The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Peripherals
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Case Code - in | Case Code - mm | Colour outer sheath | Connection 1 | Connection 2 | Contact Finish Mating | Contact Materials | Data RAM Size | Degree of protection (IP) | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Illuminated | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Material outer sheath | Maximum Clock Frequency | Maximum DC Current | Maximum DC Resistance | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Nominal cross section conductor | Nominal current | Nominal voltage | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Outer diameter approx. | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Protective conductor | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Spiralized cable | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Temperature resistance | Tradename | Unit Weight | Voltage, Rating | With cord switch | With protective conductor | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | HTS Code | Capacitance | Fastening Type | Subcategory | Power Rating | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Shell Finish | Shell Size - Insert | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Operating Supply Voltage | Lead Spacing | Power Supplies | Temperature Grade | Lead Diameter | Inductance | Interface | Test Frequency | Memory Size | Load Capacitance | Speed | RAM Size | Shell Size, MIL | Core Processor | Number of Poles | Peripherals | Program Memory Size | Connectivity | Cable Opening | Architecture | Number of Inputs | Drive Level | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Operating Temperature Range | ESR | Core Architecture | Output Format | Number of Transceivers | Primary Attributes | Number of Logic Cells | Core Type | Number of Cores | Flash Size | Product | Features | Product Category | Diameter | Height | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating |
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 | Mfr Part No M2S010-1TQ144 | Microchip | Datasheet | 2148 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCG1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | M2S150 | Microchip Technology | 574 | Tray | Active | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160T-FCVG784E | Microchip | Datasheet | 2237 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | - | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MCU - 136, FPGA - 312 | 161000 LE | Tray | Active | 100 V | 0°C ~ 100°C | PolarFire™ | 0.1 % | 100 ppm/°C | 715 Ω | 155 °C | -55 °C | Thin Film | 125 mW | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | 650 µm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS025TS-1FCSG325I | Microchip | Datasheet | 47 |
| Min: 1 Mult: 1 | 325-TFBGA | 325-BGA (11x11) | - | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | MCU - 102, FPGA - 80 | 23000 LE | Tray | Active | -40°C ~ 100°C | - | 1 V | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 23K Logic Modules | 5 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U23I7N | ALTERA | Datasheet | 2296 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 484 | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA2U23I7N | 3 | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2 | Yes | Yes | FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9 | 8542390000 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | Active | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 800 MHz | S-PBGA-B672 | 145 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F27E2SG | ALTERA | Datasheet | 551 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E3F27E2SG | 1.2 GHz | Yes | SMD/SMT | 20000 LAB | 160000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964690 | Active | NOT SPECIFIED | 1.96 | Yes | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 9.819566 oz | Tray | Arria 10 SX 160 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | - | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 160000 | 2 Core | SoC FPGA | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048H2F34I1HG | ALTERA | Datasheet | 519 |
| Min: 1 Mult: 1 | Free Hanging (In-Line) | 1152-BBGA, FCBGA | - | Aluminum | 1152-FBGA (35x35) | Thermoplastic | - | D38999/26FC | Intel / Altera | Gold | Copper Alloy | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048H2F34I1HG | 1.2 GHz | + 100 C | TE Connectivity Deutsch Connectors | - 40 C | Yes | SMD/SMT | 492 | 60000 LAB | 480000 LE | Bulk | 964982 | Active | Metal | Discontinued at Digi-Key | 5.68 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | - | -65°C ~ 200°C | Tray | Military, MIL-DTL-38999 Series III, DTS | Active | Crimp | Plug, Female Sockets | 22 | Silver | Military | Threaded | SOC - Systems on a Chip | 5A | D | Shielded | Environment Resistant | unknown | Nickel | 13-35 | 950 mV | 1.5GHz | 256KB | C | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 480K Logic Elements | 2 Core | -- | Self Locking | SoC FPGA | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FFVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Grey | Other | Other | Other | Other | AMD Xilinx | 1.5 | 6.6 | 380 - 480 | 366 | 10 | Tray | Active | Yes | No | -10 - 55 | No | Yes | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 50 - 60 | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 1.5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVD1760E | AMD | Datasheet | 770 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 308 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2E3VAA | Intel | Datasheet | 628 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1LLINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2.5 mm x 2 mm | 1024-BGA (31x31) | CTS Electronic Components | 3000 | CTS | + 85 C | AMD Xilinx | - 40 C | 316 | Tray | Active | Details | 3.63 V | 2.97 V | -40°C ~ 100°C (TJ) | MouseReel | 625 | Oscillators | 3.6864 MHz | 50 PPM | SMD/SMT | 700 mV | 15 pF | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | HCMOS | Versal™ Prime FPGA, 70k Logic Cells | - | Standard Clock Oscillators | 1 mm | 2.5 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2LSENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2.5 mm x 2 mm | 1024-BGA (31x31) | CTS Electronic Components | 3000 | CTS | + 70 C | AMD Xilinx | - 20 C | 424 | Tray | Active | Details | 3.3 V | 3.3 V | 0°C ~ 100°C (TJ) | Reel | 625 | Oscillators | 30 MHz | 25 PPM | SMD/SMT | 700 mV | 15 pF | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | Versal™ Prime FPGA, 1.2M Logic Cells | - | Standard Clock Oscillators | 1 mm | 2.5 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2MLINFVB1369 | AMD | Datasheet | 781 | - | Min: 1 Mult: 1 | AIRPAX | 3 | Not Illuminated | Sensata | AMD | Panel Mount | 478 | Tray | Active | N | Versal™ Prime | Circuit Breakers | Hook Terminal | Toggle | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 2 Pole | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | Circuit Protectors | Circuit Breakers | 32.53 mm | 45.21 mm | 39.67 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-2MLEVSVA1596 | AMD | Datasheet | 798 | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | AIRPAX | 3 | Not Illuminated | Sensata | + 85 C | AMD | - 40 C | Panel Mount | 500 | Tray | Active | AIRPAX | 3.174657 oz | IAL/IDL/IML/IUL | Hydraulic-Magnetic | Circuit Breakers | Stud | Handle | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 1 Pole | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Magnetic Circuit Breakers | - | Circuit Breakers | Circuit Breakers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-1SBVA484I | AMD | Datasheet | 2024 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU3 | AIRPAX | 3 | Not Illuminated | Sensata | + 85 C | AMD | - 40 C | Panel Mount | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | Circuit Breakers | Push-On | Toggle | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 2 Pole | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | Circuit Breakers | Circuit Breakers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVB1517I | AMD | Datasheet | 425 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU19 | TE Connectivity / AMP | 5000 | TE Connectivity | AMD | 644 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Wire & Cable Management | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Wire Labels & Markers | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | Wire Labels & Markers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM2502-1LSEVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | TE Connectivity / Holsworthy | 0603 | 1608 | 1000 | TE Connectivity | + 155 C | - 55 C | PCB Mount | 6-1879134-0 | Details | 0.000071 oz | 100 V | MouseReel | RN73 | 0.1 % | 10 PPM / C | SMD High Power Precision Resistor | 41.2 kOhms | Resistors | 62.5 mW (1/16 W) | Thin Film | SMD/SMT | 700 mV | Thin Film Resistors | - 55 C to + 155 C | Precision Resistors Thin Film SMD | - | Thin Film Resistors - SMD | 0.45 mm | 1.55 mm | 0.8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2202-1MSESFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 5 mm x 3.2 mm | CTS Electronic Components | 1000 | CTS | + 60 C | - 10 C | SMD/SMT | Details | 0.001764 oz | MouseReel | 445 | 30 PPM | SMD Quartz | Crystals | 24.576 MHz | SMD/SMT | 800 mV | 12 pF | 100 uW | Crystals | 40 Ohms | Crystals | 1.35 mm | 5 mm | 3.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2002-1MSESFVA784 | Xilinx | Datasheet | 1035 | - | Min: 1 Mult: 1 | Cornell Dubilier - CDE | 100 | Cornell Dubilier | + 100 C | 0 C | Details | Bulk | 381LR | 220 uF | Capacitors | 800 mV | Electrolytic Capacitors | Aluminum Electrolytic Capacitors - Snap In | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2202-1LLISFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | J.W. Miller | 50 | Bourns | 24.3 A | 5 mOhms | + 200 C | - 55 C | PCB Mount | Details | 1.404962 oz | Tray | 2300HT | 15 % | Standard | Toroidal | High Current | Inductors, Chokes & Coils | Unshielded | Radial | 700 mV | 0.56 in | 0.066 in | 8.2 uH | 1 kHz | Fixed Inductors | Toroidal | Power Inductors | Power Inductors - Leaded | 32.512 mm | 16.51 mm |
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M2S010-1TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FCG1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS160T-FCVG784E
Microchip
Package:Embedded - System On Chip (SoC)
236.701813
-
MPFS025TS-1FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
76.147823
-
5CSEBA2U23I7N
ALTERA
Package:Embedded - System On Chip (SoC)
134.880231
-
10AS016E3F27E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
893.971526
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10AS048H2F34I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
4,037.716694
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XCZU48DR-1FFVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-2FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB022R31C2E3VAA
Intel
Package:Embedded - System On Chip (SoC)
19,849.841575
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XCVM1302-1LLINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-2LSENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-2MLINFVB1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE1752-2MLEVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3CG-1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
492.388724
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XCZU19EG-2FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
8,519.509152
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XCVM2502-1LSEVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE2202-1MSESFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE2002-1MSESFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE2202-1LLISFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire