The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Number of External Interrupts | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No GX2-X28-TD | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 368 | NATIONAL SEMICONDUCTOR CORP | 3 | PLASTIC/EPOXY | BGA | BGA368,26X26,50 | SQUARE | GRID ARRAY | Obsolete | No | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.27 mm | not_compliant | 30 | S-PBGA-B368 | Not Qualified | 366 MHz | MICROPROCESSOR, RISC | 32 | ||||||||||||||||||||||||||
![]() | Mfr Part No TMPZ84C02AF-6 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 6.144 MHz | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | ON-CHIP CLOCK GENERATOR; BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | 44 | S-PQFP-G44 | Not Qualified | INDUSTRIAL | 6 MHz | MICROPROCESSOR | 24 mA | 8 | 3.05 mm | 16 | NO | YES | 8 | FIXED POINT | NO | 0 | 2 | 14 mm | 14 mm | |||||||
![]() | Mfr Part No SAB80188-1-N | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 20 MHz | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 68 | S-PQCC-J68 | Not Qualified | COMMERCIAL | 10 MHz | MICROPROCESSOR | 550 mA | 16 | 5.1 mm | 20 | NO | NO | 8 | FIXED POINT | NO | 24.3 mm | 24.3 mm | |||||||||
![]() | Mfr Part No XCF5202PU33A | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 215R2PUA13 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LE80539UE0092MX | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PPC460EX-NUB800T | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 728 | 100 MHz | APPLIED MICRO CIRCUITS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | BGA | Yes | 1.3 V | 1.2 V | 1.25 V | Yes | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | NOT SPECIFIED | 728 | S-PBGA-B728 | INDUSTRIAL | 800 MHz | MICROPROCESSOR, RISC | 2.65 mm | 32 | YES | YES | 32 | FLOATING POINT | YES | 35 mm | 35 mm | |||||||||||
![]() | Mfr Part No PPC440EPX-STA400T | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 680 | 66.66 MHz | APPLIED MICRO CIRCUITS CORP | PLASTIC/EPOXY | BGA | BGA, BGA680,34X34,40 | BGA680,34X34,40 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 1.6 V | 1.425 V | 1.5 V | No | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | NOT SPECIFIED | 680 | S-PBGA-B680 | Not Qualified | 400 MHz | MICROPROCESSOR, RISC | 3350 mA | 32 | 2.65 mm | 32 | YES | YES | 64 | FLOATING POINT | YES | 35 mm | 35 mm | ||||||||||
![]() | Mfr Part No XPC7450RX600LE | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 483 | 133 MHz | FREESCALE SEMICONDUCTOR INC | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 1.85 V | 1.55 V | 1.6 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 483 | S-CBGA-B483 | Not Qualified | 600 MHz | MICROPROCESSOR, RISC | 32 | 3.22 mm | 36 | YES | YES | 64 | FLOATING POINT | YES | 29 mm | 29 mm | ||||||||||||||||
![]() | Mfr Part No XPC7450RX600LE | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 483 | 133 MHz | MOTOROLA INC | CERAMIC, METAL-SEALED COFIRED | BGA | 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483 | SQUARE | GRID ARRAY | Obsolete | 1.85 V | 1.55 V | 1.6 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-CBGA-B483 | Not Qualified | 600 MHz | MICROPROCESSOR, RISC | 32 | 3.22 mm | 36 | YES | YES | 64 | FLOATING POINT | YES | 29 mm | 29 mm | ||||||||||||||||||
![]() | Mfr Part No BX80551PE2666FN | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 775 | INTEL CORP | PLASTIC/EPOXY | LGA | LGA, LGA775,30X33,46/43 | LGA775,30X33,46/43 | RECTANGULAR | GRID ARRAY | Obsolete | 1.3 V | 3A991.A.1 | 8473.30.11.80 | BOTTOM | NO LEAD | 1.1 mm | unknown | R-PBGA-N775 | Not Qualified | 2.6 MHz | MICROPROCESSOR, RISC | 125000 mA | 32 | ||||||||||||||||||||||||||||
![]() | Mfr Part No R6512AP | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 2 MHz | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | Not Qualified | COMMERCIAL | 2 MHz | MICROPROCESSOR | 133 mA | 8 | 5.08 mm | 16 | NO | NO | 8 | FIXED POINT | NO | 0 | 2 | 52.07 mm | 15.24 mm | ||||||||
![]() | Mfr Part No R6512AP | Rockwell Automation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | ROCKWELL AUTOMATION | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Contact Manufacturer | 5.25 V | 4.75 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | compliant | R-PDIP-T40 | COMMERCIAL | 2 MHz | MICROPROCESSOR | 8 | 16 | NO | NO | 8 | FIXED POINT | NO | |||||||||||||||||||||||
