The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Terminal Finish | Applications | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Interface | Number of Ports | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Program Memory Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | RAM (words) | Number of Serial I/Os | Bus Compatibility | On Chip Data RAM Width | Data Transfer Rate-Max | Communication Protocol | Data Encoding/Decoding Method | Length | Width |
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![]() | Mfr Part No SIS6326DVD | Silicon Integrated Systems Corp | Datasheet | - | - | Min: 1 Mult: 1 | SILICON INTEGRATED SYSTEMS CORP | , | Contact Manufacturer | QFP | 8542.31.00.01 | unknown | 208 | Not Qualified | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PCA9541D/03 | Philips Semiconductors | Datasheet | 800 | - | Min: 1 Mult: 1 | YES | 16 | PHILIPS SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.31.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.6 mA | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No USB24913CT-V/LSXVAO | Microchip Technology Inc | Datasheet | 16000 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7EG-3FBVB900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.97 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7EG-3FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | SQUARE | GRID ARRAY | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.97 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ICS9159M-07 | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | INTEGRATED DEVICE TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5.25 V | 3.13 V | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.8194 mm | 14.318 MHz | 64.98 MHz | 17.8816 mm | 7.5184 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R65C24P1 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 1 MHz | CONEXANT SYSTEMS | 16 | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-40 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | Not Qualified | COMMERCIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 5.08 mm | 8 | 52.07 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AU6367 | Alcor Micro Corp | Datasheet | - | - | Min: 1 Mult: 1 | ALCOR MICRO CORP | , | Contact Manufacturer | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ICS1522MT | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | INTEGRATED DEVICE TECHNOLOGY INC | SOIC-24 | Obsolete | SOIC | No | 8542.39.00.01 | not_compliant | 24 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU4CG-2LFBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ST16C554DCJ | XP Power | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SLS32AIA010MKUSON10XTMA3 | Infineon Technologies | Datasheet | 3819 |
| Min: 1 Mult: 1 | Surface Mount | 10-UFDFN Exposed Pad | PG-USON-10-2 | -25°C ~ 85°C (TA) | Tape & Reel (TR) | OPTIGA? Trust M | Active | Security | 1.62V ~ 5.5V | I2C | 10K x 8 | 16-Bit | NVSRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No HD44780UA01FS | Hitachi Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | HITACHI LTD | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Transferred | QFP | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | 3.1 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NSC831D-3I | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | NATIONAL SEMICONDUCTOR CORP | 20 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-CDIP-T40 | Not Qualified | INDUSTRIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 8 | 5.08 mm | 8 | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NSC831D-3I | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | NATIONAL SEMICONDUCTOR CORP | 20 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-CDIP-T40 | Not Qualified | INDUSTRIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 8 | 5.08 mm | 8 | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No COM20020P | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 40 MHz | MICROCHIP TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-24 | DIP24,.6 | RECTANGULAR | IN-LINE | Active | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | DUAL | THROUGH-HOLE | 235 | 2.54 mm | compliant | R-PDIP-T24 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 50 mA | 3.81 mm | 3 | NO | NO | 8 | 1024 | 1 | 8051; 6801 | 8 | 0.625 MBps | ASYNC, BIT; SYNC, BYTE; ETHERNET | NRZ | 31.877 mm | 15.24 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No COM20020P | SMSC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 40 MHz | STANDARD MICROSYSTEMS CORP | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-24 | DIP24,.6 | RECTANGULAR | IN-LINE | Transferred | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | No | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 235 | 2.54 mm | compliant | 24 | R-PDIP-T24 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 50 mA | 3.81 mm | 3 | NO | NO | 8 | 1024 | 1 | 8051; 6801 | 8 | 0.625 MBps | NRZ | 31.877 mm | 15.24 mm | |||||||||||||||||||||||||
![]() | Mfr Part No BCM5655 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM CORP | , | Transferred | No | 8542.31.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM4780P | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM LTD | , | Active | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RD151TS3325ARPH0 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | RENESAS ELECTRONICS CORP | 1 | 85 °C | -20 °C | PLASTIC/EPOXY | SOP | 3.95 X 4.90 MM, 1.27 MM PITCH, PLASTIC, SOP-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | Yes | 3.6 V | 3 V | 3.3 V | Yes | EAR99 | 8542.39.00.01 | DUAL | GULL WING | 260 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | OTHER | CLOCK GENERATOR, OTHER | 30 mA | 1.75 mm | 40 MHz | 160 MHz | 4.9 mm | 3.95 mm |
SIS6326DVD
Silicon Integrated Systems Corp
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCA9541D/03
Philips Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
USB24913CT-V/LSXVAO
Microchip Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU7EG-3FBVB900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU7EG-3FBVB900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ICS9159M-07
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
R65C24P1
Conexant Systems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
AU6367
Alcor Micro Corp
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ICS1522MT
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU4CG-2LFBVB900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ST16C554DCJ
XP Power
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SLS32AIA010MKUSON10XTMA3
Infineon Technologies
Package:Embedded - Microcontrollers - Application Specific
1.761290
HD44780UA01FS
Hitachi Ltd
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
NSC831D-3I
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
NSC831D-3I
National Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
COM20020P
Microchip Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
COM20020P
SMSC
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM5655
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM4780P
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RD151TS3325ARPH0
Renesas Electronics Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
