The category is 'Embedded - PLDs (Programmable Logic Device)'
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- Base Part Number
- Moisture Sensitivity Level (MSL)
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- Programmable Type
- RoHS Status
- Frequency
- Max Operating Temperature
- Max Supply Voltage
- Min Operating Temperature
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Packing Method | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
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 | Mfr Part No XC9572F-10PQG100I | AMD Xilinx | Datasheet | 425 | - | Min: 1 Mult: 1 | YES | 100 | 67 MHz | XILINX INC | 3 | 72 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | Yes | 5.5 V | 4.5 V | 5 V | e3 | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | INDUSTRIAL | 10 ns | 0 DEDICATED INPUTS, 72 I/O | 3.4 mm | FLASH PLD | MACROCELL | 20 mm | 14 mm | |||||||||||||||||
 | Mfr Part No EPM7128AETC144-4 | Altera Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 250 MHz | ALTERA CORP | 100 | 70 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 3.6 V | 3 V | 3.3 V | e3 | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | 144 | S-PQFP-G144 | Not Qualified | COMMERCIAL | 4.5 ns | 0 DEDICATED INPUTS, 100 I/O | 1.6 mm | EE PLD | MACROCELL | 20 mm | 20 mm | ||||||||||||||||||||
 | Mfr Part No PZ3128-S15BB2-T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | 59 MHz | NXP SEMICONDUCTORS | 96 | 70 °C | PLASTIC/EPOXY | QFP | QFP, | QFP160,1.2SQ | SQUARE | FLATPACK | Transferred | 3.6 V | 3 V | 3.3 V | 8542.39.00.01 | QUAD | GULL WING | 0.65 mm | unknown | S-PQFP-G160 | Not Qualified | COMMERCIAL | 17.5 ns | 2 DEDICATED INPUTS, 96 I/O | 4.07 mm | EE PLD | MACROCELL | 2 | 28 mm | 28 mm | ||||||||||||||||||||||
 | Mfr Part No XCR5064C-12PC44I | AMD Xilinx | Datasheet | 312 | - | Min: 1 Mult: 1 | YES | 44 | 67 MHz | XILINX INC | 3 | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | YES | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 30 | 44 | S-PQCC-J44 | Not Qualified | INDUSTRIAL | 12 ns | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | MACROCELL | 64 | YES | 2 | YES | 16.5862 mm | 16.5862 mm | |||||||||
 | Mfr Part No XCR3320-10BG256C | AMD Xilinx | Datasheet | 672 | - | Min: 1 Mult: 1 | YES | 256 | 87 MHz | XILINX INC | 3 | 3 | 70 °C | PLASTIC/EPOXY | BGA | PLASTIC, BGA-256 | BGA256,20X20,50 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 3.6 V | 3 V | 3.3 V | e0 | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | not_compliant | 30 | 256 | S-PBGA-B256 | Not Qualified | COMMERCIAL | 10 ns | 12 DEDICATED INPUTS, 3 I/O | 2.55 mm | LOADABLE PLD | MACROCELL | 320 | YES | 12 | YES | 27 mm | 27 mm | ||||||||||
| Mfr Part No PZ5128CS10BE-T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | 71 MHz | NXP SEMICONDUCTORS | 96 | 70 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | Transferred | 5.25 V | 4.75 V | 5 V | 128 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | R-PQFP-G128 | Not Qualified | COMMERCIAL | 12 ns | 2 DEDICATED INPUTS, 96 I/O | 1.6 mm | EE PLD | MACROCELL | 2 | 20 mm | 14 mm | |||||||||||||||||||||
| Mfr Part No XC7236-25PC44I | AMD Xilinx | Datasheet | 738 | - | Min: 1 Mult: 1 | YES | 44 | 33 MHz | XILINX INC | 3 | 30 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 36 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V; 3 EXTERNAL CLOCKS | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 30 | 44 | S-PQCC-J44 | Not Qualified | INDUSTRIAL | 40 ns | 2 DEDICATED INPUTS, 30 I/O | 4.57 mm | OT PLD | MACROCELL | 36 | NO | 2 | NO | 16.5862 mm | 16.5862 mm | |||||||||
 | Mfr Part No EPM9560RC240-25 | Altera Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 240 | 66.7 MHz | ALTERA CORP | 191 | 70 °C | PLASTIC/EPOXY | HFQFP | HFQFP, | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | 5.25 V | 4.75 V | 5 V | e3 | MATTE TIN | 560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | 240 | S-PQFP-G240 | Not Qualified | COMMERCIAL | 25 ns | 0 DEDICATED INPUTS, 191 I/O | 4.1 mm | EE PLD | MACROCELL | 32 mm | 32 mm | |||||||||||||||||||
| Mfr Part No PAL16R8DMJ/883B | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | 37 MHz | ROCHESTER ELECTRONICS LLC | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | DIP20,.3 | RECTANGULAR | IN-LINE | Active | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | unknown | NOT SPECIFIED | R-GDIP-T20 | MILITARY | 12 ns | 8 DEDICATED INPUTS, 0 I/O | OT PLD | REGISTERED | 8 | ||||||||||||||||||||||||
 | Mfr Part No PAL16R8DMJ/883B | AMD | Datasheet | 498 | - | Min: 1 Mult: 1 | NO | 20 | 37 MHz | ADVANCED MICRO DEVICES INC | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 20 | R-GDIP-T20 | 8 | Not Qualified | MILITARY | 12 ns | PAL-TYPE | 8 | 8 DEDICATED INPUTS, 0 I/O | OT PLD | 38535Q/M;38534H;883B | REGISTERED | 8 | 64 | ||||||||||||||
| Mfr Part No XH95180-10HQG208I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | ADVANCED MICRO DEVICES INC | 3 | 168 | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | Yes | 5 V | e3 | MATTE TIN | QUAD | GULL WING | 245 | 0.5 mm | compliant | 30 | S-PQFP-G208 | Not Qualified | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | MACROCELL | 28 mm | 28 mm | |||||||||||||||||||||||||
| Mfr Part No P3Z22V10-DDH | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 80 MHz | XILINX INC | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP24,.25 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 0.635 mm | unknown | R-PDSO-G24 | 10 | Not Qualified | COMMERCIAL | 10 ns | PAL-TYPE | 22 | EE PLD | MACROCELL | 132 | |||||||||||||||||||||||
