The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Neg Supply Voltage-Nom | Battery Feed | PSRR-Min | Hybrid | Battery Supply | Noise-Max | Fax Rate | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No ZL70123MNG7 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 29 | MICROSEMI CORP | 55 °C | UNSPECIFIED | LGA | LGA, | RECTANGULAR | GRID ARRAY | Transferred | 3.3 V | 8542.39.00.01 | BOTTOM | BUTT | 1 | compliant | R-XBGA-B29 | COMMERCIAL | 2.95 mm | RF AND BASEBAND CIRCUIT | 18 mm | 12 mm | ||||||||||||||||||||||||
| Mfr Part No OQ2541HPB-S | Philips Semiconductors | Datasheet | 808 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AM7943-1JC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | ADVANCED MICRO DEVICES INC | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Transferred | QFJ | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | COMMERCIAL | 8.5 mA | 3.556 mm | SLIC | -5 V | CONSTANT CURRENT | 30 dB | 2-4 CONVERSION | -19 TO -56.5 V | 10 dBrnC | 13.97 mm | 11.43 mm | |||||||||
 | Mfr Part No TISP61CAP3P | JW Miller | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | POWER INNOVATIONS LTD | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Transferred | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | Not Qualified | 5.08 mm | SURGE PROTECTION CIRCUIT | 7.62 mm | ||||||||||||||||||||||||
 | Mfr Part No RFFC5071SQ | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3 V | Yes | 5A991.G | 8517.70.00.00 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | 0.95 mm | TELECOM CIRCUIT | 5 mm | 5 mm | ||||||||||||||
 | Mfr Part No RFG1M20090 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 2 | RF MICRO DEVICES INC | 85 °C | -25 °C | CERAMIC, METAL-SEALED COFIRED | , | RECTANGULAR | FLANGE MOUNT | Transferred | DFM | Yes | Yes | 8542.39.00.01 | DUAL | FLAT | NOT SPECIFIED | 1 | compliant | NOT SPECIFIED | 2 | R-CDFM-F2 | Not Qualified | OTHER | TELECOM CIRCUIT | |||||||||||||||||||||
| Mfr Part No FX-500-LAC-GNJ-A3-E7 | Vectron International | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | VECTRON INTERNATIONAL | 1 | 70 °C | PLASTIC/EPOXY | SOJ | PACKAGE-6 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | 3.3 V | e4 | Yes | NICKEL GOLD | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | ||||||||||||||||
| Mfr Part No HM9113A | Hualon Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | HUALON MICROELECTRONICS CORP | , | Contact Manufacturer | unknown | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RCV56ACF/SP | Rockwell Automation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No QET-5100M-0-LGA78B-TR-03-0 | Qualcomm | Datasheet | - | - | Min: 1 Mult: 1 | QUALCOMM | Contact Manufacturer | unknown | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IDT82V3355TF | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | e0 | No | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | compliant | 64 | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 1.4 mm | TELECOM CIRCUIT | 10 mm | 10 mm | ||||||||||||||
| Mfr Part No SY8702AABC | Silergy Corporation | Datasheet | 244640 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SA1620BE | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | PHILIPS SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP48,.35SQ,20 | QFP48,.35SQ,20 | SQUARE | FLATPACK | Transferred | No | 3 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G48 | Not Qualified | INDUSTRIAL | ||||||||||||||||||||||
| Mfr Part No BCM3022KPF | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No RFX96V12 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QFP | QFP, LDCC68,1.0SQ | LDCC68,1.0SQ | RECTANGULAR | FLATPACK | Transferred | QFP | No | 5 V | e0 | No | TIN LEAD | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | COMMERCIAL | 119 mA | 9 Mbps | 2.3 mm | MODEM-DATA/FAX/VOICE | 9.6 kbps | 20 mm | 14 mm | ||||||||||||
| Mfr Part No TXC-03108AIBG | Tri-Star Electronics International | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MH88634T-2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 21 | MICROSEMI CORP | 70 °C | PLASTIC/EPOXY | SIP21H,.6 | Transferred | No | 5 V | 8542.39.00.01 | SINGLE | 2.54 mm | unknown | Not Qualified | COMMERCIAL | 13 mA | -5 V | |||||||||||||||||||||||||||||
| Mfr Part No MH88634T-2 | Zarlink Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 21 | ZARLINK SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | , SIP21H,.6 | SIP21H,.6 | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | SINGLE | 2.54 mm | unknown | Not Qualified | COMMERCIAL | 0.013 mA | -5 V | ||||||||||||||||||||||||||
 | Mfr Part No PEB3035NV1.1 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | SIEMENS A G | 85 °C | PLASTIC/EPOXY | , | RECTANGULAR | CHIP CARRIER | Transferred | QLCC | 5 V | 8542.39.00.01 | QUAD | J BEND | 1 | unknown | 28 | R-PQCC-J28 | Not Qualified | OTHER | TELECOM CIRCUIT | |||||||||||||||||||||||||
 | Mfr Part No PBL38541/1N | Ericsson | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | ERICSSON POWER MODULES AB | 1 | 70 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 2.2 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-PDIP-T18 | Not Qualified | OTHER | 5.33 mm | TELEPHONE SPEECH CIRCUIT | 22.48 mm | 7.62 mm |
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ZL70123MNG7
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
-
OQ2541HPB-S
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
-
AM7943-1JC
AMD
Package:Interface - Telecom
Price: please inquire
-
TISP61CAP3P
JW Miller
Package:Interface - Telecom
Price: please inquire
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RFFC5071SQ
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
RFG1M20090
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
FX-500-LAC-GNJ-A3-E7
Vectron International
Package:Interface - Telecom
Price: please inquire
-
HM9113A
Hualon Microelectronics Corp
Package:Interface - Telecom
Price: please inquire
-
RCV56ACF/SP
Rockwell Automation
Package:Interface - Telecom
Price: please inquire
-
QET-5100M-0-LGA78B-TR-03-0
Qualcomm
Package:Interface - Telecom
Price: please inquire
-
IDT82V3355TF
Integrated Device Technology Inc
Package:Interface - Telecom
Price: please inquire
-
SY8702AABC
Silergy Corporation
Package:Interface - Telecom
Price: please inquire
-
SA1620BE
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
-
BCM3022KPF
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
-
RFX96V12
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
-
TXC-03108AIBG
Tri-Star Electronics International
Package:Interface - Telecom
Price: please inquire
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MH88634T-2
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
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MH88634T-2
Zarlink Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
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PEB3035NV1.1
Siemens
Package:Interface - Telecom
Price: please inquire
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PBL38541/1N
Ericsson
Package:Interface - Telecom
Price: please inquire