Embedded - PLDs (Programmable Logic Device) (2797)

-

-

Min: 1

Mult: 1

YES

160

87 MHz

NXP SEMICONDUCTORS

96

70 °C

PLASTIC/EPOXY

QFP

QFP,

QFP160,1.2SQ

SQUARE

FLATPACK

Transferred

5.25 V

4.75 V

5 V

8542.39.00.01

QUAD

GULL WING

0.65 mm

unknown

S-PQFP-G160

Not Qualified

COMMERCIAL

10 ns

2 DEDICATED INPUTS, 96 I/O

4.07 mm

EE PLD

MACROCELL

2

28 mm

28 mm

-

-

Min: 1

Mult: 1

YES

84

67 MHz

NXP SEMICONDUCTORS

64

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

PEDESTAL, PLASTIC, SOT-189-3, LCC-84

SQUARE

CHIP CARRIER

Obsolete

LCC

5.5 V

4.5 V

5 V

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

84

S-PQCC-J84

Not Qualified

INDUSTRIAL

14.5 ns

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

2

29.3116 mm

29.3116 mm

-

-

Min: 1

Mult: 1

NO

20

22 MHz

CYPRESS SEMICONDUCTOR CORP

6

75 °C

PLASTIC/EPOXY

DIP

0.300 INCH, PLASTIC, DIP-20

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.5 V

4.5 V

5 V

e0

No

TIN LEAD

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

20

R-PDIP-T20

8

Not Qualified

COMMERCIAL EXTENDED

25 ns

PAL-TYPE

16

10 DEDICATED INPUTS, 6 I/O

4.826 mm

OT PLD

COMBINATORIAL

10

64

25.527 mm

7.62 mm

-

-

Min: 1

Mult: 1

YES

100

33.3 MHz

ALTERA CORP

64

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQFP

WQFP, QFP100,.7X.9

QFP100,.7X.9

RECTANGULAR

FLATPACK, WINDOW

Obsolete

QFP

No

5.5 V

4.5 V

5 V

e0

TIN LEAD

LABS INTERCONNECTED BY PIA; 12 LABS; 192 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

QUAD

GULL WING

220

0.65 mm

unknown

100

R-CQFP-G100

Not Qualified

INDUSTRIAL

55 ns

7 DEDICATED INPUTS, 64 I/O

3.35 mm

UV PLD

MACROCELL

192

NO

7

NO

19.2 mm

13.2 mm

-

-

Min: 1

Mult: 1

YES

44

PHILIPS SEMICONDUCTORS

70 °C

PLASTIC/EPOXY

QFP

QFP, TQFP44,.47SQ,32

TQFP44,.47SQ,32

SQUARE

FLATPACK

Transferred

No

3.3 V

e0

Tin/Lead (Sn/Pb)

NO

8542.39.00.01

TRAY

QUAD

GULL WING

0.8 mm

unknown

S-PQFP-G44

Not Qualified

COMMERCIAL

12 ns

EE PLD

32

NO

NO

523
In Stock

-

Min: 1

Mult: 1

YES

44

47 MHz

XILINX INC

3

32

70 °C

PLASTIC/EPOXY

TQFP

10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-44

TQFP44,.47SQ,32

SQUARE

FLATPACK, THIN PROFILE

Obsolete

QFP

No

3.63 V

2.97 V

3.3 V

e0

TIN LEAD

32 MACROCELLS

8542.39.00.01

TRAY

QUAD

GULL WING

240

0.8 mm

not_compliant

30

44

S-PQFP-G44

Not Qualified

COMMERCIAL

15 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

32

NO

2

NO

10 mm

10 mm

-

-

Min: 1

Mult: 1

YES

100

67 MHz

XILINX INC

3

72

70 °C

PLASTIC/EPOXY

QFP

PLASTIC, QFP-100

QFP100,.7X.9

RECTANGULAR

FLATPACK

Obsolete

QFP

No

5.25 V

4.75 V

5 V

e0

Tin/Lead (Sn85Pb15)

NO

8542.39.00.01

QUAD

GULL WING

225

0.65 mm

not_compliant

30

100

R-PQFP-G100

Not Qualified

COMMERCIAL

10 ns

0 DEDICATED INPUTS, 72 I/O

3.4 mm

FLASH PLD

MACROCELL

72

YES

NO

20 mm

14 mm

500
In Stock

-

Min: 1

Mult: 1

YES

84

66 MHz

XILINX INC

3

64

70 °C

PLASTIC/EPOXY

QCCJ

PLASTIC, LCC-84

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

3.63 V

2.97 V

3.3 V

e0

TIN LEAD

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

84

S-PQCC-J84

Not Qualified

COMMERCIAL

12 ns

2 DEDICATED INPUTS, 64 I/O

5.08 mm

EE PLD

MACROCELL

128

YES

2

YES

29.3116 mm

29.3116 mm

-

-

Min: 1

Mult: 1

NO

24

25 MHz

PHILIPS COMPONENTS

12

75 °C

CERAMIC, METAL-SEALED COFIRED

DIP-24

RECTANGULAR

IN-LINE

Obsolete

5.25 V

4.75 V

5 V

OUTPUT MACROCELL STRUCTURE; REGISTER PRELOAD

8542.39.00.01

DUAL

THROUGH-HOLE

unknown

R-CDIP-T24

Not Qualified

COMMERCIAL EXTENDED

55 ns

8 DEDICATED INPUTS, 12 I/O

UV PLD

MACROCELL

8

-

-

Min: 1

Mult: 1

NO

24

14.9 MHz

NXP SEMICONDUCTORS

1

12

75 °C

CERAMIC, GLASS-SEALED

DIP

0.300 INCH, CERAMIC, DIP-24

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5.25 V

4.75 V

5 V

PROGRAMMABLE MULTI-FUNCTION PLD; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; REGISTER PRELOAD

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

24

R-GDIP-T24

12

Not Qualified

COMMERCIAL EXTENDED

55 ns

PLS-TYPE

42

8 DEDICATED INPUTS, 12 I/O

UV PLD

MACROCELL

8

105

-

-

Min: 1

Mult: 1

YES

132

119 MHz

XILINX INC

100

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

8 X 8 MM, 0.50 MM PITCH, CSP-132

BGA132,14X14,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Transferred

BGA

Yes

1.9 V

1.7 V

1.8 V

e3

No

MATTE TIN

8542.39.00.01

BOTTOM

BALL

0.5 mm

compliant

132

S-PBGA-B132

100

Not Qualified

INDUSTRIAL

7.5 ns

PLA-TYPE

100

0 DEDICATED INPUTS, 100 I/O

1.1 mm

FLASH PLD

MACROCELL

128

8 mm

8 mm

8
In Stock

-

Min: 1

Mult: 1

YES

208

83 MHz

CYPRESS SEMICONDUCTOR CORP

160

70 °C

PLASTIC/EPOXY

FQFP

PLASTIC, QFP-208

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

Obsolete

QFP

No

5.25 V

4.75 V

5 V

e0

TIN LEAD

384 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

QUAD

GULL WING

0.5 mm

not_compliant

208

S-PQFP-G208

160

Not Qualified

COMMERCIAL

10 ns

PLA-TYPE

165

1 DEDICATED INPUTS, 160 I/O

3.7 mm

EE PLD

MACROCELL

384

YES

1

YES

28 mm

28 mm

-

-

Min: 1

Mult: 1

YES

128

87 MHz

NXP SEMICONDUCTORS

96

70 °C

PLASTIC/EPOXY

LFQFP

LFQFP,

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

Transferred

5.25 V

4.75 V

5 V

8542.39.00.01

QUAD

GULL WING

0.5 mm

unknown

R-PQFP-G128

Not Qualified

COMMERCIAL

10 ns

2 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

MACROCELL

2

20 mm

14 mm

166
In Stock

-

Min: 1

Mult: 1

YES

44

77 MHz

XILINX INC

3

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

PLASTIC, LCC-44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

Obsolete

LCC

No

3.6 V

2.7 V

3 V

e0

TIN LEAD

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

44

S-PQCC-J44

Not Qualified

INDUSTRIAL

12 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

64

YES

2

YES

16.5862 mm

16.5862 mm

673
In Stock

-

Min: 1

Mult: 1

YES

160

ADVANCED MICRO DEVICES INC

3

133

PLASTIC/EPOXY

QFP

PLASTIC, QFP-160

QFP160,1.2SQ

SQUARE

FLATPACK

Obsolete

Yes

5 V

e3

MATTE TIN

QUAD

GULL WING

245

0.65 mm

compliant

30

S-PQFP-G160

Not Qualified

0 DEDICATED INPUTS, 133 I/O

3.94 mm

MASK PLD

MACROCELL

28 mm

28 mm

-

-

Min: 1

Mult: 1

YES

100

67 MHz

NXP SEMICONDUCTORS

64

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Obsolete

5.5 V

4.5 V

5 V

64 MACROCELLS

8542.39.00.01

QUAD

GULL WING

0.5 mm

unknown

S-PQFP-G100

Not Qualified

INDUSTRIAL

14 ns

2 DEDICATED INPUTS, 64 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm

-

-

Min: 1

Mult: 1

YES

44

LATTICE SEMICONDUCTOR CORP

3

70 °C

PLASTIC/EPOXY

QFP

QFP, TQFP44,.47SQ,32

TQFP44,.47SQ,32

SQUARE

FLATPACK

Obsolete

Yes

5 V

e3

Yes

MATTE TIN

YES

8542.39.00.01

QUAD

GULL WING

260

0.8 mm

compliant

40

S-PQFP-G44

Not Qualified

COMMERCIAL

10 ns

EE PLD

32

YES

YES

626
In Stock

-

Min: 1

Mult: 1

YES

100

77 MHz

XILINX INC

64

70 °C

PLASTIC/EPOXY

QFP

QFP,

RECTANGULAR

FLATPACK

Obsolete

QFP

5.25 V

4.75 V

5 V

64 MACROCELLS

8542.39.00.01

QUAD

GULL WING

0.65 mm

unknown

100

R-PQFP-G100

Not Qualified

COMMERCIAL

12.5 ns

2 DEDICATED INPUTS, 64 I/O

3.4 mm

EE PLD

MACROCELL

2

20 mm

14 mm

-

-

Min: 1

Mult: 1

YES

208

XILINX INC

3

168

PLASTIC/EPOXY

HFQFP

HEAT SINK, QFP-208

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Transferred

QFP

Yes

5 V

e3

Yes

MATTE TIN

8542.39.00.01

QUAD

GULL WING

0.5 mm

compliant

208

S-PQFP-G208

Not Qualified

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

-

-

Min: 1

Mult: 1

YES

208

ADVANCED MICRO DEVICES INC

3

168

PLASTIC/EPOXY

HFQFP

HEAT SINK, QFP-208

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Obsolete

Yes

5 V

e3

MATTE TIN

QUAD

GULL WING

245

0.5 mm

compliant

30

S-PQFP-G208

Not Qualified

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm