The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Power Rating | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Contents | Speed Grade | Number of Transceivers | Resistance Tolerance | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Product Length | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No M2S010-VFG400I | Microchip | Datasheet | 2205 | - | Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S010 | Microchip Technology / Atmel | 64 kB | 90 | MICROSEMI CORP | - | - | M2S010-VFG400I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 195 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.73 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | 0.236569 oz | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 400Kbit | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | SoC FPGA | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-FG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | MICROSEMI CORP | M1A3PE3000L-FG896I | 1.26 V | Microchip Technology | 1.14 V | 3 | 620 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGLE3000V5-FG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 896 | 400.011771 mg | 896 | MICROSEMI CORP | M1AGLE3000V5-FG896 | 3 | 620 | 70 °C | PLASTIC/EPOXY | BGA | FBGA-896 | SQUARE | GRID ARRAY | Obsolete | 20 | 5.88 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | 3e+06 | 892.86 MHz | 75264 | 75264 | 3000000 | 1.73 mm | 29 mm | 29 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL600V5-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 400.011771 mg | 484 | 108 MHz | MICROSEMI CORP | M1AGL600V5-FGG484I | 3 | 235 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 40 | 5.81 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | TIN SILVER COPPER | 85 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 600000 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-FG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | MICROSEMI CORP | M1A3PE3000L-FG896 | 1.26 V | Microchip Technology | 1.14 V | 3 | 620 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS1500-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M1AFS1500 | MICROSEMI CORP | M1AFS1500-1FG676I | 1.575 V | Microchip Technology | 1.425 V | 3 | 252 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | Fusion® | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B676 | Not Qualified | INDUSTRIAL | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1 | 38400 | 1500000 | 25 mm | 25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000L-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 350 MHz | MICROSEMI CORP | M1A3P1000L-FGG484 | 3 | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | 40 | 5.27 | Yes | 1.575 V | 1.14 V | 1.2 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 300 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL600V2-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 484 | 400.011771 mg | 484 | 108 MHz | MICROSEMI CORP | M1AGL600V2-FG484I | 3 | 235 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.86 | Non-Compliant | No | 1.575 V | 1.14 V | 1.2 V | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 600000 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090TS-1FG484I | Microchip | Datasheet | 1820 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | Microchip Technology / Atmel | 60 | MICROSEMI CORP | M2GL090TS-1FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86316 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.627572 oz | -40°C ~ 100°C (TJ) | Tray | M2GL090TS | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 323.3 kB | 667 Mb/s | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | FPGA - Field Programmable Gate Array | 2648064 | 4 Transceiver | 86316 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VF400I | Microchip | Datasheet | 27 | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | MICROSEMI CORP | - | - | M2S010TS-1VF400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 195 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150TS-FCS536 | Microchip | Datasheet | 1688 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2GL150 | MICROSEMI CORP | M2GL150TS-FCS536 | Microchip Technology | 293 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B536 | OTHER | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | MICROSEMI CORP | M1A3P400-1FG484I | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150TS-FC1152 | Microchip | Datasheet | 1823 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | M2GL150TS-FC1152 | 1.26 V | Microchip Technology | 1.14 V | 574 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | STD | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FCSG536 | Microchip | Datasheet | 2258 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | 64 kB | MICROSEMI CORP | - | - | M2S150-1FCSG536 | 166 MHz | Microchip Technology | 3 | 293 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | compliant | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050T-FG484I | Microchip | Datasheet | 2108 |
| Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL050 | MICROSEMI CORP | M2GL050T-FG484I | Microchip Technology | 3 | 267 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | STD | 56340 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050-1FCS325 | Microchip | Datasheet | 1832 | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL050 | MICROSEMI CORP | M2GL050-1FCS325 | Microchip Technology | 200 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 200 | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025TS-VF400 | Microchip | Datasheet | 1873 | - | Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2GL025 | MICROSEMI CORP | M2GL025TS-VF400 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 207 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | OTHER | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | 4 Transceiver | 27696 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CORE1553-SA | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Core1553 | Microchip Technology | Bulk | Obsolete | - | 25.0000 ppm/°C | FPGA | 41.2 kOhm | 0.1 W | Board(s) | 0.1 | 7.06 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1460A-1PQG160I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | 125 MHz | MICROSEMI CORP | A1460A-1PQG160I | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | SQUARE | FLATPACK | Obsolete | 40 | 5.81 | Yes | 5.5 V | 4.5 V | 5 V | e3 | MATTE TIN | MAX 131 I/OS | 8542.39.00.01 | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | INDUSTRIAL | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 2.6 ns | 848 | 6000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1020B-1PL84M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | MICROSEMI CORP | A1020B-1PL84M | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | 30 | 5.8 | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J84 | Not Qualified | MILITARY | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 547 | 2000 | 29.3116 mm | 29.3116 mm |
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M2S010-VFG400I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M1A3PE3000L-FG896I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M1AGLE3000V5-FG896
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M1AGL600V5-FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M1A3PE3000L-FG896
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M1AFS1500-1FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M1A3P1000L-FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M1AGL600V2-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2GL090TS-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2S010TS-1VF400I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2GL150TS-FCS536
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
247.588558
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M1A3P400-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL150TS-FC1152
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2S150-1FCSG536
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL050T-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
148.693731
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M2GL050-1FCS325
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL025TS-VF400
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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CORE1553-SA
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A1460A-1PQG160I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A1020B-1PL84M
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire