The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Time-Min | Interrupt Capability | Volatile | Communication Protocol | Information Access Method | Display Configuration | Length | Width |
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![]() | Mfr Part No 9FG108CFLF | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | INTEGRATED DEVICE TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | SSOP | 0.300 INCH, ROHS COMPLIANT, MO-118, SSOP-48 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | SSOP | Yes | 3.465 V | 3.135 V | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | DUAL | GULL WING | 260 | 0.635 mm | compliant | 30 | 48 | R-PDSO-G48 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.8 mm | 25 MHz | 400 MHz | 15.875 mm | 7.5 mm | |||||||||||||||||||||
![]() | Mfr Part No SED1522DOA | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | SEIKO EPSON CORP | UNSPECIFIED | DIE | 4.80 X 7.04 MM, 0.40 MM HEIGHT, ALUMINUM PAD, DIE-100 | RECTANGULAR | UNCASED CHIP | Obsolete | 8542.31.00.01 | UPPER | NO LEAD | unknown | R-XUUC-N100 | Not Qualified | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LM8333 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 49 | TEXAS INSTRUMENTS INC | 1 | 85 °C | -40 °C | UNSPECIFIED | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 2.75 V | 2.25 V | e3 | Yes | TIN | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | compliant | 49 | S-XBGA-B49 | Not Qualified | INDUSTRIAL | MICROPROCESSOR CIRCUIT | 1.1 mm | 4 mm | 4 mm | |||||||||||||||||||||||||
![]() | Mfr Part No XCZU5CG-2LFBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No BT445KHF150 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | BROOKTREE CORP | 70 °C | PLASTIC/EPOXY | QFP | , | SQUARE | FLATPACK | Obsolete | 5.25 V | 4.75 V | 5 V | 8542.31.00.01 | QUAD | GULL WING | unknown | S-PQFP-G160 | Not Qualified | COMMERCIAL | DISPLAY CONTROLLER, PALETTE DAC | 474 mA | 3 | 8 | 1280 X 1024 PIXELS | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No 538-42815-0012-CT | Molex | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TXC-06840AIOG | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 376 | 125 MHz | TRANSWITCH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 1.89 V | 1.71 V | 1.8 V | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | 376 | S-PBGA-B376 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 2.44 mm | 16 | YES | NO | 32 | 8 | MPC860 | 12.5 MBps | ASYNC, BIT | 23 mm | 23 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU7EV-3FBVB900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.97 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No TVGA8900D | Trident Microsystems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | TRIDENT MICROSYSTEMS INC | 70 °C | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | 5 V | 8542.31.00.01 | QUAD | GULL WING | 0.635 mm | unknown | S-PQFP-G160 | Not Qualified | COMMERCIAL | 100 mA | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DS1065-10-2*4S8BSB | Ningbo connfly electronic CO LTD | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU3EG-3SFVA625E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | PLASTIC/EPOXY | BGA | FLIPCHIP-625 | SQUARE | GRID ARRAY | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | compliant | 30 | S-PBGA-B625 | OTHER | PROGRAMMABLE SoC | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU3EG-3SFVA625E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | XILINX INC | 4 | 100 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | compliant | S-PBGA-B625 | OTHER | PROGRAMMABLE SoC | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU2CG-1LSBVA484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU11EG-3FFVF1517I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1517 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU11EG-3FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1517 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1517 | SQUARE | GRID ARRAY | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-1FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | PLASTIC/EPOXY | BGA | BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No 9-519004-0 | TE Connectivity | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM5346 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 676 | BROADCOM CORP | 1 | PLASTIC/EPOXY | BGA | BGA, | UNSPECIFIED | GRID ARRAY | Obsolete | BGA | No | 8542.31.00.01 | BOTTOM | BALL | compliant | 676 | X-PBGA-B676 | Not Qualified | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RX-4571LC | Epson Electronics America Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 12 | 0.032 MHz | SEIKO EPSON CORP | 85 °C | -40 °C | PLASTIC/EPOXY | TSOJ | , | TSSOJ12,.11,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Active | 5.5 V | 1.6 V | 3 V | e3 | EAR99 | TIN | 8542.39.00.01 | DUAL | J BEND | 260 | 0.5 mm | unknown | 30 | R-PDSO-J12 | TIMER, REAL TIME CLOCK | 1.2 mm | 1/4096 second | Y | YES | SERIAL(SPI), SERIAL, 3-WIRE | 3.6 mm | 2.4 mm | ||||||||||||||||||||||
![]() | Mfr Part No W48C111-12H | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | CYPRESS SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | No | 3.465 V | 3.135 V | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 0.635 mm | not_compliant | R-PDSO-G28 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 145 mA | 14.318 MHz | 100 MHz |
9FG108CFLF
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SED1522DOA
Seiko Epson Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
LM8333
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU5CG-2LFBVB900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BT445KHF150
Conexant Systems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
538-42815-0012-CT
Molex
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TXC-06840AIOG
Transwitch Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU7EV-3FBVB900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TVGA8900D
Trident Microsystems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
DS1065-10-2*4S8BSB
Ningbo connfly electronic CO LTD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU3EG-3SFVA625E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU3EG-3SFVA625E
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU2CG-1LSBVA484I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU11EG-3FFVF1517I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU11EG-3FFVF1517I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-1FBVB900E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
9-519004-0
TE Connectivity
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM5346
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RX-4571LC
Epson Electronics America Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
W48C111-12H
Cypress Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
