The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No MX29LA320DLXCI-70G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 70 ns | MACRONIX INTERNATIONAL CO LTD | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA64,8X8,40 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | unknown | NOT SPECIFIED | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 2MX16 | 1.2 mm | 16 | 0.000015 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 64 | 64K | YES | YES | 13 mm | 10 mm | |||||||||||||||||
![]() | Mfr Part No SST34WA1601-70-5E-MVJE | Greenliant Systems Ltd | Datasheet | - | - | Min: 1 Mult: 1 | GREENLIANT SYSTEMS LTD | , | Obsolete | EAR99 | 8542.32.00.51 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29PL127J60TFI13 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 60 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 20 X 14 MM, LEAD FREE, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | Yes | 3 V | e3 | EAR99 | NOR TYPE | Matte Tin (Sn) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 8MX16 | 1.2 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,254 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm | |||||||||||||||
![]() | Mfr Part No XC1765EPC2OI | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | 10 MHz | XILINX INC | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Transferred | No | 5 V | EAR99 | 8542.32.00.71 | QUAD | J BEND | 1.27 mm | not_compliant | S-PQCC-J20 | Not Qualified | INDUSTRIAL | 0.01 mA | 64KX1 | 3-STATE | 1 | 0.00005 A | 65536 bit | COMMON | CONFIGURATION MEMORY | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC1765EPC2OI | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | 120 ns | 10 MHz | ADVANCED MICRO DEVICES INC | 65536 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Active | No | 5 V | QUAD | J BEND | 1 | 1.27 mm | compliant | S-PQCC-J20 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.01 mA | 256KX16 | 3-STATE | 16 | 0.00005 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No E28F016SC-95 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 95 ns | INTEL CORP | 2097152 words | 2000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP40,.8,20 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | USER SELECTABLE 5V OR 12V VPP | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 40 | R-PDSO-G40 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.05 mA | 2MX8 | 3-STATE | 1.2 mm | 8 | 0.00001 A | 16777216 bit | PARALLEL | FLASH | 3.3 V | NO | NO | YES | 32 | 64K | YES | 18.4 mm | 10 mm | ||||||||||||||||||
![]() | Mfr Part No MX29F400TMC-55 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 55 ns | MACRONIX INTERNATIONAL CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP44,.63 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | EAR99 | NOR TYPE | 100,000 MINIMUM ERASE/PROGRAM CYCLES | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 44 | R-PDSO-G44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 256KX16 | 3 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | 28.5 mm | 12.6 mm | ||||||||||||||||
![]() | Mfr Part No KFG1216U2A-DIB6 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 11.5 ns | SAMSUNG SEMICONDUCTOR INC | 1 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA63,10X12,32 | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | Yes | 3.3 V | e3 | Yes | EAR99 | MATTE TIN | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B63 | Not Qualified | INDUSTRIAL | 0.04 mA | 32MX16 | 16 | 0.00008 A | 536870912 bit | PARALLEL | FLASH | NO | NO | YES | 512 | 64K | 1K words | YES | |||||||||||||||||||||||||||
![]() | Mfr Part No M58BW016BB80T3F | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | 80 ns | NUMONYX | 524288 words | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | QFP | PLASTIC, QFP-80 | RECTANGULAR | FLATPACK | Obsolete | QFP | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn85Pb15) | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | 3.6 V | AUTOMOTIVE | 2.7 V | ASYNCHRONOUS | 512KX32 | 3.4 mm | 32 | 16777216 bit | PARALLEL | FLASH | 3 V | BOTTOM | 20 mm | 14 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No M58BW016BB80T3F | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | 80 ns | STMICROELECTRONICS | 524288 words | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | QFP | PLASTIC, QFP-80 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Transferred | QFP | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | QUAD | GULL WING | 1 | 0.8 mm | not_compliant | 80 | R-PQFP-G80 | Not Qualified | 3.6 V | AUTOMOTIVE | 2.7 V | ASYNCHRONOUS | 0.03 mA | 512KX32 | 3.4 mm | 32 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | NO | NO | YES | 8,31 | 2K,16K | BOTTOM | YES | 20 mm | 14 mm | |||||||||||||||||
