The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Material | Shape | Number of Terminals | Approvals | Base Product Number | Brand | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part # Aliases | Part Life Cycle Code | Processing Unit | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Usage Level | Voltage Rating AC | Voltage Rating DC | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Type | Number of Positions | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Time@Peak Reflow Temperature-Max (s) | Pin Count | Contact Finish | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Output Type | Panel Cutout Dimensions | Power Supplies | Temperature Grade | Plating | Attachment Method | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Size | Connectivity | Input Type | Voltage - Output | Family | Number of Decks | Architecture | Number of Inputs | Operating Force | Seated Height-Max | Programmable Logic Type | Size | Product Type | Contact Timing | Screening Level | Index Stops | Circuit per Deck | Depth Behind Panel | Speed Grade | Number of Poles per Deck | Angle of Throw | Convert From (Adapter End) | Convert To (Adapter End) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Constant Current Load - Max | Features | Product Category | Height | Length | Width | Plating Thickness | Actuator Length |
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![]() | Mfr Part No XCZU4EV-1SFVC784I | AMD | Datasheet | 704 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | Pfannenberg | 31008805000 | 0.892 V | AMD | 0.808 V | 252 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU17EG-2FFVE1924I | AMD | Datasheet | 567 |
| Min: 1 Mult: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | XCZU17 | PILZ | 313902 | 0.892 V | AMD | 0.808 V | 668 | Tray | Active | 0.85 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 1924 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5CG-2FBVB900E | AMD | Datasheet | 600 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | CE, CSA, UL | XCZU5 | Cutler Hammer, Div of Eaton Corp | PDG53K0800E2NM | AMD | Panel | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 800 A | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-VF400 | Microchip | Datasheet | 1931 | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S025 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S025-VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 207 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5EG-2SFVC784E | AMD | Datasheet | 646 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU17EG-3FFVB1517E | AMD | Datasheet | 507 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU17 | AMD | 644 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090T-FG676I | Microchip | Datasheet | 2129 |
| Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090T-FG676I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.83 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | 1500 | e0 | Active | Panel Mount | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 120VAC | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | Not Qualified | Terminals | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Terminals | 120VAC, 140VAC | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 8.810 L x 7.250 W x 13.000 H (223.77mm x 184.15mm x 330.20mm) | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 15A (2.1kVA) | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU49DR-1FFVF1760E | AMD | Datasheet | 446 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | Active | 0°C ~ 100°C (TJ) | * | Active | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060TS-FCSG325I | Microchip | Datasheet | 2282 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | Rectangle | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-FCSG325I | 166 MHz | Microchip Technology | 3 | 200 | 56520 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | -- | e1 | Active | Fabric Over Foam | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | -- | Adhesive | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 0.079 (2.00mm) | 18.000 (457.20mm) | 0.161 (4.10mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU43DR-1FSVG1517I | AMD | Datasheet | 595 |
| Min: 1 Mult: 1 | Panel Mount | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Silver Alloy | AMD | 561 | Tray | Active | 115V | 28V | -40°C ~ 100°C (TJ) | 44 | Active | 2 | 5A (AC), 1A (DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1 | MCU, FPGA | 5.761 ~ 83gfm | Non-Shorting (BBM) | Fixed | SPDT | 26.04mm | 1 | 45° | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Shaft and Panel Sealed | 11.10mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250T-1FCVG484EES | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Silver Alloy | Microchip Technology | MCU - 136, FPGA - 372 | Tray | Active | 115V | 28V | 0°C ~ 100°C | 44 | Active | 10 | 1A (AC/DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | 1 | MPU, FPGA | 5.761 ~ 83gfm | Shorting (MBB) | Fixed | SP10T | 26.04mm | 1 | 30° | FPGA - 254K Logic Modules | 128kB | Shaft and Panel Sealed | 11.10mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050TS-VFG400 | Microchip | Datasheet | 1760 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S050 | Silver Alloy | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050TS-VFG400 | 166 MHz | Microchip Technology | 3 | 207 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 5.82 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 115V | 28V | 0°C ~ 85°C (TJ) | 44 | e1 | Active | 5 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 5A (AC), 1A (DC) | 40 | -- | Solder Lug | S-PBGA-B400 | 207 | Not Qualified | Flatted (6.35mm Dia) | -- | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 4 | MCU, FPGA | 207 | 5.761 ~ 83gfm | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | Shorting (MBB) | Fixed | SP5T | 52.40mm | 1 | 45° | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | -- | 17 mm | 17 mm | 11.10mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MSCMMX6XYCM08AA | NXP | Datasheet | - | - | Min: 1 Mult: 1 | NXP SEMICONDUCTORS | NXP Semiconductors | MSCMMX6XYCM08AA | Surface Mount | , | BGA | Obsolete | Microprocessor | Yes | No | 5.77 | Industrial grade | 8542.31.00.01 | unknown | 265 | MICROPROCESSOR, RISC | MSCMMX6XYCM08 | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU4CG-1SFVC784E | AMD | Datasheet | 748 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU2CG-2SFVA625E | AMD | Datasheet | 291 | - | Min: 1 Mult: 1 | Panel Mount, Bulkhead | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU2 | AMD | 180 | Tray | Active | 0°C ~ 100°C (TJ) | USBF TV | Active | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | USB - A, Receptacle | USB - A, Receptacle | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-L1FFVC900I | AMD | Datasheet | 708 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | AMD | 204 | Bulk | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA022R31C2E3VAA | Intel | Datasheet | 472 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H2F35E2SG | ALTERA | Datasheet | 440 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032H2F35E2SG | 1.2 GHz | Yes | SMD/SMT | 384 | 40000 LAB | 320000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964856 | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057N2F40I2SG | ALTERA | Datasheet | 556 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057N2F40I2SG | 1.2 GHz | Yes | SMD/SMT | 588 | 71250 LAB | 570000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | 965096 | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 588 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E3F29I2SG | ALTERA | Datasheet | 698 |
| Min: 1 Mult: 1 | FBGA-780 | YES | 780 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E3F29I2SG | 1.2 GHz | Yes | SMD/SMT | 288 | 27500 LAB | 220000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964921 | Active | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm |
XCZU4EV-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
1,408.651033
XCZU17EG-2FFVE1924I
AMD
Package:Embedded - System On Chip (SoC)
9,301.862225
XCZU5CG-2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
2,911.800889
M2S025-VF400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU5EG-2SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
2,356.280211
XCZU17EG-3FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
8,393.581110
M2S090T-FG676I
Microchip
Package:Embedded - System On Chip (SoC)
443.655242
XCZU49DR-1FFVF1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060TS-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU43DR-1FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
22,736.741350
MPFS250T-1FCVG484EES
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050TS-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
224.119113
MSCMMX6XYCM08AA
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU4CG-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
1,011.003111
XCZU2CG-2SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU9CG-L1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
3,604.659554
AGFA022R31C2E3VAA
Intel
Package:Embedded - System On Chip (SoC)
22,347.165635
10AS032H2F35E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
2,305.032975
10AS057N2F40I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
6,433.216615
10AS022E3F29I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,349.933050
