The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No M1A3P600-PQG208 | Microchip Technology | Datasheet | 32 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P600 | 350 MHz | 24 | MICROSEMI CORP | M1A3P600-PQG208 | 350 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 154 I/O | - | 6500 LE | 85 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | 110592 bit | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | M1A3P600 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | COMMERCIAL | 5 mA | 700 Mb/s | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF300TL-FCSG536I | Microchip Technology | Datasheet | 531 |
| Min: 1 Mult: 1 | Surface Mount | BGA-536 | YES | 536-CSPBGA (16x16) | 536 | MPF300 | 1 | MICROSEMI CORP | MPF300TL-FCSG536I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 300 I/O | 300000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 5.79 | Details | Yes | This product may require additional documentation to export from the United States. | 1.08 V | 0.97 V | 1 V | 20.6 Mbit | PolarFire | -40°C ~ 100°C (TJ) | Tray | MPF300TL | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 0.97V ~ 1.08V | BOTTOM | BALL | 0.5 mm | compliant | S-PBGA-B536 | 1 V, 1.05 V | INDUSTRIAL | 12.5 Gb/s | 1.45 mm | FIELD PROGRAMMABLE GATE ARRAY | 300000 | 21094400 | 4 Transceiver | 16 mm | 16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-1BG272M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-272 | YES | 272 | 272-PBGA (27x27) | 272 | A42MX36 | 83 MHz | 40 | MICROSEMI CORP | A42MX36-1BG272M | 151 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 202 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | PLASTIC, BGA-272 | SQUARE | GRID ARRAY | Active | BGA | Active | 30 | 5.19 | N | No | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A42MX36 | e0 | 3A001.A.2.C | TIN LEAD SILVER | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | BOTTOM | BALL | 225 | 1.27 mm | compliant | 272 | S-PBGA-B272 | Not Qualified | 3.3 V, 5 V | MILITARY | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 151 MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 54000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL250V5-VQ100I | Microchip Technology | Datasheet | 5 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | VQFP | YES | 100 | 100-VQFP (14x14) | 100 | M1AGL250 | 108 MHz | 90 | MICROSEMI CORP | M1AGL250V5-VQ100I | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 68 I/O | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | -40 to 85 °C | Tray | M1AGL250V5 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT6005-2AU | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | 24 Weeks | Tin | Surface Mount | Surface Mount | 100-TQFP | 100 | 80 | Industrial grade | -40°C~85°C TC | Tray | 1999 | AT6000(LV) | e3 | yes | Active | 3 (168 Hours) | 100 | 4.5V~5.5V | QUAD | GULL WING | 260 | 5V | 0.5mm | 40 | AT6005 | 80 | 5V | 500MHz | FIELD PROGRAMMABLE GATE ARRAY | 15000 | 2 | 3136 | 50 ns | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050T-FGG896I | Microchip Technology | Datasheet | 2320 | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2GL050 | 27 | MICROSEMI CORP | M2GL050T-FGG896I | Microchip Technology | Yes | 3 | 377 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL050T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600-1FG256I | Microchip Technology | Datasheet | 32 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P600 | 90 | MICROSEMI CORP | M1A3P600-1FG256I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX16-TQG176I | Microchip Technology | Datasheet | 2084 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-176 | YES | 176-TQFP (24x24) | 176 | A42MX16 | 94 MHz | 40 | MICROSEMI CORP | A42MX16-TQG176I | 172 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 140 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.28 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | 3.3, 5 V | -40 to 85 °C | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G176 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 1232 CLBS, 24000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | STD | 2.8 ns | 1232 | 24000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-PQ208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | 208-PQFP (28x28) | A3P400 | 24 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 151 I/O | Tray | Obsolete | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P400 | 1.425V ~ 1.575V | 1.5 V | 55296 | 400000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-1TQG144 | Microchip Technology | Datasheet | 1864 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-144 | YES | 144-TQFP (20x20) | 144 | A54SX32 | 278 MHz | 60 | MICROSEMI CORP | A54SX32A-1TQG144 | 278 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 113 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.046530 oz | 0°C ~ 70°C (TA) | Tray | A54SX32A | e3 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 113 | 2880 CLBS, 48000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.4 mm | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-1FG484 | Microchip Technology | Datasheet | 1717 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1AFS600 | 60 | MICROSEMI CORP | M1AFS600-1FG484 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 172 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS600 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE1500-2PQG208 | Microchip Technology | Datasheet | 2134 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3PE1500 | 350 MHz | 24 | MICROSEMI CORP | M1A3PE1500-2PQG208 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 147 I/O | 70 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.59 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | M1A3PE1500 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE1500-FGG676 | Microchip Technology | Datasheet | 1756 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 676-FBGA (27x27) | 676 | M1A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | M1A3PE1500-FGG676 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 444 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | STD | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL250V2-CS196 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CSP-196 | YES | 196-CSP (8x8) | 196 | AGL250 | 108 MHz | 348 | MICROSEMI CORP | AGL250V2-CS196 | 250 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 143 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.304431 oz | 0°C ~ 70°C (TA) | Tray | AGL250V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | S-PBGA-B196 | Not Qualified | 1.2 V to 1.5 V | OTHER | 20 uA | - | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | - | 6144 | 250000 | 0.7 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLP060V5-CS289 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CSP-289 | YES | 289-CSP (14x14) | 289 | AGLP060 | 250 MHz | 119 | MICROSEMI CORP | AGLP060V5-CS289 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 157 I/O | 70 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA289,17X17,32 | BGA289,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Obsolete | NOT SPECIFIED | 5.26 | N | No | 1.575 V | 1.425 V | 1.5 V | IGLOO PLUS | 0°C ~ 85°C (TJ) | Tray | AGLP060V5 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | unknown | S-PBGA-B289 | 157 | Not Qualified | 1.5 V | 1.5 V | COMMERCIAL | 157 | 1584 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 1584 | 18432 | 60000 | STD | 1584 | 1584 | 60000 | 0.81 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN020-1QNG68I | Microchip Technology | Datasheet | 5 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN020 | 260 | MICROSEMI CORP | A3PN020-1QNG68I | 350 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -40°C ~ 100°C (TJ) | Tray | A3PN020 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | INDUSTRIAL | 1 mA | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 20000 | 1 | 520 | 20000 | 0.88 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060TS-1FG484 | Microchip Technology | Datasheet | 1989 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL060 | 60 | MICROSEMI CORP | M2GL060TS-1FG484 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 267 I/O | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL060TS | e0 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | OTHER | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 4 Transceiver | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-FG484M | Microchip Technology | Datasheet | 702 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 649 MHz | 60 | MICROSEMI CORP | AX1000-FG484M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 317 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||
| Mfr Part No M1A3P250-VQG100I | Microchip Technology | Datasheet | 28 | - | Min: 1 Mult: 1 | Surface Mount | VQFP-100 | YES | 100-VQFP (14x14) | 100 | M1A3P250 | 90 | MICROSEMI CORP | M1A3P250-VQG100I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 68 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.420854 oz | -40 to 85 °C | Tray | M1A3P250 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | STD | 6144 | 250000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLP125V2-CS281 | Microchip Technology | Datasheet | 12 | - | Min: 1 Mult: 1 | Surface Mount | CSP-281 | YES | 281-CSP (10x10) | 281 | AGLP125 | 160 MHz | 184 | MICROSEMI CORP | AGLP125V2-CS281 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 212 I/O | 70 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA281,19X19,20 | BGA281,19X19,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Obsolete | NOT SPECIFIED | 5.26 | N | No | 1.575 V | 1.14 V | 1.5 V | IGLOO PLUS | 0°C ~ 85°C (TJ) | Tray | AGLP125V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | S-PBGA-B281 | 212 | Not Qualified | 1.2 V to 1.5 V | 1.2/1.5 V | COMMERCIAL | 212 | 3120 CLBS, 125000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 3120 | 36864 | 125000 | STD | 3120 | 3120 | 125000 | 0.71 mm | 10 mm | 10 mm |
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