 | Mfr Part No P3Z22V10-DDH | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 83 MHz | NXP SEMICONDUCTORS | 10 | 70 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, PLASTIC, SOT-355-1, TSSOP-24 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | 3.6 V | 3 V | 3.3 V | 8542.39.00.01 | DUAL | GULL WING | 0.65 mm | unknown | 24 | R-PDSO-G24 | Not Qualified | COMMERCIAL | 10 ns | 11 DEDICATED INPUTS, 10 I/O | 1.1 mm | EE PLD | MACROCELL | 11 | 7.8 mm | 4.4 mm | ||||||||||||||||||||
| Mfr Part No PZ3064DS10BP | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | PHILIPS SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | TQFP100,.63SQ | SQUARE | FLATPACK | Transferred | No | e0 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 11.5 ns | EE PLD | 64 | YES | YES | ||||||||||||||||||||||||||
| Mfr Part No PZ3064DS10BP | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | XILINX INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK | Obsolete | No | YES | 8542.39.00.01 | QUAD | GULL WING | 240 | 0.5 mm | unknown | 30 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 11.5 ns | EE PLD | 64 | YES | YES | ||||||||||||||||||||||||
| Mfr Part No PZ5032-10BC-S | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 59 MHz | XILINX INC | 3 | 32 | 70 °C | PLASTIC/EPOXY | TQFP | 10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | 32 MACROCELLS | 8542.39.00.01 | TRAY | QUAD | GULL WING | 240 | 0.8 mm | unknown | 30 | 44 | S-PQFP-G44 | Not Qualified | COMMERCIAL | 12.5 ns | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | MACROCELL | 32 | NO | 2 | NO | 10 mm | 10 mm | |||||||||||
| Mfr Part No PZ5032-10BC-S | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | SQUARE | FLATPACK | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | NO | 8542.39.00.01 | TRAY | QUAD | GULL WING | 0.8 mm | unknown | S-PQFP-G44 | Not Qualified | COMMERCIAL | 12.5 ns | EE PLD | 32 | NO | NO | ||||||||||||||||||||||||
| Mfr Part No XC7336-15WC44M | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 41.67 MHz | XILINX INC | 32 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | LCC | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | CONFIGURABLE 3.3V OR 5V I/O OPERATION; 18 OUTPUT MACROCELLS | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 44 | S-CQCC-J44 | Not Qualified | MILITARY | 23 ns | 0 DEDICATED INPUTS, 32 I/O | 4.826 mm | UV PLD | MACROCELL | 16.51 mm | 16.51 mm | ||||||||||||||||||
| Mfr Part No PZ3032CS10A44-T | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 57 MHz | XILINX INC | 32 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LPCC | 3.63 V | 2.97 V | 3.3 V | 32 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 44 | S-PQCC-J44 | Not Qualified | COMMERCIAL | 13 ns | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | MACROCELL | 2 | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||
| Mfr Part No PAL16R6AMJ/883B | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | 20 MHz | ROCHESTER ELECTRONICS LLC | 2 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | CERAMIC, DIP-20 | DIP20,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | DIP | No | 5.5 V | 4.5 V | 5 V | No | 3A001.A.2.C | PAL; REGISTER PRELOAD; POWER-UP RESET | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | unknown | NOT SPECIFIED | 20 | R-CDIP-T20 | Not Qualified | MILITARY | 30 ns | 8 DEDICATED INPUTS, 2 I/O | 5.08 mm | OT PLD | MIXED | 8 | 24.257 mm | 7.62 mm |
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XC9572F-10PQG100I
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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EPM7128AETC144-4
Altera Corporation
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ3128-S15BB2-T
NXP Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XCR5064C-12PC44I
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XCR3320-10BG256C
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ5128CS10BE-T
NXP Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC7236-25PC44I
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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EPM9560RC240-25
Altera Corporation
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PAL16R8DMJ/883B
Rochester Electronics LLC
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PAL16R8DMJ/883B
AMD
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XH95180-10HQG208I
AMD
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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P3Z22V10-DDH
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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P3Z22V10-DDH
NXP Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ3064DS10BP
Philips Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ3064DS10BP
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ5032-10BC-S
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ5032-10BC-S
Philips Semiconductors
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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XC7336-15WC44M
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PZ3032CS10A44-T
AMD Xilinx
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire
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PAL16R6AMJ/883B
Rochester Electronics LLC
Package:Embedded - PLDs (Programmable Logic Device)
Price: please inquire