The manufacturer is 'Intel'
- Architecture
- Connectivity
- Core Processor
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
- RAM Size
- All Manufacturers:
Intel
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Mounting Type | Package / Case | Mounting Feature | Number of Pins | Supplier Device Package | Dielectric Material | Housing Material | Body Material | Center Contact Plating | Center Contact Material | Base Product Number | Body Orientation | Brand | Current Transfer Ratio-Min | Duty Cycle - Max | Factory Pack QuantityFactory Pack Quantity | Manufacturer | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Number of I/Os | Package | Part # Aliases | Product Status | RoHS | Shell Sizes | Supply Voltage-Max | Supply Voltage-Min | Termination Method | Voltage, Rating | Operating Temperature | Packaging | Series | Termination | Connector Type | Number of Positions | Max Operating Temperature | Min Operating Temperature | Gender | Fastening Type | Subcategory | Ingress Protection | Style | Current Rating | Frequency | Frequency Stability | Termination Style | Number of Contacts | Contact Gender | Voltage - Isolation | Housing Color | Output Type | Number of Channels | Impedance | Connector Style | Number of Ports | Speed | RAM Size | Voltage - Forward (Vf) (Typ) | Accessory Type | Core Processor | Peripherals | Connectivity | Input Type | Architecture | Mating Cycles | Contact Termination | Product Type | Includes | Rise / Fall Time (Typ) | Current - Output / Channel | Voltage - Output (Max) | Insertion Loss | Current - DC Forward (If) (Max) | Body Finish | Output Format | Cable Group | Shield Termination | Primary Attributes | Current Transfer Ratio (Max) | Turn On / Turn Off Time (Typ) | Vce Saturation (Max) | Flash Size | Product | Features | Product Category | Strain Relief | IP Rating | Height | Length | Width | Ratings |
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 | Mfr Part No AGIB019R18A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, Gull Wing | 4-SMD | 50% @ 5mA | Fairchild Semiconductor | 480 | Bulk | Obsolete | -40°C ~ 100°C | - | 3750Vrms | Transistor | 1 | 1.4GHz | 256KB | 1.3V (Max) | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | AC, DC | MPU, FPGA | 3µs, 3µs | 80mA | 40V | 50 mA | FPGA - 1.9M Logic Elements | 300% @ 5mA | - | 300mV | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R29B1E2VR3 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | TE Connectivity / Laird External Antennas | 1 | TE Connectivity | Intel | - | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | Antennas | Dish | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Antennas | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 5 mm x 3.2 mm | - | CTS Electronic Components | 55 % | 1000 | CTS | + 85 C | Intel | - 40 C | 480 | Tray | Active | Details | 3.46 V | 3.13 V | 0°C ~ 100°C (TJ) | Reel | 653 | Oscillators | 45 mA | 312.5 MHz | 50 PPM | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | LVDS | FPGA - 2.3M Logic Elements | - | Standard Clock Oscillators | 1.2 mm | 5 mm | 3.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R24C2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Silver | Free Hanging | - | 3 | - | Intel | 744 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Agilex F | Solder | Plug | 3 | 125 °C | -55 °C | Bayonet | 46 A | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | Environment Proof | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R31B2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | - | - | - | - | - | - | CBMUHF | TE Connectivity Laird | 720 | Bulk | Obsolete | - | - | Plug, Male Pin | Threaded | - | - | - | UHF, Mini | 1 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | Crimp | - | - | - | RG-58 | - | FPGA - 2.7M Logic Elements | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R31C2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | - | Yazaki | 10000 | Yazaki | Intel | 720 | Tray | 7158-3721-90 | Active | Details | 0°C ~ 100°C (TJ) | Agilex F | - | Automotive Connectors | 1.4GHz | 256KB | Wire Seal | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Automotive Connectors | FPGA - 2.2M Logic Elements | - | Accessories | Automotive Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R25A3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | Yes | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX040HH1F35E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | Yes | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | No | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB008R24C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2E2VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Silver | Cable Mount | - | - | Metal, Polymer | Straight | +85°C | Intel | -40°C | 624 | Tray | Active | M16 | Solder | 300 V | -40°C ~ 100°C (TJ) | Signalmate C091 | 5.0A | 6 | Male | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Yes | IP40 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R16A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R31C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R29A1E2VR0 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | TE Connectivity / Raychem | 1 | TE Connectivity | Intel | 720 | Tray | 3-1192074-9 | Active | N | 0°C ~ 100°C (TJ) | Tray | Agilex I | Circular Connectors | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Circular MIL Spec Strain Reliefs & Adapters | FPGA - 2.7M Logic Elements | - | Circular MIL Spec Strain Reliefs & Adapters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R24C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | TE Connectivity / Raychem | 1 | TE Connectivity | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | Data Bus Components | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Data Bus Microcouplers | FPGA - 2.7M Logic Elements | - | Data Bus Components - Microcouplers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R24C2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX040HH3F35I3VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | TE Connectivity / AMP | 1000 | TE Connectivity | Intel | 374 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | Wire & Cable Management | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Wire Labels & Markers | FPGA - 400K Logic Elements | - | Wire Labels & Markers |
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AGIB019R18A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIB027R29B1E2VR3
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA023R25A3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R24C2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB027R31B2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R31C2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB027R25A3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA023R25A2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX040HH1F35E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB008R24C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R31C2E2VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R25A3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA006R16A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R31C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB027R29A1E2VR0
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB027R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R24C2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R31C2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX040HH3F35I3VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire