The category is 'Embedded - System On Chip (SoC)'
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Series | JESD-609 Code | Pbfree Code | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of Logic Cells | Flash Size | Length | Width |
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![]() | Mfr Part No XCVM1302-1MLIVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE1752-1LLINSVG1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1802-1LSIVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1802-1MSEVIVA1596 | AMD | Datasheet | 595 |
| Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-2MLIVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-1MSINBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU57DR-L2FFVE1156I | AMD | Datasheet | 554 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU57DR-L2FSVE1156I | AMD | Datasheet | 509 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-1MSIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 402 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE1752-1LLIVSVA2197 | AMD | Datasheet | 445 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE1752-1LSEVSVA2197 | AMD | Datasheet | 771 | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-2LSENSVF1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050S-1VF400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S100T-FC1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | Microsemi Corporation | M2S100T-FC1152 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm | |||||||||||||||||||||||
![]() | Mfr Part No M2S090S-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 676 | MICROSEMI CORP | Microsemi Corporation | M2S090S-1FG676I | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.83 | No | 1.26 V | 1.14 V | 1.2 V | No | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 676 | S-PBGA-B676 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090S-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S100T-FCG1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | Microsemi Corporation | M2S100T-FCG1152 | 4 | 85 °C | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm | ||||||||||||||||||||||||
![]() | Mfr Part No M2S010T-1FGG484M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | Microchip Technology | 233 | Tray | Active | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S100T-1FCG1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | Microsemi Corporation | M2S100T-1FCG1152 | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm | ||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-FGG256I | Microchip | Datasheet | 2169 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB |
XCVM1302-1MLIVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE1752-1LLINSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1802-1LSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1802-1MSEVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
17,540.319056
XCVM1302-2MLIVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-1MSINBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU57DR-L2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU57DR-L2FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
22,548.679933
XCVM1302-1MSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE1752-1LLIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
30,562.424301
XCVE1752-1LSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-2LSENSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050S-1VF400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S100T-FC1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S090S-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S090S-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S100T-FCG1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010T-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S100T-1FCG1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-FGG256I
Microchip
Package:Embedded - System On Chip (SoC)
133.596184
