The manufacturer is 'Microchip'
- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Mfr
- Minimum Operating Temperature
- Mounting Styles
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Operating Temperature
- Package
- All Manufacturers:
Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No AGLN250V2-CSG81 | Microchip Technology | Datasheet | 44 | - | Min: 1 Mult: 1 | Surface Mount | CSP-81 | YES | 81-CSP (5x5) | 81 | AGLN250 | 640 | MICROSEMI CORP | AGLN250V2-CSG81 | 250 MHz | + 85 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 60 I/O | 3000 LE | 70 °C | -20 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 2.06 | Details | Yes | 1.575 V | 1.14 V | 1.2 V | IGLOO nano | 0.001058 oz | -20°C ~ 85°C (TJ) | Tray | AGLN250V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B81 | Not Qualified | 1.2 V to 1.5 V | OTHER | - | 6144 CLBS, 250000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | - | 6144 | 250000 | 0.66 mm | 5 mm | 5 mm | |||||||||||||||||||||||||||||||
| Mfr Part No M1AFS1500-2FG484I | Microchip Technology | Datasheet | 2020 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | M1AFS1500 | 60 | MICROSEMI CORP | M1AFS1500-2FG484I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 223 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS1500 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.47059 GHz | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||
| Mfr Part No M1AGL1000V5-FGG144 | Microchip Technology | Datasheet | 2120 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-144 | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | 160 | MICROSEMI CORP | M1AGL1000V5-FGG144 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | OTHER | 127 uA | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 250 MHz | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
| Mfr Part No P1AFS1500-2FG256I | Microchip Technology | Datasheet | 2385 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | P1AFS1500 | 90 | Microchip Technology | Yes | 119 | Tray | Active | N | This product may require additional documentation to export from the United States. | Fusion | -40°C ~ 100°C (TJ) | Tray | P1AFS1500 | 1.425V ~ 1.575V | 276480 | 1500000 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS1500-FG484 | Microchip Technology | Datasheet | 1826 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1AFS1500 | 60 | MICROSEMI CORP | M1AFS1500-FG484 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 223 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS1500 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | OTHER | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | STD | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS1500-FGG484K | Microchip Technology | Datasheet | 727 | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M1AFS1500 | 350 MHz | 60 | MICROSEMI CORP | M1AFS1500-FGG484K | Microchip Technology | Yes | 3 | 223 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.8 | Details | Yes | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 30 | S-PBGA-B484 | 223 | Not Qualified | 1.5,3.3 V | 223 | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 38400 | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1AFS600-2FG256 | Microchip Technology | Datasheet | 2008 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | P1AFS600 | 90 | Microchip Technology | Yes | 119 | Tray | Active | N | This product may require additional documentation to export from the United States. | Fusion | 0°C ~ 85°C (TJ) | Tray | P1AFS600 | 1.425V ~ 1.575V | 110592 | 600000 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000L-1FGG144 | Microchip Technology | Datasheet | 1870 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000L-1FGG144 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P1000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||
| Mfr Part No M1AGL1000V2-FGG484I | Microchip Technology | Datasheet | 2004 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M1AGL1000 | 108 MHz | 60 | MICROSEMI CORP | M1AGL1000V2-FGG484I | 250 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.5 V | 1.2 V | 1.2 V | IGLOOe | 0.396232 oz | -40°C ~ 85°C (TA) | Tray | M1AGL1000V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 127 µA | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 250 MHz | STD | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||
| Mfr Part No P1AFS1500-2FGG256I | Microchip Technology | Datasheet | 2344 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | P1AFS1500 | 90 | Microchip Technology | Yes | 119 | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | -40°C ~ 100°C (TJ) | Tray | U1AFS1500 | 1.425V ~ 1.575V | 276480 | 1500000 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN020-2QNG68 | Microchip Technology | Datasheet | 18 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN020 | 260 | MICROSEMI CORP | A3PN020-2QNG68 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 49 I/O | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN020 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | OTHER | 1 mA | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 20000 | 2 | 520 | 20000 | 0.88 mm | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-1FG484K | Microchip Technology | Datasheet | 592 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | 484-FPBGA (23x23) | AFS1500 | 60 | Microchip Technology | Yes | 223 | Tray | Active | N | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | AFS1500 | 100 °C | -55 °C | 1.425V ~ 1.575V | 33.8 kB | 276480 | 1.5e+06 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN010V5-UCG36I | Microchip Technology | Datasheet | 24 |
