNAL CLOCK; REGISTER PRELOAD	8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	compliant			R-GDIP-T20	8	Qualified	MILITARY	10 ns	PAL-TYPE	18	8 DEDICATED INPUTS, 8 I/O	5.08 mm	EE PLD	38535Q/M;38534H;883B	MACROCELL			8		64	25.27 mm	7.62 mm
Mfr Part No PEEL18LV8ZJ-25L	Anachip Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	20	33.3 MHz	ANACHIP CORP			70 °C		PLASTIC/EPOXY	QCCJ	QCCJ, LDCC20,.4SQ	LDCC20,.4SQ	SQUARE	CHIP CARRIER	Transferred		Yes									8542.39.00.01	QUAD	J BEND	260	1.27 mm	unknown			S-PQCC-J20	8	Not Qualified	COMMERCIAL	30 ns	PAL-TYPE	18			EE PLD		MACROCELL					113
Mfr Part No PEEL18LV8ZJ-25L	Diodes Incorporated	Datasheet	-	-	Min: 1 Mult: 1	YES	20	25 MHz	DIODES INC	3	10	70 °C		PLASTIC/EPOXY	QCCJ	LEAD FREE, PLASTIC, LCC-20	LDCC20,.4SQ	SQUARE	CHIP CARRIER	Obsolete	QLCC	Yes	3.6 V	2.7 V	3 V	e3		EAR99	MATTE TIN		8542.39.00.01	QUAD	J BEND	260	1.27 mm	unknown		20	S-PQCC-J20	8	Not Qualified	COMMERCIAL	25 ns	PAL-TYPE	18	7 DEDICATED INPUTS, 10 I/O	4.369 mm	EE PLD		MACROCELL			7		113	8.9662 mm	8.9662 mm
Mfr Part No EPM5128AGC-20	Altera Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	68	66.7 MHz	ALTERA CORP	1	52	70 °C		CERAMIC, METAL-SEALED COFIRED	WPGA	WPGA, PGA68,11X11	PGA68,11X11	SQUARE	GRID ARRAY, WINDOW	Obsolete	PGA	No	5.25 V	4.75 V	5 V	e0	No		TIN LEAD	LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK	8542.39.00.01	PERPENDICULAR	PIN/PEG	220	2.54 mm	unknown		68	S-CPGA-P68		Not Qualified	COMMERCIAL	33 ns			7 DEDICATED INPUTS, 52 I/O	3.81 mm	UV PLD		MACROCELL	128	NO	7	NO		27.94 mm	27.94 mm