The manufacturer is 'Microchip'
- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
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- Rohs Code
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- JESD-30 Code
- Number of Terminals
- Package Body Material
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- All Manufacturers:
Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Data RAM Size | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No M2GL050TS-FGG484I | Microchip | Datasheet | 1796 |
| Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL050 | MICROSEMI CORP | M2GL050TS-FGG484I | Microchip Technology | 3 | 267 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCG1152I | Microchip | Datasheet | 1835 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | M2S150T-1FCG1152I | 166 MHz | Microchip Technology | 4 | SMD/SMT | 574 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010T-1VFG256 | Microchip | Datasheet | 20 |
| Min: 1 Mult: 1 | Surface Mount | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | M2GL010 | MICROSEMI CORP | M2GL010T-1VFG256 | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 138 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.27 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 2 Transceiver | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050TS-FG896I | Microchip | Datasheet | 1712 | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2GL050 | MICROSEMI CORP | M2GL050TS-FG896I | Microchip Technology | 3 | 377 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FG676I | Microchip | Datasheet | 2284 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | 64 kB | MICROSEMI CORP | - | - | M2S060T-1FG676I | 166 MHz | Microchip Technology | 3 | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | MICROSEMI CORP | M1A3P400-FG484I | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025-1FCS325 | Microchip | Datasheet | 4 |
| Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL025 | MICROSEMI CORP | M2GL025-1FCS325 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 180 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 1.2 V | OTHER | 180 | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | 27696 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600L-FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 350 MHz | MICROSEMI CORP | M1A3P600L-FG256 | 3 | 70 °C | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.26 | No | 1.575 V | 1.14 V | 1.2 V | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 13824 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010-1VF400I | Microchip | Datasheet | 4 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2GL010 | MICROSEMI CORP | M2GL010-1VF400I | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 195 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | 1.26 V | 1.14 V | 114 kB | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 1 | 12084 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-VFG400 | Microchip | Datasheet | 20 |
| Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | MICROSEMI CORP | - | - | M2S010T-VFG400 | 166 MHz | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 195 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.25 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No M2GL100T-1FC1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | M2GL100T-1FC1152I | PLASTIC | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | 5.88 | No | 1.2 V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 574 | FIELD PROGRAMMABLE GATE ARRAY | 99512 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100T-1FCG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | M2S100T-1FCG1152I | 4 | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050S-1FGG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | MICROSEMI CORP | M2S050S-1FGG896I | 3 | Active | 30 | 5.26 | Yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 245 | compliant | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010S-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 484 | MICROSEMI CORP | M2GL010S-1FG484I | 233 | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | 5.88 | Non-Compliant | No | 1.2 V | 100 °C | -40 °C | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 114 kB | 233 | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 12084 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025S-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | MICROSEMI CORP | M2S025S-1FGG484I | 3 | Active | 30 | 5.78 | Yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025S-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 484 | MICROSEMI CORP | M2GL025S-1FG484I | 267 | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | 5.3 | Non-Compliant | No | 1.2 V | 100 °C | -40 °C | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 138 kB | 267 | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 27696 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050S-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 484 | MICROSEMI CORP | M2GL050S-1FG484I | 267 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | 5.88 | Non-Compliant | No | 1.2 V | 100 °C | -40 °C | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 228.3 kB | 267 | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 56340 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100T-1FC1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | M2S100T-1FC1152 | 85 °C | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF300TLS-FCVG484I | Microchip | Datasheet | 528 |
| Min: 1 Mult: 1 | Surface Mount | 484-BBGA, FCBGA | YES | 484-FCBGA (19x19) | 484 | MPF300 | MICROSEMI CORP | MPF300TLS-FCVG484I | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 284 | 300000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FBGA | FCBGA-484 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 5.79 | 1.03 V | 0.97 V | 1 V | -40°C ~ 100°C (TJ) | PolarFire™ | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 0.97V ~ 1.08V | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B484 | 1.05 V | INDUSTRIAL | 12.7 Gb/s | 3.32 mm | FIELD PROGRAMMABLE GATE ARRAY | 300000 | 21094400 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-1FGG896 | Microchip | Datasheet | 672 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | A3PE3000L-1FGG896 | 1.26 V | Microchip Technology | 1.14 V | 3 | 620 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Compliant | Yes | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No |
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M2GL050TS-FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
221.329126
-
M2S150T-1FCG1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
528.850384
-
M2GL010T-1VFG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
63.820491
-
M2GL050TS-FG896I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2S060T-1FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
192.991015
-
M1A3P400-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2GL025-1FCS325
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
95.653367
-
M1A3P600L-FG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL010-1VF400I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
80.268645
-
M2S010T-VFG400
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
78.923393
-
M2GL100T-1FC1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2S100T-1FCG1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S050S-1FGG896I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2GL010S-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2S025S-1FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2GL025S-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2GL050S-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S100T-1FC1152
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
MPF300TLS-FCVG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
727.611413
-
A3PE3000L-1FGG896
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire