The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Weight | Insert Material | Backshell Material, Plating | Base Product Number | Contact Finish Mating | Contact Materials | Contact Sizes | Data Converters | Data RAM Size | I/O Voltage | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Mfr | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Package | Primary Material | Processing Unit | Product Status | RoHS | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Termination | Connector Type | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Color | Applications | Power (Watts) | Fastening Type | Contact Type | Current Rating (Amps) | Orientation | Shielding | Ingress Protection | Shell Finish | Pin Count | Shell Size - Insert | Termination Style | Number of Outputs | Approval Agency | Efficiency | Voltage - Isolation | Voltage - Input (Max) | Housing Color | Operating Supply Voltage | Voltage - Input (Min) | Note | Interface | Oscillator Type | Current - Output (Max) | Speed | RAM Size | Shell Size, MIL | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Cable Opening | Voltage - Output | Topology | Architecture | Data Bus Width | Includes | EEPROM Size | Screening Level | Dimming | Primary Attributes | Number of Cores | Flash Size | Features | Device Core | Contact Finish Thickness - Mating | Material Flammability Rating | Radiation Hardening | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCVM1402-1LSIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-1FFVE1156I | AMD | Datasheet | 411 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 1.8/2.5/3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | AMD | 366 | Tray | FPGA/Microcontroller | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5F | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1MLIVSVD1760 | AMD | Datasheet | 711 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 402 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-1UBVA530I | AMD | Datasheet | 500 |
| Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FSVE1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-BQFP | 100-QFP (14x20) | MB90F546 | A/D 8x8/10b | Infineon Technologies | 81 | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | F²MC-16LX MB90545G | External | 16MHz | 8K x 8 | 4.5V ~ 5.5V | F²MC-16LX | POR, WDT | FLASH | 16-Bit | 256KB (256K x 8) | CANbus, EBI/EMI, SCI, Serial I/O, UART/USART | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FCS325 | Microchip | Datasheet | 1934 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Free Hanging (In-Line) | 325-TFBGA, FCBGA | - | Circular | Aluminum | 325-FCBGA (11x11) | - | D38999/26ZA | 22D | 64 kB | - | - | 166 MHz | Amphenol Aerospace Operations | 200 | 56520 LE | Bulk | Active | Non-Compliant | -65°C ~ 175°C | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Plug Housing | For Female Sockets | 6 | Threaded | Crimp | A | Shielded | Environment Resistant | Zinc Nickel | 9-35 | Black | Contacts Not Included | 166MHz | 64KB | A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | FPGA - 60K Logic Modules | 1 Core | 256KB | Coupling Nut, Self Locking | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-1FSVH1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | - | Aluminum Alloy | 1760-FCBGA (42.5x42.5) | Rubber | - | FRCIR | Gold | Copper Alloy | RISC | JTAG | Yes | ITT Cannon, LLC | 6 | 574 | Bulk | Metal | Active | Industrial grade | 500VAC, 700VDC | -40°C ~ 125°C | CIR | Crimp | Plug, Male Pins | 35 | Black | Aerospace, Medical, Military | Bayonet Lock | 13A | W | Shielded | Environment Proof | Black Anodized | 1760 | 28-15 | 0.85 V | JTAG | 500MHz, 1.2GHz | 38 Mb | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.610 ~ 0.937 (15.49mm ~ 23.80mm) | MCU, FPGA | 32 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Backshell, Cable Clamp, Coupling Nut, Flame Retardant | Arm Cortex A53/Arm Cortex R5 | - | Flame Retardant | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FFVE1156E | AMD | Datasheet | 640 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | 366 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FG484I | Microchip | Datasheet | 2264 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S060 | 64 kB | - | - | 166 MHz | Mallory Sonalert Products Inc. | 267 | 56520 LE | Bulk | Active | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L2FFVE1156I | AMD | Datasheet | 414 |
| Min: 1 Mult: 1 | Chassis Mount | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 1.7 lbs (771.1 g) | LXV76 | Advanced Energy | 366 | Box | Obsolete | -35°C ~ 70°C | LXV76 (76W) | 6.97 L x 2.66 W x 1.46 H (177.0mm x 67.5mm x 37.0mm) | Constant Voltage | 76 W | Wire Leads | 1 | CE, cULus, EN | 89% | 3 kV | 305VAC | 90VAC | 1.81A | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 42V | AC DC Converter | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | OTP, OVP, SCP | IP67 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-VF400 | Microchip | Datasheet | 2104 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 400-LFBGA | Flange | Aluminum Alloy | 400-VFBGA (17x17) | CB2 | Silver | 64 kB | - | - | 166 MHz | ITT Cannon, LLC | 207 | 56520 LE | Bulk | Metal | Active | Non-Compliant | 50V | -55°C ~ 125°C | MIL-DTL-5015, CB | Crimp | Receptacle, Male Pins | 22 | Black | Reverse Bayonet Lock | 22A, 41A | N (Normal) | - | IP67 - Dust Tight, Waterproof | Black Zinc Cobalt | 28-11 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG676I | Microchip | Datasheet | 1649 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | 64 kB | - | - | 166 MHz | PEI-Genesis | 387 | 56520 LE | Bulk | Active | Non-Compliant | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1MSINSVF1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Tape & Reel | Versal™ Prime | 20 % | 1 kΩ | 125 °C | -55 °C | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1MSIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-1SBVA484E | AMD | Datasheet | 1892 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-1SFVA625I | AMD | Datasheet | 1747 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1MSEVFVC1760 | AMD | Datasheet | 782 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1MSIVSVD1760 | AMD | Datasheet | 752 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | -40°C ~ 100°C (TJ) | * | Obsolete | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-2SFVA625E | AMD | Datasheet | 1943 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | Active | 0°C ~ 100°C (TJ) | * | Active | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1MSEVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | Active | 0°C ~ 100°C (TJ) | * | Active | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - |
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XCVM1402-1LSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU42DR-1FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
13,192.121495
-
XCVM1302-1MLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
5,488.501593
-
XCZU3EG-1UBVA530I
AMD
Package:Embedded - System On Chip (SoC)
619.194164
-
XCZU47DR-2FSVE1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1FCS325
Microchip
Package:Embedded - System On Chip (SoC)
168.544896
-
XCZU46DR-1FSVH1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-2FFVE1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
274.408069
-
XCZU48DR-L2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
37,936.510010
-
M2S060-VF400
Microchip
Package:Embedded - System On Chip (SoC)
181.210191
-
M2S060-FG676I
Microchip
Package:Embedded - System On Chip (SoC)
240.194660
-
XCVM1402-1MSINSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1MSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU1CG-1SBVA484E
AMD
Package:Embedded - System On Chip (SoC)
217.316425
-
XCZU1CG-1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-1MSEVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-1MSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
25,336.999168
-
XCZU1CG-2SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1MSEVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire