The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Material | Dielectric Material | Housing Material | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Contact Sizes | Data Converters | Data RAM Size | Data RAM Type | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rating AC | Voltage Rating DC | Voltage-Input | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Type | Number of Positions | Max Operating Temperature | Min Operating Temperature | Color | Applications | Gender | Power (Watts) | Capacitance | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Operating Frequency | Efficiency | Housing Color | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Lead Spacing | Power Supplies | Temperature Grade | Note | Interface | Memory Size | Oscillator Type | Current - Output (Max) | Load Capacitance | Connector Style | Speed | RAM Size | Operating Mode | Shell Size, MIL | Voltage - Supply (Vcc/Vdd) | Core Processor | Frequency Tolerance | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Output Power | Cable Opening | Voltage - Output | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Includes | Core Architecture | EEPROM Size | Form | Speed Grade | Convert From (Adapter End) | Convert To (Adapter End) | Sensitivity | Number of ADC Channels | Housing Finish | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Number of Positions (Convert From) | Orientation (Convert From) | Shell Size - Insert (Convert From) | Orientation (Convert To) | Number of Positions (Convert To) | Features | Shell Size - Insert (Convert To) | Product Category | Device Core | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating | REACH SVHC | Flammability Rating | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XAZU3EG-1SBVA484Q | AMD | Datasheet | 462 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XAZU3 | AMD | 128 | Tray | Active | -40°C ~ 125°C (TJ) | * | Active | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2LSEVSVA2197 | AMD | Datasheet | 634 | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C3E3E | Intel | Datasheet | 583 |
| Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1LSEVFVC1760 | AMD | Datasheet | 547 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Glenair | 378 | Retail Package | Active | 0°C ~ 100°C (TJ) | * | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS025T-1FCSG325T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 325-TFBGA | - | 325-BGA (11x11) | Thermoplastic | YAA | Amphenol LTW | MCU - 102, FPGA - 80 | Bulk | Active | - | - | M12 | Threaded | - | Unshielded | IP68 - Dust Tight, Waterproof | - | Distributor Y-Shaped | - | 230.4KB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | Male Pins | Female Sockets (2) | - | FPGA - 23K Logic Modules | 128KB | 6 | A | M12 | A | 6 (2) | Coupling Nut | M12 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MSCMMX6QZDK08AB1G0A | NXP | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | Bulkhead - Rear Side Nut | Zinc Alloy | Polyamide (PA), Nylon, Glass Filled | - | M12D-04PMMS | Gold | Copper Alloy | Amphenol LTW | Bulk | Metal | Active | 250V | -40°C ~ 105°C | M | Solder Cup | Receptacle, Male Pins | 4 | Silver | - | Threaded | 4A | D | Unshielded | IP68/IP69K - Dust Tight, Water Resistant, Waterproof | Nickel | M12-4 | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U19C8SN | ALTERA | Datasheet | 8068 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 484 | 484-UBGA (19x19) | 484 | INTEL CORP | Intel Corporation | 5CSEBA2U19C8SN | Suntsu Electronics, Inc. | MCU - 151, FPGA - 66 | 85 °C | Bulk | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | NOT SPECIFIED | 2.04 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 85°C | Tray | SXT214 | 0.079 L x 0.063 W (2.00mm x 1.60mm) | Active | MHz Crystal | 85 °C | 0 °C | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 48 MHz | ±30ppm | S-PBGA-B484 | 66 | Not Qualified | 1.1 V | 60 Ohms | 1.1,1.2/3.3,2.5 V | OTHER | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 8pF | 600MHz | 64KB | Fundamental | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | ±25ppm | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 0.020 (0.50mm) | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC32MZ1025W104132-I/NX | Microchip | Datasheet | 285 | - | Min: 1 Mult: 1 | Surface Mount | DQFN-132 | 132-VQFN (10x10) | PIC32MZ1025 | Microchip Technology / Atmel | A/D 20x12b SAR | 256 kB | SRAM | 168 | CAN, I2C, SPI, UART | Microchip | 80 MHz | 54 Mbps | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | MSL 3 - 168 hours | 64 I/O | Tray | Active | 88 mA | 287 mA | 3.63 V | 2.97 V | -40°C ~ 85°C (TA) | Tray | PIC® 32MZ | Wi-Fi | Wireless & RF Integrated Circuits | Si | 2.4 GHz | CAN, Ethernet, I2C, I2S, SPI, UART, USB | Internal | 200MHz | 256K x 8 | 2.97V ~ 3.63V | MIPS32® M-Class | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | Flash | 32-Bit Single-Core | 1MB | CANbus, Ethernet, I²C, IrDA, SPI, SQI, UART/USART, USB OTG | 21.5 dBm | 32bit | RF System on a Chip - SoC | - | - 76 dBm | 20 Channel | RF System on a Chip - SoC | PIC32 MZ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-CSG288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | External | 288-TFBGA, CSPBGA | 288-CSP (11x11) | ABS | ABS | A2F200 | Microchip Technology | MCU - 31, FPGA - 78 | Tray | Active | Compliant | -40°C ~ 100°C (TJ) | SmartFusion® | Grey | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 80 mm | No SVHC | UL94 HB | IP65 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-L2FFVH1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Glenair | 574 | Retail Package | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FFVH1760E | AMD | Datasheet | 468 |
