The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Number of Terminals | Base Product Number | Brand | Case Code - in | Case Code - mm | Class | Clock Frequency-Max | Contact Materials | Degree of protection (IP) | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Mfr | MIL Type | Minimum Operating Temperature | Model | Number of digital inputs | Number of digital outputs | Number of I/Os | Number of Positions / Contacts per Port | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Qualification | Radio standard Bluetooth | Radio standard Wi-Fi 802.11 | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Temperature Coefficient / Code | Type of fastening | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | Termination | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Gender | Power (Watts) | HTS Code | Capacitance | Subcategory | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Base Part Number | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Dielectric | Power Supplies | Temperature Grade | Configuration | Voltage | Memory Size | Number of Ports | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Operating Temperature Range | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Product | Mounting Angle | Features | USOC Codes | Product Category | Height | Height Seated (Max) | Length | Width | Flammability Rating |
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 | Mfr Part No XCVC1502-2MLIVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | 1 | Glenair | + 110 C | - 40 C | Circular Connectors | 800 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2LLEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Glenair | + 110 C | 0 C | Circular Connectors | 700 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U19C7N | ALTERA | Datasheet | 2076 |
| Min: 1 Mult: 1 | 484-FBGA | YES | 484 | 484-UBGA (19x19) | 484 | Glenair | INTEL CORP | Glenair | 5CSEBA5U19C7N | MIL-DTL-38999 | MCU - 151, FPGA - 66 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.55 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | Circular Connectors | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | Circular MIL Spec Connector | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | Connectors | Circular MIL Spec Connector | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB023R25A3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RN732A | KOA Speer Electronics, Inc. | 480 | Tape & Reel (TR) | Obsolete | -55°C ~ 155°C | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±1% | 2 | ±50ppm/°C | 505 Ohms | Thin Film | 0.1W, 1/10W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | Moisture Resistant | 0.024 (0.60mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD019R25A2E4F | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | 110267 | Molex | 480 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FFVE1156I | Xilinx | Datasheet | 960 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Amphenol Commercial Products | 125 | Amphenol | AMD Xilinx | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Reel | Zynq® UltraScale+™ RFSoC | Modular Connectors / Ethernet Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Modular Connectors / Ethernet Connectors | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Modular Connectors / Ethernet Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FFVG1517E | Xilinx | Datasheet | 40 | - | Min: 1 Mult: 1 | 1111 (2828 metric) | 1517-FCBGA (40x40) | ATC / KYOCERA AVX | 1111 | 2828 | 1000 | KYOCERA AVX | + 125 C | AMD Xilinx | - 55 C | 561 | Tray | Active | Details | P90 | 500 V | 0°C ~ 100°C (TJ) | Reel | 100B | 0.25 pF | 90 PPM / C | High Q, Low ESR/ESL Porcelain Superchip Capacitor | 3.9 pF | Capacitors | SMD/SMT | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Silicon RF Capacitors / Thin Film | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | RF/Microwave Multilayer Capacitors (MLC) | Silicon RF Capacitors / Thin Film | 2.59 mm | 2.79 mm | 2.79 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FFVH1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Amphenol Positronic | 5 | Positronic | AMD Xilinx | 574 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | D-Sub Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Mixed Contact D-Sub Connectors | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | D-Sub Mixed Contact Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24D2I2V | Intel | Datasheet | 423 | - | Min: 1 Mult: 1 | - | - | Intel | - | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5CG-1SFVC784E | AMD | Datasheet | 580 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 221050 | Molex | 252 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1CS288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 288 | ITT Cannon | 100 MHz | 1 | MICROSEMI CORP | ITT Cannon | A2F060M3E-1CS288I | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 155523-4500 | Obsolete | 20 | 5.24 | Details | No | 1.575 V | 1.425 V | 1.5 V | e0 | TIN LEAD SILVER | 8542.39.00.01 | Circular Connectors | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B288 | 68 | Not Qualified | 1.5,1.8,2.5,3.3 V | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | Circular MIL Spec Connector | 1536 | 1536 | 60000 | Circular MIL Spec Connector | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FFVG1517E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FFVE1156I | Xilinx | Datasheet | 256 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD Xilinx | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-L2FFG676I | AMD | Datasheet | 435 |
| Min: 1 Mult: 1 | 0805 (2012 metric) | 676-FCBGA (27x27) | XC7Z035 | Vishay / Vitramon | 0805 | 2012 | Class 1 | 1000 | Vishay | + 150 C | AMD | - 55 C | 130 | Tray | Active | AEC-Q200 | N | 500 VDC | -40°C ~ 100°C (TJ) | Reel | VJ....32 | 0.1 pF | Standard | Lead-Bearing Finish MLCCs | 3.3 pF | Capacitors | SMD/SMT | C0G (NP0) | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Ceramic Capacitors | Kintex™-7 FPGA, 275K Logic Cells | - | General Type MLCCs | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 1.45 mm | 2 mm | 1.25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C2I3V | Intel | Datasheet | 437 |
| Min: 1 Mult: 1 | - | - | Advanced Energy | 1 | Advanced Energy | Intel | 576 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | DC-DC Converter | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Non-Isolated DC-DC Converters | FPGA - 764K Logic Elements | - | Non-Isolated DC/DC Converters | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R16A2E3V | Intel | Datasheet | 772 |
| Min: 1 Mult: 1 | Gold | - | - | Thermoplastic polyester | Amphenol Commercial Products | Phosphor Bronze | 450 | Amphenol | + 70 C | Intel | 0 C | 384 | 8P8C | Tray | Active | 0°C ~ 100°C (TJ) | Tray | Agilex F | Magnetic Jack | Black | Jack (Female) | Modular Connectors / Ethernet Connectors | Shielded | Solder Pin | 1x1 | 1 Port | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Modular Connectors / Ethernet Connectors | 0 C to + 70 C | FPGA - 573K Logic Elements | - | Connectors | Right Angle | RJ45 | Modular Connectors / Ethernet Connectors | UL 94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2I1VAA | Intel | Datasheet | 548 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVP1502-2MLEVSVA3340 | AMD | Datasheet | 649 |
| Min: 1 Mult: 1 | 3340-BFBGA | 3340-BGA (55x55) | IP65/IP67 | AMD | Fix mounted | 3 | 3 | 486 | Tray | Active | No | No | With screws | 0°C ~ 100°C (TJ) | Versal® Premium | 56.9 | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | 25.4 | 44.5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L1FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in Triple Quick-Connect, Ground Lug | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | BARKER MICROFARADS INC | AMD Xilinx | 561 | Tray | Active | Y | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | SMD | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | ECE/EXCEL CELL ELECTRONIC CORP | AMD Xilinx | 561 | Tray | Active | Y | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 101.5mm (3.996 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) |
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XCVC1502-2MLIVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-2LLEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA5U19C7N
ALTERA
Package:Embedded - System On Chip (SoC)
216.357128
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AGFB023R25A3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFD019R25A2E4F
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-2FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-1FFVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-2FFVH1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB014R24D2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5CG-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
1,595.717994
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A2F060M3E-1CS288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-1FFVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-2FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z035-L2FFG676I
AMD
Package:Embedded - System On Chip (SoC)
2,451.709992
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AGFA008R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
11,313.939264
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AGFB006R16A2E3V
Intel
Package:Embedded - System On Chip (SoC)
7,108.143585
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AGFB022R31C2I1VAA
Intel
Package:Embedded - System On Chip (SoC)
31,619.351910
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XCVP1502-2MLEVSVA3340
AMD
Package:Embedded - System On Chip (SoC)
33,023.243738
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XCZU47DR-L1FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-1FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire