The category is 'Embedded - System On Chip (SoC)'
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- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Resistive Material | Base Product Number | Body Orientation | Contact Classification | Contact Materials | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Mounting Styles | Number of I/Os | Operating Temp Range | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Depth (mm) | Product Diameter (mm) | Product Status | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shell Size / Insert Arrangement | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Voltage Rated | Voltage Rating (DC) | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Gender | Power (Watts) | Capacitance | Power Rating | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Base Part Number | Output | Termination Style | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Number of Contacts | Actuator Type | Contact Gender | Lead Spacing | Temperature Grade | Current - Supply (Disable) (Max) | Interface | Number of Ports | Speed | RAM Size | Lead Style | Core Processor | Peripherals | Connectivity | Family | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Bushing Thread | Adjustment Type | Number of Turns | Taper | Speed Grade | Built in Switch | Absolute Pull Range (APR) | Actuator Diameter | Primary Attributes | Rotation | Number of CLBs | Shell Plating | Number of Logic Cells | Number of Gangs | Resistance (Ohms) | Flash Size | Features | Strain Relief | Product Length (mm) | Height Seated (Max) | Length | Width | Thickness (Max) | Actuator Length | Product Height (mm) | Ratings |
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 | Mfr Part No STID337CYCB | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | 24 | Straight | 24Signal | Beryllium Copper | Cable | -55C to 200C | Not Required(mm) | 49.86(mm) | No | 24-28 | Crimp | 250VDC/200VAC | Circular | PL | 24(POS) | PIN | 1(Port) | MS | Electroless Nickel | No | 53.98(mm) | Not Required(mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXFB5H4F40C4N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXFB5H4F40C4N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXFB5 | S-PBGA-B1517 | 540 | COMMERCIAL EXTENDED | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No GUT3100 S LKJU | Intel | Datasheet | - | - | Min: 1 Mult: 1 | EDAC Inc. | Bulk | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24B2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM47622LA1KFEBG | AVAGO | Datasheet | - | - | Min: 1 Mult: 1 | 200 V | 500 mW | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FSVG1517E | Xilinx | Datasheet | 288 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-2FFG900E | AMD | Datasheet | 435 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z045 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R31C2E2VAA | Intel | Datasheet | 719 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1LLIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | RAM, SRAM | AMD | 692 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Versal™ AI Core | 85 °C | -40 °C | Parallel | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-1SFVC784I | AMD | Datasheet | 511 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU3 | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-2FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB019R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R31C2E2VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0402 (1005 Metric) | - | VJ0402 | Vishay Vitramon | 720 | Tape & Reel (TR) | Active | 50V | -55°C ~ 125°C | VJ HIFREQ | 0.040 L x 0.020 W (1.02mm x 0.51mm) | ±0.25pF | C0G, NP0 | RF, Microwave, High Frequency | 8.2 pF | - | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | High Q, Low Loss | - | 0.024 (0.61mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2LSEVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 100026 | Molex | 692 | Bulk | Last Time Buy | 0°C ~ 100°C (TJ) | * | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FSVG1517E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Active | 0°C ~ 100°C (TJ) | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-1FG484I | Microchip | Datasheet | 2276 |
| Min: 1 Mult: 1 | Panel Mount | 484-BGA | 484-FPBGA (23x23) | Carbon | M2S050 | -- | Microchip Technology | 267 | Tray | Active | -40°C ~ 100°C (TJ) | Bulk | RV6 | ±10% | Active | -- | 0.5W, 1/2W | Solder Lug | Slotted | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1/4-32 | User Defined | 1 | Linear | 1 | None | 0.125 (3.18mm) | FPGA - 50K Logic Modules | 295° | 1 | 500 | 256KB | 0.625 (15.88mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-L2SFVA625E | AMD | Datasheet | 411 | - | Min: 1 Mult: 1 | Through Hole | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | Cermet | XCZU2 | -- | AMD | 180 | Tray | Active | 0°C ~ 100°C (TJ) | Bulk | RJ-5 | Square - 0.266 L x 0.252 W x 0.177 H (6.75mm x 6.40mm x 4.50mm) | ±10% | Active | -- | ±100ppm/°C | 1 kOhms | 0.25W, 1/4W | PC Pins | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Side Adjustment | 14 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-L2FFVD1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 308 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | 2.8V | 6MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | 0.039 (1.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU3EG-L1SFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 625-FCBGA (21x21) | XAZU3 | AMD | 128 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 1.8V | 4MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1L | -- | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 0.032 (0.80mm) | -- |
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STID337CYCB
STMicroelectronics
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASXFB5H4F40C4N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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GUT3100 S LKJU
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA012R24B2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM47622LA1KFEBG
AVAGO
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-2FSVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z045-2FFG900E
AMD
Package:Embedded - System On Chip (SoC)
2,536.827071
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AGFB027R31C2E2VAA
Intel
Package:Embedded - System On Chip (SoC)
30,333.299350
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XCVC1802-1LLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
704.668379
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XCZU7EV-2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB019R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R31C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R31C2E2VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-2LSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-1FSVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050TS-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
187.617296
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XCZU2CG-L2SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-L2FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU3EG-L1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire