The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No B88069X4961T702 | TDK Corporation | Datasheet | - | - | Min: 1 Mult: 1 | TDK CORP | Active | 8542.39.00.01 | NOT SPECIFIED | compliant | NOT SPECIFIED | SURGE PROTECTION CIRCUIT | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PN512AA0HN1/C2 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | NXP SEMICONDUCTORS | 3 | 85 °C | -30 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | Yes | 3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | S-PQCC-N32 | OTHER | 1 mm | AEC-Q100 | TELECOM CIRCUIT | 5 mm | 5 mm | ||||||||||||||
![]() | Mfr Part No SF2-LP11 | Methode Electronics Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 10 | METHODE ELECTRONICS INC | 70 °C | UNSPECIFIED | RECTANGULAR | FIBER OPTIC | Contact Manufacturer | 3.3 V | 8542.39.00.01 | DUAL | PIN/PEG | 1 | unknown | R-XDFO-P10 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | |||||||||||||||||||||||
![]() | Mfr Part No SI2415-FT | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | SILICON LABORATORIES INC | , | Transferred | Yes | unknown | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RTL8201 | Realtek Semiconductor | Datasheet | 8 | - | Min: 1 Mult: 1 | YES | 48 | REALTEK SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP48,.35SQ,20 | QFP48,.35SQ,20 | SQUARE | FLATPACK | Active | 3.3 V | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G48 | Not Qualified | COMMERCIAL | 100000 Mbps | ETHERNET TRANSCEIVER | 1 | ||||||||||||||||||
![]() | Mfr Part No S1T2410B02-D0B0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | SAMSUNG SEMICONDUCTOR INC | 65 °C | -45 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, MINI, DIP-8 | RECTANGULAR | IN-LINE | Obsolete | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | Not Qualified | OTHER | 5.08 mm | TELEPHONE RINGER CIRCUIT | 9.2 mm | 7.62 mm | |||||||||||||||
![]() | Mfr Part No MCP2021-330E/MF | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | MICROCHIP TECHNOLOGY INC | 1 | 125 °C | -40 °C | PLASTIC/EPOXY | HVSON | 6 X 5 MM, LEAD FREE, PLASTIC, DFN-8 | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Not Recommended | DFN | Yes | 12 V | e3 | MATTE TIN | 8542.39.00.01 | DUAL | NO LEAD | 260 | 1 | 1.27 mm | compliant | 40 | 8 | R-PDSO-N8 | AUTOMOTIVE | 1 mm | TS 16949 | LIN TRANSCEIVER | 1 | 6 mm | 5 mm | ||||||
![]() | Mfr Part No DP83822IRHB | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TXC-03456-AIPQ | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | TRANSWITCH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | 5 V | QUAD | GULL WING | 1 | 0.65 mm | unknown | 144 | S-PQFP-G144 | Not Qualified | INDUSTRIAL | 320 mA | 4.07 mm | SUPPORT CIRCUIT | 28 mm | 28 mm | ||||||||||||||
![]() | Mfr Part No SC9149AHN | Hangzhou Silan Microelectronics CO LTD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | HANGZHOU SILAN MICROELECTRONICS CO LTD | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | Yes | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T16 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | ||||||||||||||||||
![]() | Mfr Part No RF2059SB | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | 3 V | 5A991.G | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 32 | S-PQCC-N32 | Not Qualified | INDUSTRIAL | 0.95 mm | RF AND BASEBAND CIRCUIT | 5 mm | 5 mm | |||||||||||||
![]() | Mfr Part No MC209010 | RRC power solutions | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SE5012T | Skyworks Solutions Inc | Datasheet | 1992 | - | Min: 1 Mult: 1 | YES | 16 | SKYWORKS SOLUTIONS INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | QFN-16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | 16 | S-XQCC-N16 | INDUSTRIAL | 0.6 mm | RF AND BASEBAND CIRCUIT | 3 mm | 3 mm | ||||||||||||
![]() | Mfr Part No PCD3360T | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | No | 6 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G16 | Not Qualified | OTHER | 0.14 mA | ||||||||||||||||
![]() | Mfr Part No PCD3360T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | NXP SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 6 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 16 | R-PDSO-G16 | Not Qualified | OTHER | 0.14 mA | 2.65 mm | TELEPHONE RINGER CIRCUIT | 10.3 mm | 7.5 mm | |||||||||||
![]() | Mfr Part No TEA1062AT/C4 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | NXP SEMICONDUCTORS | 1 | 75 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Active | SOIC | Yes | 2.7 V | e4 | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | NOT SPECIFIED | 16 | R-PDSO-G16 | Not Qualified | COMMERCIAL EXTENDED | 1.75 mm | TELEPHONE SPEECH CIRCUIT | 9.9 mm | 3.9 mm | |||||||
![]() | Mfr Part No BCM54991EB0IFSBG | Broadcom Limited | Datasheet | 312 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TJF1051T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NXP SEMICONDUCTORS | 105 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Active | 5 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G8 | INDUSTRIAL | 1.75 mm | SUPPORT CIRCUIT | 4.9 mm | 3.9 mm | |||||||||||||||||
![]() | Mfr Part No PSB6620 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | INFINEON TECHNOLOGIES AG | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T8 | Not Qualified | COMMERCIAL | 22 mA | ||||||||||||||||||
![]() | Mfr Part No AN6107SA | Panasonic Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | PANASONIC CORP | PLASTIC/EPOXY | LSSOP | LSSOP, | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Obsolete | SOIC | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.65 mm | unknown | 16 | R-PDSO-G16 | Not Qualified | 1.6 mm | TELECOM CIRCUIT | 5 mm | 4.4 mm |
B88069X4961T702
TDK Corporation
Package:Interface - Telecom
Price: please inquire
PN512AA0HN1/C2
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
SF2-LP11
Methode Electronics Inc
Package:Interface - Telecom
Price: please inquire
SI2415-FT
Silicon Laboratories Inc
Package:Interface - Telecom
Price: please inquire
RTL8201
Realtek Semiconductor
Package:Interface - Telecom
Price: please inquire
S1T2410B02-D0B0
Samsung Semiconductor
Package:Interface - Telecom
Price: please inquire
MCP2021-330E/MF
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
DP83822IRHB
Texas Instruments
Package:Interface - Telecom
Price: please inquire
TXC-03456-AIPQ
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
SC9149AHN
Hangzhou Silan Microelectronics CO LTD
Package:Interface - Telecom
Price: please inquire
RF2059SB
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
MC209010
RRC power solutions
Package:Interface - Telecom
Price: please inquire
SE5012T
Skyworks Solutions Inc
Package:Interface - Telecom
Price: please inquire
PCD3360T
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
PCD3360T
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
TEA1062AT/C4
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
BCM54991EB0IFSBG
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
TJF1051T
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
PSB6620
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
AN6107SA
Panasonic Electronic Components
Package:Interface - Telecom
Price: please inquire