![]() | Mfr Part No LE80537LG0254M | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 479 | INTEL CORP | PLASTIC/EPOXY | HBGA | HBGA, | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Obsolete | BGA | Yes | 1.3 V | 0.75 V | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | 479 | S-PBGA-B479 | Not Qualified | 1600 MHz | MICROPROCESSOR | 64 | 2.963 mm | 36 | NO | YES | 64 | YES | 35 mm | 35 mm | ||||||||||||||||||
![]() | Mfr Part No SDA3600IAA3CN | AMD | Datasheet | 102 | - | Min: 1 Mult: 1 | NO | 940 | ADVANCED MICRO DEVICES INC | CERAMIC | SPGA | SPGA, PGA940,31X31,50 | PGA940,31X31,50 | SQUARE | GRID ARRAY, SHRINK PITCH | Obsolete | 3A991.A.2 | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 1.27 mm | unknown | S-XPGA-P940 | Not Qualified | 2000 MHz | MICROPROCESSOR, RISC | 44800 mA | 64 | |||||||||||||||||||||||||||||
![]() | Mfr Part No PPC440SPE-AGB533C | Applied Micro Circuits Corporation | Datasheet | 62 | - | Min: 1 Mult: 1 | YES | 675 | 66.66 MHz | APPLIED MICRO CIRCUITS CORP | 1 | PLASTIC/EPOXY | BGA | BGA, BGA675,26X26,40 | BGA675,26X26,40 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 1.575 V | 1.425 V | 1.5 V | No | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | 675 | S-PBGA-B675 | Not Qualified | 533 MHz | MICROPROCESSOR, RISC | 5400 mA | 32 | 3.22 mm | 32 | YES | YES | 64 | FIXED POINT | YES | 27 mm | 27 mm | |||||||||||
![]() | Mfr Part No TSC695F-25SASV | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | MICROCHIP TECHNOLOGY INC | 125 °C | -55 °C | PLASTIC/EPOXY | QFF | MQFP-256 | SQUARE | FLATPACK | Active | 5.5 V | 4.5 V | 5 V | e4 | 3A001.A.2.C | GOLD | 8542.31.00.01 | QUAD | FLAT | 0.508 mm | compliant | S-PQFP-F256 | MILITARY | 25 MHz | MICROPROCESSOR, RISC | 32 | 3.18 mm | 32 | YES | YES | 32 | FLOATING POINT | NO | 37.085 mm | 37.085 mm | |||||||||||||||
![]() | Mfr Part No TMPM4KNFYFG | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | TOSHIBA CORP | , | Not Recommended | 8542.31.00.01 | unknown | MICROPROCESSOR, RISC | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC68HC001FC10 | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 10 MHz | MOTOROLA INC | 70 °C | PLASTIC/EPOXY | BQFP | BQFP, SPQFP68,.7SQ | SPQFP68,.7SQ | SQUARE | FLATPACK, BUMPER | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.635 mm | unknown | 68 | S-PQFP-G68 | Not Qualified | COMMERCIAL | 10 MHz | MICROPROCESSOR | 30 mA | 32 | 3.04 mm | 24 | NO | NO | 16 | FIXED POINT | NO | 0 | 3 | 13.97 mm | 13.97 mm | ||||||||
![]() | Mfr Part No P2020MN2MHC | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | TELEDYNE E2V (UK) LTD | TBGA-689 | Obsolete | Yes | e2 | 3A001.A.2.C | Tin/Silver (Sn96.5Ag3.5) | 8542.31.00.01 | compliant |
GX2-X28-TD
National Semiconductor Corporation
Package:Embedded - Microprocessors
Price: please inquire
TMPZ84C02AF-6
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
SAB80188-1-N
Infineon Technologies AG
Package:Embedded - Microprocessors
Price: please inquire
XCF5202PU33A
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
215R2PUA13
AMD
Package:Embedded - Microprocessors
Price: please inquire
LE80539UE0092MX
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
PPC460EX-NUB800T
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
PPC440EPX-STA400T
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
XPC7450RX600LE
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
XPC7450RX600LE
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
BX80551PE2666FN
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
R6512AP
Conexant Systems Inc
Package:Embedded - Microprocessors
Price: please inquire
R6512AP
Rockwell Automation
Package:Embedded - Microprocessors
Price: please inquire
LE80537LG0254M
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
SDA3600IAA3CN
AMD
Package:Embedded - Microprocessors
Price: please inquire
PPC440SPE-AGB533C
Applied Micro Circuits Corporation
Package:Embedded - Microprocessors
Price: please inquire
TSC695F-25SASV
Microchip Technology Inc
Package:Embedded - Microprocessors
Price: please inquire
TMPM4KNFYFG
Toshiba America Electronic Components
Package:Embedded - Microprocessors
Price: please inquire
MC68HC001FC10
Motorola Mobility LLC
Package:Embedded - Microprocessors
Price: please inquire
P2020MN2MHC
Teledyne e2v
Package:Embedded - Microprocessors
Price: please inquire