![]() | Mfr Part No CY7C291-50DMB | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 50 ns | CYPRESS SEMICONDUCTOR CORP | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | 0.300 INCH, SLIM, CERDIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 24 | R-GDIP-T24 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.12 mA | 2KX8 | 3-STATE | 8 | 0.12 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | OTP ROM | 13.5 V | |||||||||||||||||||||||||
![]() | Mfr Part No SST39VF6401B-70-4I-B1K | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | MICROCHIP TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 8 X 10 MM, 0.80 MM PITCH, MO-210, TFBGA-48 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 2.7 V | BOTTOM | 10 mm | 8 mm | |||||||||||||||||||||||||
![]() | Mfr Part No MX29GA321EHXCI-70G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 70 ns | MACRONIX INTERNATIONAL CO LTD | 67108864 words | 64000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA64,8X8,40 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | unknown | NOT SPECIFIED | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.1 mA | 64MX16 | 1.2 mm | 16 | 0.0001 A | 1073741824 bit | PARALLEL | FLASH | 3 V | 70 ms | 8 | YES | YES | YES | 64 | 64K | 8/16 words | YES | YES | 13 mm | 10 mm | |||||||||||||||
![]() | Mfr Part No FM27C010V45L | Fairchild Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 45 ns | FAIRCHILD SEMICONDUCTOR CORP | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | No | EAR99 | TIN LEAD | TTL/CMOS COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 128KX8 | 3-STATE | 3.56 mm | 8 | 0.00001 A | 1048576 bit | PARALLEL | COMMON | OTP ROM | 13.995 mm | 11.455 mm | ||||||||||||||||||||||||
![]() | Mfr Part No S25FL016A | Spansion | Datasheet | 8 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM27C64-150JI | AMD | Datasheet | 604 | - | Min: 1 Mult: 1 | YES | 32 | 150 ns | ADVANCED MICRO DEVICES INC | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.025 mA | 8KX8 | 3-STATE | 8 | 0.0001 A | 65536 bit | PARALLEL | COMMON | OTP ROM | 12.75 V | |||||||||||||||||||||||||||
![]() | Mfr Part No AM27C64-150JI | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 150 ns | SPANSION INC | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | EAR99 | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.025 mA | 8KX8 | 3-STATE | 3.556 mm | 8 | 0.0001 A | 65536 bit | PARALLEL | COMMON | OTP ROM | 12.75 V | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||
![]() | Mfr Part No SST25LF040A-33-4C-QAE | Silicon Storage Technology | Datasheet | 1493 | - | Min: 1 Mult: 1 | YES | 8 | 33 MHz | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | UNSPECIFIED | HVSON | VSON, SOLCC8,.25 | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Obsolete | SON | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 1.27 mm | unknown | 8 | R-PDSO-N8 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.03 mA | 512KX8 | 3-STATE | 0.8 mm | 8 | 0.000015 A | 4194304 bit | SERIAL | FLASH | 3.3 V | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 6 mm | 5 mm | ||||||||||||||||||||
![]() | Mfr Part No AM29SL160CB-100EIN | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | SPANSION INC | 3 | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DD, TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 2 V | e0 | EAR99 | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 2.2 V | INDUSTRIAL | 1.8 V | ASYNCHRONOUS | 1MX16 | 1.2 mm | 16 | 16777216 bit | PARALLEL | FLASH | 1.8 V | 8 | 18.4 mm | 12 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No THGBMHG9C8LBAB8 | KIOXIA | Datasheet | - | - | Min: 1 Mult: 1 |
MX29LA320DLXCI-70G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
SST34WA1601-70-5E-MVJE
Greenliant Systems Ltd
Package:Memory - Modules
Price: please inquire
S29PL127J60TFI13
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
XC1765EPC2OI
AMD Xilinx
Package:Memory - Modules
Price: please inquire
XC1765EPC2OI
AMD
Package:Memory - Modules
Price: please inquire
E28F016SC-95
Intel Corporation
Package:Memory - Modules
Price: please inquire
MX29F400TMC-55
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
KFG1216U2A-DIB6
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
M58BW016BB80T3F
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
M58BW016BB80T3F
STMicroelectronics
Package:Memory - Modules
Price: please inquire
CY7C291-50DMB
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
SST39VF6401B-70-4I-B1K
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
MX29GA321EHXCI-70G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
FM27C010V45L
Fairchild Semiconductor Corporation
Package:Memory - Modules
Price: please inquire
S25FL016A
Spansion
Package:Memory - Modules
Price: please inquire
AM27C64-150JI
AMD
Package:Memory - Modules
Price: please inquire
AM27C64-150JI
Spansion
Package:Memory - Modules
Price: please inquire
SST25LF040A-33-4C-QAE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
AM29SL160CB-100EIN
Spansion
Package:Memory - Modules
Price: please inquire
THGBMHG9C8LBAB8
KIOXIA
Package:Memory - Modules
Price: please inquire
