The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact plating | Surface Mount | Number of pins | Material | Body material | Number of Terminals | Access Time-Max | Body colour | Cable external diameter | Cable features | Cable structure | Clock Frequency-Max (fCLK) | Colour | Conform to the norm | Connector | Connector pinout layout | Contacts pitch | Core marking | Core structure | Dimension X | Dimension Y | Dimension Z | Dimensions | Earth core | Electrical mounting | Enclosure description | Enclosure material | Gross weight | Heatsink shape | Holding force | I/O | Ihs Manufacturer | Interface Type | Internal width | Kind of connector | Kind of core | Material finishing | Mounting | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package contents | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Row pitch | Shield structure | Spatial orientation | Supply Voltage-Nom (Vsup) | Type of connector | Type of enclosure | Type of heatsink | Type of mounting element | Type of wire | Version | Wire insulation material | Operating temperature | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Current rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Rated voltage | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of cores | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | 2nd Connector Number of Positions Loaded | Core diameter | Profile | Saturation Current | Temperature | Height | Length | Width | Plating thickness | Flammability rating |
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![]() | Mfr Part No W25Q256JVEIN | Winbond Electronics Corp | Datasheet | 16000 |
| Min: 1 Mult: 1 | gold-plated | 20 | socket | 1x20 | 2.54mm | SMT | 1.2 g | WINBOND ELECTRONICS CORP | female | Active | Yes | straight | pin strips | -40...163°C | compliant | 1.5A | FLASH | 60V | beryllium copper | 0.254µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No THGBMJG7C2LBAB8 | KIOXIA | Datasheet | 1216 | - | Min: 1 Mult: 1 | gold-plated | YES | 48 | socket | 2x24 | 2.54mm | THT | 3.96 g | KIOXIA HOLDINGS CORP | female | 17179869184 words | 16000000000 | 105 °C | -40 °C | TFBGA-153 | RECTANGULAR | Active | 2.54mm | straight | pin strips | -40...163°C | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | unknown | 1.5A | R-PBGA-B | 3.6 V | INDUSTRIAL | 2.7 V | 16GX8 | 1.2 mm | 8 | 137438953472 bit | AEC-Q100 | FLASH CARD | 60V | beryllium copper | 13 mm | 11.5 mm | 0.75µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W25X40CVUXBG | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 56 | 8 | 80 MHz | socket | 2x28 | 2.54mm | THT | 4.63 g | WINBOND ELECTRONICS CORP | female | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 2.54mm | straight | 3 V | pin strips | -40...163°C | EAR99 | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | 1.5A | NOT SPECIFIED | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.6 V | SYNCHRONOUS | 512KX8 | 3-STATE | 0.6 mm | 8 | 4194304 bit | AEC-Q100 | SERIAL | FLASH | 3 V | 60V | beryllium copper | 3 mm | 2 mm | 0.75µm | UL94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S25FL064K0SMFI013 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 34 | 8 | 80 MHz | socket | 2x17 | 2.54mm | THT | 1.82 g | SPANSION INC | female | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.208 INCH, LEAD FREE, PLASTIC, SOP-8 | SOP8,.3 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | Yes | 2.54mm | straight | 3 V | pin strips | -40...163°C | 3A991.B.1.A | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | 1.5A | NOT SPECIFIED | 8 | S-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 8MX8 | 2.159 mm | 8 | 0.000005 A | 67108864 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 60V | beryllium copper | 5.283 mm | 5.283 mm | 0.254µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M25P16-VMP6 | STMicroelectronics | Datasheet | 3027 | - | Min: 1 Mult: 1 | gold-plated | YES | 80 | 8 | 50 MHz | socket | 2x40 | 2.54mm | THT | 7.65 g | STMICROELECTRONICS | female | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SON | SON, SOLCC8,.25 | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | DFP | No | 2.54mm | straight | 3 V | pin strips | -40...163°C | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | NO LEAD | 1 | 1.27 mm | not_compliant | 1.5A | 8 | R-PDSO-N8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.015 mA | 2MX8 | 1 mm | 8 | 0.00001 A | 16777216 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 60V | beryllium copper | 6 mm | 5 mm | 0.75µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT25SF321-SSHD-T | Dialog Semiconductor GmbH | Datasheet | - | - | Min: 1 Mult: 1 | DIALOG SEMICONDUCTOR GMBH | Transferred | Yes | compliant | FLASH | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT25SF041B-SSHD-T | Dialog Semiconductor GmbH | Datasheet | 360000 | - | Min: 1 Mult: 1 | YES | 8 | 108 MHz | DIALOG SEMICONDUCTOR GMBH | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | 3 V | NOR TYPE | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.0185 mA | 512KX8 | 3-STATE | 1.75 mm | 8 | 0.00003 A | 4194304 bit | SERIAL | FLASH | 3 V | QSPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 4.925 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EN25F20-100GIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 100 MHz | EON SILICON SOLUTION INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 256KX8 | 1.75 mm | 8 | 0.000005 A | 2097152 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EN25QH64A-104HIP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGYINC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.3 | SOP8,.3 | SQUARE | SMALL OUTLINE | Active | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | S-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.035 mA | 8MX8 | 3-STATE | 2.2 mm | 8 | 0.00002 A | 67108864 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 5.275 mm | 5.275 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EN25QH16B-104HIP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP-8 | SQUARE | SMALL OUTLINE | Active | Yes | 3 V | EAR99 | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | S-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 2MX8 | 2.2 mm | 8 | 16777216 bit | SERIAL | FLASH | 3 V | 5.275 mm | 5.275 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NAND04GW3C2BN6E | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | aluminium | 48 | 25 ns | aluminium | 700 g | U | NUMONYX | 13.3mm | transparently anodized | for back plate | 1073741824 words | 1000000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | Yes | 3 V | extruded | EAR99 | MLC NAND TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 1GX8 | 1.2 mm | 8 | 0.00005 A | 8589934592 bit | PARALLEL | FLASH | 3 V | NO | NO | YES | 2K | 256K | 2K words | YES | LED | 17mm | 18.4 mm | 12 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NAND512W3A2DZA6E | STMicroelectronics | Datasheet | 220 | - | Min: 1 Mult: 1 | YES | 63 | 12000 ns | black | ATEX Ex | 122mm | 2220mm | 91mm | See | glass fiber reinforced | polyester | STMICROELECTRONICS | 67108864 words | 64000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | 8.50 X 15 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | RECTANGULAR | GRID ARRAY | Transferred | BGA | Yes | 3 V | multipurpose | -40...100°C | EAR99 | SLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | compliant | NOT SPECIFIED | 63 | R-PBGA-B63 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 64MX8 | 8 | 536870912 bit | PARALLEL | FLASH | 3 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT45DB021E-SSHN-T | Dialog Semiconductor GmbH | Datasheet | 64000 |
| Min: 1 Mult: 1 | YES | stainless steel | 8 | 70 MHz | 84.71 g | 1600N | DIALOG SEMICONDUCTOR GMBH | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | 1.8 V | clasp | e4 | EAR99 | NOR TYPE | NICKEL PALLADIUM GOLD | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | 0.016 mA | 2MX1 | 1.75 mm | 1 | 0.000008 A | 2097152 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 4.925 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M29W128GL70ZA6E | STMicroelectronics | Datasheet | 1811 | - | Min: 1 Mult: 1 | YES | 64 | 70 ns | STMICROELECTRONICS | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Transferred | BGA | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 40 | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 8MX16 | 1.2 mm | 16 | 0.0001 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | 13 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29GL064A10FAIR30 | Spansion | Datasheet | 1531 | - | Min: 1 Mult: 1 | YES | 64 | 100 ns | SPANSION INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE 8M X 8 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.4 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | TOP | YES | 3 | 13 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29GL064A10FAIR30 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 100 ns | 6.4mm | twisted pair conductors | 12x2x28AWG | colours without colour repetition | stranded | none | 2525.8 g | CYPRESS SEMICONDUCTOR CORP | Cu | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 30.5m | 13 X 11 MM, FBGA-64 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | No | Al-PET foil, | 3.3 V | data transmission | Splice Free | PVC | max. 75°C | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 4MX16 | 1.4 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 50V | 8 | 24 | TOP | 28AWG | 3 | 13 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No N28F020-120 | Intel Corporation | Datasheet | 391 | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | INTEL CORP | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | 0.450 X 0.550 INCH, PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 100000 ERASE/PROGRAM CYCLES | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3.55 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | FLASH | 12 V | 100000 Write/Erase Cycles | NO | NO | YES | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W631GU6NB11I | Winbond | Datasheet | 67 |
| Min: 1 Mult: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | VFBGA - 96 | 933 / 1066MHz | 1.283 ~ 1.45V | 1Gb | -40 ~ 95˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W631GU6NB12I | Winbond | Datasheet | 2400 |
| Min: 1 Mult: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | VFBGA - 96 | 933 / 1066MHz | 1.283 ~ 1.45V | 1Gb | -40 ~ 95˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W632GU6QB09I | Winbond | Datasheet | 29 |
| Min: 1 Mult: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 2Gb | -40 ~ 95˚C |
W25Q256JVEIN
Winbond Electronics Corp
Package:Memory - Modules
4.239724
THGBMJG7C2LBAB8
KIOXIA
Package:Memory - Modules
Price: please inquire
W25X40CVUXBG
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
S25FL064K0SMFI013
Spansion
Package:Memory - Modules
Price: please inquire
M25P16-VMP6
STMicroelectronics
Package:Memory - Modules
Price: please inquire
AT25SF321-SSHD-T
Dialog Semiconductor GmbH
Package:Memory - Modules
Price: please inquire
AT25SF041B-SSHD-T
Dialog Semiconductor GmbH
Package:Memory - Modules
Price: please inquire
EN25F20-100GIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
EN25QH64A-104HIP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
EN25QH16B-104HIP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
NAND04GW3C2BN6E
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
NAND512W3A2DZA6E
STMicroelectronics
Package:Memory - Modules
Price: please inquire
AT45DB021E-SSHN-T
Dialog Semiconductor GmbH
Package:Memory - Modules
1.033481
M29W128GL70ZA6E
STMicroelectronics
Package:Memory - Modules
Price: please inquire
S29GL064A10FAIR30
Spansion
Package:Memory - Modules
Price: please inquire
S29GL064A10FAIR30
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
N28F020-120
Intel Corporation
Package:Memory - Modules
Price: please inquire
W631GU6NB11I
Winbond
Package:Memory - Modules
3.819694
W631GU6NB12I
Winbond
Package:Memory - Modules
3.620295
W632GU6QB09I
Winbond
Package:Memory - Modules
4.239030
