Embedded - PLDs (Programmable Logic Device) (2797)

-

-

Min: 1

Mult: 1

YES

28

25 MHz

PHILIPS COMPONENTS

12

75 °C

PLASTIC/EPOXY

SQUARE

CHIP CARRIER

Obsolete

5.25 V

4.75 V

5 V

OUTPUT MACROCELL STRUCTURE; REGISTER PRELOAD

8542.39.00.01

QUAD

J BEND

unknown

S-PQCC-J28

Not Qualified

COMMERCIAL EXTENDED

55 ns

8 DEDICATED INPUTS, 12 I/O

OT PLD

MACROCELL

8

-

-

Min: 1

Mult: 1

YES

28

14.9 MHz

NXP SEMICONDUCTORS

1

12

75 °C

PLASTIC/EPOXY

QCCJ

0.450 INCH, PLASTIC, LCC-28

LDCC28,.5SQ

SQUARE

CHIP CARRIER

Obsolete

QLCC

No

5.25 V

4.75 V

5 V

PROGRAMMABLE MULTI-FUNCTION PLD; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; REGISTER PRELOAD

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

28

S-PQCC-J28

12

Not Qualified

COMMERCIAL EXTENDED

55 ns

PLS-TYPE

42

8 DEDICATED INPUTS, 12 I/O

4.57 mm

OT PLD

MACROCELL

8

105

11.505 mm

11.505 mm

66
In Stock

-

Min: 1

Mult: 1

YES

68

67 MHz

XILINX INC

48

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ,

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

5.5 V

4.5 V

5 V

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

68

S-PQCC-J68

Not Qualified

INDUSTRIAL

14.5 ns

2 DEDICATED INPUTS, 48 I/O

4.57 mm

EE PLD

MACROCELL

2

24.2316 mm

24.2316 mm

-

-

Min: 1

Mult: 1

YES

160

91 MHz

XILINX INC

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP,

SQUARE

FLATPACK

Obsolete

QFP

3.63 V

2.97 V

3.3 V

8542.39.00.01

QUAD

GULL WING

unknown

160

S-PQFP-G160

Not Qualified

INDUSTRIAL

9.5 ns

LOADABLE PLD

MACROCELL

548
In Stock

-

Min: 1

Mult: 1

YES

144

167 MHz

XILINX INC

3

116

70 °C

PLASTIC/EPOXY

LFQFP

QFP-144

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Transferred

QFP

No

3.6 V

3 V

3.3 V

e4

No

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

QUAD

GULL WING

NOT SPECIFIED

0.5 mm

compliant

NOT SPECIFIED

144

S-PQFP-G144

Not Qualified

COMMERCIAL

7.5 ns

116 I/O

1.6 mm

EE PLD

MACROCELL

20 mm

20 mm

132
In Stock

-

Min: 1

Mult: 1

YES

160

67 MHz

XILINX INC

3

108

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP,

SQUARE

FLATPACK

Obsolete

QFP

Yes

5.5 V

4.5 V

5 V

e3

MATTE TIN

8542.39.00.01

QUAD

GULL WING

0.65 mm

compliant

160

S-PQFP-G160

Not Qualified

INDUSTRIAL

10 ns

0 DEDICATED INPUTS, 108 I/O

4.1 mm

FLASH PLD

MACROCELL

28 mm

28 mm

-

-

Min: 1

Mult: 1

YES

44

PHILIPS SEMICONDUCTORS

70 °C

PLASTIC/EPOXY

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

Transferred

No

3.3 V

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

GULL WING

0.8 mm

unknown

S-PQFP-G44

Not Qualified

COMMERCIAL

11.5 ns

EE PLD

64

YES

YES

-

-

Min: 1

Mult: 1

YES

44

XILINX INC

3

70 °C

PLASTIC/EPOXY

QFP

QFP, TQFP44,.47SQ,32

TQFP44,.47SQ,32

SQUARE

FLATPACK

Obsolete

No

3.3 V

YES

8542.39.00.01

QUAD

GULL WING

240

0.8 mm

unknown

30

S-PQFP-G44

Not Qualified

COMMERCIAL

11.5 ns

EE PLD

64

YES

YES

-

-

Min: 1

Mult: 1

YES

44

83 MHz

NXP SEMICONDUCTORS

32

70 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

Obsolete

3.6 V

3 V

3.3 V

8542.39.00.01

QUAD

GULL WING

0.8 mm

unknown

S-PQFP-G44

Not Qualified

COMMERCIAL

11.5 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

2

10 mm

10 mm

-

-

Min: 1

Mult: 1

YES

44

80 MHz

CYPRESS SEMICONDUCTOR CORP

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

PLASTIC, LCC-44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

5.5 V

4.5 V

5 V

e0

TIN LEAD

IN-SYSTEM RE-PROGRAMMABLE; 64 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

QUAD

J BEND

1.27 mm

not_compliant

44

S-PQCC-J44

Not Qualified

INDUSTRIAL

12 ns

3 DEDICATED INPUTS, 32 I/O

4.572 mm

FLASH PLD

MACROCELL

64

NO

3

YES

16.6116 mm

16.6116 mm

646
In Stock

-

Min: 1

Mult: 1

YES

68

77 MHz

XILINX INC

48

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ,

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

5.5 V

4.5 V

5 V

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

68

S-PQCC-J68

Not Qualified

INDUSTRIAL

12.5 ns

2 DEDICATED INPUTS, 48 I/O

4.57 mm

EE PLD

MACROCELL

2

24.2316 mm

24.2316 mm

670
In Stock

-

Min: 1

Mult: 1

YES

144

XILINX INC

3

117

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

PLASTIC, CSP-144

BGA144,13X13,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

No

2.6 V

2.4 V

2.5 V

e0

TIN LEAD

8542.39.00.01

BOTTOM

BALL

0.8 mm

compliant

144

S-PBGA-B144

Not Qualified

INDUSTRIAL

4 ns

0 DEDICATED INPUTS, 117 I/O

1.2 mm

FLASH PLD

REGISTERED

12 mm

12 mm

-

-

Min: 1

Mult: 1

YES

128

66 MHz

XILINX INC

96

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

LFQFP,

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

5.5 V

4.5 V

5 V

128 MACROCELLS

8542.39.00.01

QUAD

GULL WING

0.5 mm

unknown

128

R-PQFP-G128

Not Qualified

INDUSTRIAL

12 ns

2 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

MACROCELL

2

20 mm

14 mm

293
In Stock

-

Min: 1

Mult: 1

YES

352

100 MHz

XILINX INC

3

192

70 °C

PLASTIC/EPOXY

LBGA

PLASTIC, BGA-352

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

BGA

No

3.6 V

3 V

3.3 V

e0

Tin/Lead (Sn63Pb37)

288 MACROCELLS

8542.39.00.01

BOTTOM

BALL

225

1.27 mm

not_compliant

30

352

S-PBGA-B352

Not Qualified

COMMERCIAL

10 ns

0 DEDICATED INPUTS, 192 I/O

1.7 mm

FLASH PLD

MACROCELL

288

YES

YES

35 mm

35 mm

-

-

Min: 1

Mult: 1

YES

100

59 MHz

NXP SEMICONDUCTORS

80

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TFQFP,

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Transferred

3.6 V

3 V

3.3 V

8542.39.00.01

QUAD

GULL WING

0.5 mm

unknown

S-PQFP-G100

Not Qualified

INDUSTRIAL

17.5 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm

-

-

Min: 1

Mult: 1

NO

24

28.5 MHz

INTEL CORP

12

70 °C

PLASTIC/EPOXY

DIP

DIP, DIP24,.3

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.25 V

4.75 V

5 V

e0

TIN LEAD

PAL WITH MACROCELLS; 12 MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

24

R-PDIP-T24

12

Not Qualified

COMMERCIAL

25 ns

PAL-TYPE

22

8 DEDICATED INPUTS, 12 I/O

4.32 mm

OT PLD

MACROCELL

8

200

31.61 mm

7.62 mm

122
In Stock

-

Min: 1

Mult: 1

YES

280

167 MHz

ADVANCED MICRO DEVICES INC

3

160

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

CHIP SCALE, BGA-280

BGA280,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

No

3.6 V

2.7 V

3.3 V

e0

TIN LEAD

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B280

Not Qualified

INDUSTRIAL

7.5 ns

160 I/O

1.2 mm

EE PLD

MACROCELL

16 mm

16 mm

-

-

Min: 1

Mult: 1

YES

44

77 MHz

NXP SEMICONDUCTORS

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

TQFP,

SQUARE

FLATPACK, THIN PROFILE

Transferred

5.5 V

4.5 V

5 V

8542.39.00.01

QUAD

GULL WING

0.8 mm

unknown

S-PQFP-G44

Not Qualified

INDUSTRIAL

12.5 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

2

10 mm

10 mm

-

-

Min: 1

Mult: 1

YES

128

63 MHz

NXP SEMICONDUCTORS

96

70 °C

PLASTIC/EPOXY

LFQFP

LFQFP,

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

Transferred

3.63 V

2.97 V

3.3 V

128 MACROCELLS

8542.39.00.01

QUAD

GULL WING

0.5 mm

unknown

R-PQFP-G128

Not Qualified

COMMERCIAL

14.5 ns

2 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

MACROCELL

2

20 mm

14 mm

-

-

Min: 1

Mult: 1

YES

128

63 MHz

XILINX INC

96

70 °C

PLASTIC/EPOXY

LFQFP

LFQFP,

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

3.63 V

2.97 V

3.3 V

128 MACROCELLS

8542.39.00.01

QUAD

GULL WING

0.5 mm

unknown

128

R-PQFP-G128

Not Qualified

COMMERCIAL

14.5 ns

2 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

MACROCELL

2

20 mm

14 mm