| Min: 1 Mult: 1 | Surface Mount | UCSP | YES | 36-UCSP (3x3) | 36 | AGLN010 | 490 | MICROSEMI CORP | AGLN010V5-UCG36I | 250 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 23 I/O | 100 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 2.08 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | IGLOO nano | -40°C ~ 100°C (TJ) | Tray | AGLN010V5 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.4 mm | compliant | S-PBGA-B36 | Not Qualified | 1.5 V | INDUSTRIAL | 3 uA | 260 CLBS, 10000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 260 | 10000 | STD | 260 | 10000 | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V5-CS281 | Microchip Technology | Datasheet | 2084 | - | Min: 1 Mult: 1 | Surface Mount | CSP | YES | 281-CSP (10x10) | 281 | AGL1000 | 108 MHz | 184 | MICROSEMI CORP | AGL1000V5-CS281 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 215 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0 to 70 °C | Tray | AGL1000V5 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | 281 | S-PBGA-B281 | Not Qualified | 1.5 V | OTHER | 44 uA | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 0.71 mm | 10 mm | 10 mm | |||||||||||||||||||||||||||||||
| Mfr Part No A3P030-1QNG68 | Microchip Technology | Datasheet | 24 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3P030 | 350 MHz | 260 | MICROSEMI CORP | A3P030-1QNG68 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P030 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | COMMERCIAL | 2 mA | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 1 | 768 | 30000 | 0.88 mm | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FGG484M | Microchip Technology | Datasheet | 753 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 504 kbit | 60 | MICROSEMI CORP | M1A3PE3000L-1FGG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 341 I/O | 3500 LAB | 35000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 700 Mb/s | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | |||||||||||||||||||||||
| Mfr Part No P1AFS1500-2FGG484 | Microchip Technology | Datasheet | 626 |
| Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | P1AFS1500 | 60 | Microchip Technology | Yes | 223 | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | 0°C ~ 85°C (TJ) | Tray | P1AFS1500 | 1.425V ~ 1.575V | 276480 | 1500000 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No U1AFS250-FG256 | Microchip Technology | Datasheet | 1937 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | U1AFS250 | 90 | 1.575 V | Microchip Technology | 1.425 V | Yes | 114 | Tray | Active | N | This product may require additional documentation to export from the United States. | Fusion | 1.5000 V | 0 to 70 °C | Tray | U1AFS250 | 1.425V ~ 1.575V | 36864 | 250000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-FGG256 | Microchip Technology | Datasheet | 18 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M1A3P400 | 350 MHz | 90 | MICROSEMI CORP | M1A3P400-FGG256 | Microchip Technology | Yes | 3 | SMD/SMT | 178 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1AFS600-2FGG256 | Microchip Technology | Datasheet | 2242 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | P1AFS600 | 90 | Microchip Technology | Yes | 119 | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | 0°C ~ 85°C (TJ) | Tray | P1AFS600 | 1.425V ~ 1.575V | 110592 | 600000 | 2 |
-
AGLN250V2-CSG81
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AFS1500-2FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
545.865686
-
M1AGL1000V5-FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
P1AFS1500-2FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
528.846863
-
M1AFS1500-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
272.795991
-
M1AFS1500-FGG484K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
P1AFS600-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
299.168604
-
M1A3P1000L-1FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AGL1000V2-FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
P1AFS1500-2FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
532.200924
-
A3PN020-2QNG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.416458
-
AFS1500-1FG484K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,012.737263
-
AGLN010V5-UCG36I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
13.398590
-
AGL1000V5-CS281
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P030-1QNG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.361265
-
M1A3PE3000L-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
P1AFS1500-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
730.915279
-
U1AFS250-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
183.615281
-
M1A3P400-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
P1AFS600-2FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
299.168604