Interface - Telecom (6000)

-

-

Min: 1

Mult: 1

YES

32

THESYS GESELLSCHAFT FUR MIKROELEKTRONIK MBH

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

LQFP,

SQUARE

FLATPACK

Obsolete

QFP

8542.39.00.01

QUAD

GULL WING

1

0.8 mm

unknown

32

S-PQFP-G32

Not Qualified

INDUSTRIAL

1.6 mm

TELECOM CIRCUIT

7 mm

7 mm

4000
In Stock

-

Min: 1

Mult: 1

YES

28

TRIQUINT SEMICONDUCTOR INC

3

85 °C

-40 °C

PLASTIC/EPOXY

HQCCN

HQCCN,

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

Obsolete

QFN

Yes

5 V

e4

GOLD OVER NICKEL

8542.39.00.01

QUAD

NO LEAD

1

0.7 mm

compliant

28

S-PQCC-N28

Not Qualified

INDUSTRIAL

1.12 mm

RF AND BASEBAND CIRCUIT

6 mm

6 mm

-

-

Min: 1

Mult: 1

YES

256

BROADCOM CORP

1

PLASTIC/EPOXY

BGA

TBGA-256

GRID ARRAY

Obsolete

BGA

No

1.8 V

No

8542.39.00.01

BOTTOM

BALL

1

compliant

256

Not Qualified

ETHERNET TRANSCEIVER

-

-

Min: 1

Mult: 1

YES

256

BROADCOM CORP

PLASTIC/EPOXY

BGA

BGA,

UNSPECIFIED

GRID ARRAY

Obsolete

BGA

No

1.8 V

8542.39.00.01

BOTTOM

BALL

1

compliant

256

X-PBGA-B256

Not Qualified

TELECOM CIRCUIT

-

-

Min: 1

Mult: 1

YES

60

TEXAS INSTRUMENTS INC

70 °C

UNSPECIFIED

VQCCN

VQCCN,

SQUARE

CHIP CARRIER, VERY THIN PROFILE

Obsolete

QFN

5 V

8542.39.00.01

QUAD

NO LEAD

1

0.5 mm

unknown

60

S-XQCC-N60

COMMERCIAL

0.8 mm

TELECOM CIRCUIT

-5 V

9 mm

9 mm

-

-

Min: 1

Mult: 1

YES

10

RF MICRO DEVICES INC

85 °C

-40 °C

PLASTIC/EPOXY

BCC

BCC,

RECTANGULAR

CHIP CARRIER

Obsolete

2.85 V

8542.39.00.01

BOTTOM

BUTT

1

0.5 mm

unknown

R-PBCC-B10

INDUSTRIAL

1.195 mm

TELECOM CIRCUIT

2.5 mm

2 mm

-

-

Min: 1

Mult: 1

YES

12

TRIQUINT SEMICONDUCTOR INC

PLASTIC/EPOXY

LGA

LGA,

SQUARE

GRID ARRAY

Obsolete

LGA

e4

GOLD FLASH OVER NICKEL

8542.39.00.01

BOTTOM

NO LEAD

1

unknown

12

S-PBGA-N12

Not Qualified

2.1336 mm

TELECOM CIRCUIT

-

-

Min: 1

Mult: 1

YES

28

STMICROELECTRONICS

70 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP, SOP28,.4

SOP28,.4

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

No

e0

TIN LEAD

8542.39.00.01

DUAL

GULL WING

1

1.27 mm

not_compliant

28

R-PDSO-G28

Not Qualified

OTHER

2.65 mm

TELEPHONE MULTIFUNCTION CIRCUIT

17.9 mm

7.5 mm

-

-

Min: 1

Mult: 1

NO

28

WINBOND ELECTRONICS CORP

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Obsolete

No

5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

R-PDIP-T28

Not Qualified

COMMERCIAL

-

-

Min: 1

Mult: 1

YES

81

NXP SEMICONDUCTORS

SOT-643-1

3

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

LFBGA,

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Obsolete

BGA

Yes

1.2 V

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

260

1

0.8 mm

unknown

30

81

S-PBGA-B81

Not Qualified

INDUSTRIAL

1.6 mm

INTERFACE CIRCUIT

9 mm

9 mm

-

-

Min: 1

Mult: 1

YES

100

INTEGRATED DEVICE TECHNOLOGY INC