| Min: 1 Mult: 1 | Through Hole | Radial | 1760-FCBGA (42.5x42.5) | Polyester, Metallized | -- | AMD | 574 | Tray | Active | 160V | 250V | -55°C ~ 105°C | Bulk | MKT369 | 0.492 L x 0.173 W (12.50mm x 4.40mm) | ±10% | Active | -- | PC Pins | General Purpose | 0.082µF | 0.394 (10.00mm) | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Long Life | 0.370 (9.40mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XA7Z030-1FBG484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 484-BBGA, FCBGA | - | Circular | Zinc Die Cast | 484-FCBGA (23x23) | Polyamide (PA66), Nylon 6/6 | MB1JJN | 1.0mm (5), 2.0mm (4) | Amphenol Sine Systems Corp | 130 | Bulk | Active | -20°C ~ 130°C | MotionGrade™ M23 Power Standard Series, Threaded | Receptacle Housing | For Male Pins | 9 (5 + 3 Power + PE) | Threaded | Crimp | Keyed | Shielded | IP67 - Dust Tight, Waterproof | Nickel | M23-9 | Silver | Contacts Not Included | 667MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Kintex™-7 FPGA, 125K Logic Cells | - | - | UL94 V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF050-1VG400M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | -- | Circular | Aluminum Alloy | Plastic | 22D | -- | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series I, DJT | Active | -- | Plug Housing | For Female Sockets | 128 | Bayonet Lock | Crimp | N (Normal) | Shielded | Environment Resistant | Chromate over Cadmium | 25-35 | Olive Drab | Contacts Not Included | -- | -- | Coupling Nut | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R16A2E4X | Intel | Datasheet | 620 | - | Min: 1 Mult: 1 | Panel Mount, Through Hole | - | Flange | Aluminum | - | Gold | Copper Alloy | Glenair | 384 | Retail Package | Metal | Active | -65°C ~ 175°C | 806 | Solder | Receptacle, Female Sockets | Olive Drab | Threaded | B | Olive Drab Cadmium | 24-20A | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R24C2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Glenair | 744 | Retail Package | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L1FFVE1156I | Xilinx | Datasheet | 72 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AUTEC POWER SYSTEMS | 366 | Case | Active | 100 ~ 240 VAC | -40°C ~ 100°C (TJ) | DT030GS (30W) | ITE (Commercial) | 30 W | Level VI | 536mA | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 56V | MCU, FPGA | Desktop | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FFVE1156E | Xilinx | Datasheet | 160 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | CIR06 | ITT Cannon, LLC | 366 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H2F34E1HG | ALTERA | Datasheet | 744 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H2F34E1HG | 1.2 GHz | + 100 C | 0 C | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 973530 | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3384MKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | Broadcom Limited | Tray | Obsolete | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No I.MX 6QUAD / MCIMX6Q6AVT10AE | NXP | Datasheet | - | - | Min: 1 Mult: 1 | Non-Compliant | Female |
-
XAZU3EG-1SBVA484Q
AMD
Package:Embedded - System On Chip (SoC)
981.154923
-
XCVM1502-2LSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA006R24C3E3E
Intel
Package:Embedded - System On Chip (SoC)
6,529.695847
-
XCVM1502-1LSEVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS025T-1FCSG325T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MSCMMX6QZDK08AB1G0A
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA2U19C8SN
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
PIC32MZ1025W104132-I/NX
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-CSG288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-L2FFVH1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-2FFVH1760E
AMD
Package:Embedded - System On Chip (SoC)
30,494.787245
-
XA7Z030-1FBG484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPF050-1VG400M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA006R16A2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB027R24C2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-L1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-2FFVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS066H2F34E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
5,102.018535
-
BCM3384MKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
I.MX 6QUAD / MCIMX6Q6AVT10AE
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire