The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No S29AL016D90TFI010H | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TC58NVG1S3HBAI4_TRAY | KIOXIA | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SST25VF010A-33-4C-SA | Silicon Storage Technology | Datasheet | 662 | - | Min: 1 Mult: 1 | YES | 8 | 20 MHz | SILICON STORAGE TECHNOLOGY INC | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | No | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.03 mA | 128KX8 | 3-STATE | 1.75 mm | 8 | 0.0004 A | 1048576 bit | SERIAL | FLASH | 3 V | SPI | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | |||||||||||||||||||||
| Mfr Part No K9F2816U0C-HCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA63,10X12,32 | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | 3.3 V | EAR99 | SLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B63 | Not Qualified | COMMERCIAL | 0.02 mA | 8MX16 | 16 | 0.00005 A | 134217728 bit | PARALLEL | FLASH | NO | NO | YES | 1K | 8K | 256 words | YES | ||||||||||||||||||||||||||||||
| Mfr Part No DTXON/128GB | Kingston Technology Company | Datasheet | 167 |
| Min: 1 Mult: 1 | NO | KINGSTON TECHNOLOGY COMPANY INC | 137438953472 words | 128000000000 | 60 °C | UNSPECIFIED | XMA | MODULE | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Active | EAR99 | NOR TYPE | 8542.32.00.51 | UNSPECIFIED | UNSPECIFIED | 1 | unknown | R-XXMA-X | ASYNCHRONOUS | 128GX8 | 8 | 1099511627776 bit | USB FLASH DRIVE | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No THGBMJG6C1LBAU7_TRAY | KIOXIA | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLM8G1GETF-B041008 | Samsung Electronics Co. Ltd | Datasheet | 25 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX29GL512GLXFI-10Q/TR | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX27L2000QC-12 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | MACRONIX INTERNATIONAL CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 3 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 256KX8 | 3-STATE | 3.55 mm | 8 | 0.00002 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | 14.05 mm | 11.43 mm | ||||||||||||||||||||||||
| Mfr Part No S29GL064M10TAIR2 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | ADVANCED MICRO DEVICES INC | , | Obsolete | EAR99 | 8542.32.00.51 | unknown | FLASH | 3 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M10TAIR2 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | 18.4 mm | 14 mm | |||||||||||||
| Mfr Part No K9F5616D0C-YCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 2.65 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.02 mA | 16MX16 | 16 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | NO | NO | YES | 2K | 8K | 256 words | YES | |||||||||||||||||||||||||||
 | Mfr Part No MX27C4000PC-90 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 70 °C | -10 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 512KX8 | 3-STATE | 4.9 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 41.91 mm | 15.24 mm | |||||||||||||||||||||||
| Mfr Part No S29GL064A90TFIR70H | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TBP28LA22N | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | 65 ns | TEXAS INSTRUMENTS INC | 256 words | 212942 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | not_compliant | NOT SPECIFIED | 20 | R-PDIP-T20 | Not Qualified | COMMERCIAL | ASYNCHRONOUS | 0.1 mA | 64X8 | 5.08 mm | 1 | 512 bit | PARALLEL | OTP ROM | 24.325 mm | 7.62 mm | |||||||||||||||||||||||||||||
| Mfr Part No TBP28LA22N | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | 75 ns | ROCHESTER ELECTRONICS LLC | 256 words | 256 | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Active | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T20 | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 256X8 | 5.08 mm | 8 | 2048 bit | PARALLEL | OTP ROM | 24.325 mm | 7.62 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No MX25V1635FM1Q/TR | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SST39VF160-70-4C-EKE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 1MX16 | 1.2 mm | 16 | 0.00002 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 512 | 2K | YES | 18.4 mm | 12 mm | |||||||||||||||||||
| Mfr Part No W25Q128BVBIP | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 104 MHz | WINBOND ELECTRONICS CORP | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | 8 X 6 MM, GREEN TFBGA-24 | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B24 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 16MX8 | 3-STATE | 1.2 mm | 8 | 0.000015 A | 134217728 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 8 mm | 6 mm | ||||||||||||||||||||||
 | Mfr Part No TE28F160B3B90 | Intel Corporation | Datasheet | 3600 | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | INTEL CORP | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | 3 V | EAR99 | NOR TYPE | USER-SELECTABLE 12V VPP; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 1MX16 | 1.2 mm | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | NO | NO | YES | 8,31 | 4K,32K | BOTTOM | 18.4 mm | 12 mm |
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S29AL016D90TFI010H
Infineon Technologies AG
Package:Memory - Modules
Price: please inquire
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TC58NVG1S3HBAI4_TRAY
KIOXIA
Package:Memory - Modules
Price: please inquire
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SST25VF010A-33-4C-SA
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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K9F2816U0C-HCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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DTXON/128GB
Kingston Technology Company
Package:Memory - Modules
18.044589
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THGBMJG6C1LBAU7_TRAY
KIOXIA
Package:Memory - Modules
Price: please inquire
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KLM8G1GETF-B041008
Samsung Electronics Co. Ltd
Package:Memory - Modules
Price: please inquire
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MX29GL512GLXFI-10Q/TR
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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MX27L2000QC-12
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL064M10TAIR2
AMD
Package:Memory - Modules
Price: please inquire
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S29GL064M10TAIR2
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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K9F5616D0C-YCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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MX27C4000PC-90
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL064A90TFIR70H
Spansion
Package:Memory - Modules
Price: please inquire
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TBP28LA22N
Texas Instruments
Package:Memory - Modules
Price: please inquire
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TBP28LA22N
Rochester Electronics LLC
Package:Memory - Modules
Price: please inquire
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MX25V1635FM1Q/TR
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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SST39VF160-70-4C-EKE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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W25Q128BVBIP
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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TE28F160B3B90
Intel Corporation
Package:Memory - Modules
Price: please inquire