85 °C

-40 °C

PLASTIC/EPOXY

HLFQFP

HLFQFP,

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Transferred

QFP

No

3.3 V

e0

No

TIN LEAD

8542.39.00.01

QUAD

GULL WING

1

0.5 mm

compliant

100

S-PQFP-G100

Not Qualified

INDUSTRIAL

1.4 mm

TELECOM CIRCUIT

14 mm

14 mm

-

-

Min: 1

Mult: 1

YES

16

TOKO INC

70 °C

-30 °C

PLASTIC/EPOXY

SOP

SOP,

RECTANGULAR

SMALL OUTLINE

Transferred

Yes

4 V

8542.39.00.01

DUAL

GULL WING

NOT SPECIFIED

1

1.27 mm

unknown

NOT SPECIFIED

R-PDSO-G16

Not Qualified

OTHER

1.94 mm

TELECOM CIRCUIT

9.9 mm

3.9 mm

-

-

Min: 1

Mult: 1

YES

16

ASAHI KASEI MICRODEVICES CORP

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP,

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

4 V

8542.39.00.01

DUAL

GULL WING

1

1.27 mm

unknown

16

R-PDSO-G16

INDUSTRIAL

1.94 mm

TELECOM CIRCUIT

9.9 mm

3.9 mm

-

-

Min: 1

Mult: 1

YES

16

ASAHI KASEI POWER DEVICES CORP

70 °C

-30 °C

PLASTIC/EPOXY

SOP

SOP,

RECTANGULAR

SMALL OUTLINE

Contact Manufacturer

SOIC

Yes

4 V

Yes

8542.39.00.01

DUAL

GULL WING

NOT SPECIFIED

1

1.27 mm

unknown

NOT SPECIFIED

16

R-PDSO-G16

Not Qualified

OTHER

1.94 mm

TELECOM CIRCUIT

9.9 mm

3.9 mm

-

-

Min: 1

Mult: 1

YES

10

2020-10-15

EXPOSED PAD MINI_SOIC

150 °C

-40 °C

PLASTIC/EPOXY

HTSSOP

TSSOP10,.2,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Active

EXPOSED PAD MINI_SOIC

Yes

3.3 V

DUAL

GULL WING

NOT SPECIFIED

1

0.5 mm

NOT SPECIFIED

10

S-PDSO-G10

400 Mbps

1.1 mm

AEC-Q100

CAN TRANSCEIVER

1

3 mm

3 mm

-

-

Min: 1

Mult: 1

YES

24

TEXAS INSTRUMENTS INC

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP,

RECTANGULAR

SMALL OUTLINE

Obsolete

5 V

FULL DUPLEX

8542.39.00.01

DUAL

GULL WING

1

1.27 mm

unknown

R-PDSO-G24

Not Qualified

INDUSTRIAL

SYNCHRONOUS

13 mA

2.65 mm

PCM CODEC

YES

A/MU-LAW

-5 V

15.4 mm

7.5 mm

-

-

Min: 1

Mult: 1

YES

64

PHILIPS SEMICONDUCTORS

PLASTIC/EPOXY

QFP

QFP, QFP64,.66SQ,32

QFP64,.66SQ,32

SQUARE

FLATPACK

Transferred

No

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

GULL WING

0.8 mm

unknown

S-PQFP-G64

Not Qualified

ATM/SONET/SDH TRANSCEIVER

-

-

Min: 1

Mult: 1

NO

28

NATIONAL SEMICONDUCTOR CORP

1

CERAMIC, GLASS-SEALED

DIP

DIP, DIP28,.6

DIP28,.6

RECTANGULAR

IN-LINE

Obsolete

No

5 V

e0

TIN LEAD

8542.39.00.01

DUAL

THROUGH-HOLE

260

1

2.54 mm

compliant

R-GDIP-T28

Not Qualified

160 Mbps

DIGITAL SLIC

0.0032 A

ANSI T1.601

BASIC

U

2.4 V

0.4 V

-

-

Min: 1

Mult: 1

YES

14

2019-09-04

NXP SEMICONDUCTORS

150 °C

-40 °C

PLASTIC/EPOXY

HVSON

,

SOLCC14,.12,25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Active

5 V

EAR99

8542.39.00.01

DUAL

NO LEAD

1

0.65 mm

unknown

R-PDSO-N14

65 mA

1 mm

AEC-Q100

CAN TRANSCEIVER

1

3 mm

4.5 mm

-

-

Min: 1

Mult: 1

MINDSPEED TECHNOLOGIES INC

,

Obsolete

unknown