The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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![]() | Mfr Part No A3P125-1VQ100 | Microchip Technology | Datasheet | 5 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3P125 | 350 MHz | 90 | MICROSEMI CORP | A3P125-1VQ100 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 71 I/O | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.23 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | A3P125 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | COMMERCIAL | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 1 | 3072 | 125000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN060-2VQ100 | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3PN060 | 90 | MICROSEMI CORP | A3PN060-2VQ100 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 71 I/O | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.26 | N | No | FPGA - Field Programmable Gate Array ProASIC3 | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN060 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | OTHER | 2 mA | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 2 | 1536 | 60000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL030V5-VQ100 | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | AGL030 | 108 MHz | 90 | MICROSEMI CORP | AGL030V5-VQ100 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 77 I/O | 330 LE | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | AGL030V5 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 230 | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | 1.5 V | OTHER | 768 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL050T-1FGG896I | Microchip Technology | Datasheet | 2178 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | M2GL050 | 27 | MICROSEMI CORP | M2GL050T-1FGG896I | Microchip Technology | Yes | 3 | 377 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | BGA | Active | 40 | 1.57 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 1.2000 V | -40 to 100 °C | Tray | M2GL050T | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 1.2 V | 228.3 kB | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 1 | 56340 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL090TS-FG484I | Microchip Technology | Datasheet | 1620 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | 60 | MICROSEMI CORP | M2GL090TS-FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86184 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL090TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 4 Transceiver | 86316 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX16-3PLG84I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | A42MX16 | 129 MHz | 16 | MICROSEMI CORP | A42MX16-3PLG84I | 237 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 72 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.3 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | 0.239083 oz | -40°C ~ 85°C (TA) | Tube | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 1232 CLBS, 24000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 1.9 ns | 1232 | 24000 | 3.68 mm | 29.31 mm | 29.31 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX16-VQG100A | Microchip Technology | Datasheet | 1682 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A42MX16 | 139 MHz | 90 | MICROSEMI CORP | A42MX16-VQG100A | 153 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 83 I/O | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.59 | Details | Yes | 5.25 V | 4.75 V | 5 V | Actel | -40°C ~ 125°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5.0V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 5 V | AUTOMOTIVE | 1232 CLBS, 24000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | STD | 2.2 ns | 1232 | 24000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN015-1QNG68I | Microchip Technology | Datasheet | 5 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN015 | 260 | MICROSEMI CORP | A3PN015-1QNG68I | 350 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -40°C ~ 100°C (TJ) | Tray | A3PN015 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | 49 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | INDUSTRIAL | 1 mA | 49 | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 15000 | 1 | 384 | 384 | 15000 | 0.88 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX250-FGG256 | Microchip Technology | Datasheet | 2040 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AX250 | 649 MHz | 90 | MICROSEMI CORP | AX250-FGG256 | 649 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 138 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 248 | 2816 CLBS, 250000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | 0.99 ns | 2816 | 4224 | 250000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No A3P030-1VQ100 | Microchip Technology | Datasheet | 36 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3P030 | 350 MHz | 90 | MICROSEMI CORP | A3P030-1VQ100 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 77 I/O | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | A3P030 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | COMMERCIAL | 768 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 1 | 768 | 30000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL030V5-VQ100I | Microchip Technology | Datasheet | 243 |
| Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | AGL030 | 108 MHz | 90 | MICROSEMI CORP | AGL030V5-VQ100I | 892.86 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 77 I/O | 330 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 1.56 | N | No | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | -40 to 85 °C | Tray | AGL030V5 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 230 | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 768 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P600-2PQ208I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 1 month ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | A3P600 | 350 MHz | 24 | MICROSEMI CORP | A3P600-2PQ208I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 154 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | A3P600 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 310 MHz | 2 | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FG256I | Microchip Technology | Datasheet | 2372 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-1FG256I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3P1000 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPF200T-FCG784I | Microchip Technology | Datasheet | 2058 |
| Min: 1 Mult: 1 | Surface Mount | BGA-784 | YES | 784-FCBGA (29x29) | 784 | MPF200 | 1 | MICROSEMI CORP | MPF200T-FCG784I | + 100 C | Microchip Technology | - 40 C | Yes | 4 | SMD/SMT | 364 I/O | 192000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | 1 V | PolarFire | 2.674354 oz | -40°C ~ 100°C (TJ) | Tray | MPF200T | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 0.97V ~ 1.08V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B784 | 1 V, 1.05 V | INDUSTRIAL | 12.7 Gb/s | 3.47 mm | FIELD PROGRAMMABLE GATE ARRAY | 192000 | 13619200 | 16 Transceiver | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL090TS-1FGG676 | Microchip Technology | Datasheet | 1910 |
| Min: 1 Mult: 1 | Surface Mount | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | M2GL090 | 40 | MICROSEMI CORP | M2GL090TS-1FGG676 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 425 I/O | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | OTHER | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 4 Transceiver | 86316 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P250-2FG144 | Microchip Technology | Datasheet | 12 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-2FG144 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-1FGG896 | Microchip Technology | Datasheet | 740 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 27 | MICROSEMI CORP | A3PE3000-1FGG896 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 620 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 272 MHz | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||
![]() | Mfr Part No A3P400-FG256I | Microchip Technology | Datasheet | 9 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P400 | 350 MHz | 90 | MICROSEMI CORP | A3P400-FG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 178 I/O | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.22 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3P400 | e0 | 3A001.A.7.B | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | STD | 9216 | 400000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS250-FG256 | Microchip Technology | Datasheet | 1864 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS250 | 90 | 1098.9 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 114 I/O | 3000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | AFS250 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.0989 GHz | 1.5 V | 1.575 V | 1.425 V | 4.5 kB | 36864 | 250000 | 1.0989 GHz | STD | 6144 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGLP030V2-CSG201 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CSP | YES | 201-CSP (8x8) | 201 | AGLP030 | 160 MHz | 348 | MICROSEMI CORP | AGLP030V2-CSG201 | 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 120 I/O | 70 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.26 | Details | Yes | 1.575 V | 1.14 V | 1.5 V | IGLOO PLUS | 1.2, 1.5 V | 0 to 70 °C | Tray | AGLP030V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | 201 | S-PBGA-B201 | 120 | Not Qualified | 1.2 V to 1.5 V | 1.2/1.5 V | COMMERCIAL | 120 | 792 CLBS, 30000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | 30000 | STD | 792 | 792 | 30000 | 0.66 mm | 8 mm | 8 mm |
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