The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Logic Cells | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No A54SX32A-1CQ84M | Microchip Technology | Datasheet | 25 | - | Min: 1 Mult: 1 | Surface Mount | CQFP-84 | YES | 84-CQFP (42x42) | 84 | A54SX32 | 250 MHz | 9 | MICROSEMI CORP | A54SX32A-1CQ84M | 278 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 62 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, | SQUARE | FLATPACK | Active | Active | 20 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | -55°C ~ 125°C (TC) | A54SX32A | e0 | 3A001.A.2.C | TIN LEAD | IT CAN ALSO OPERATE WITH 3.3V AND 5V | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.635 mm | compliant | S-CQFP-F84 | Not Qualified | 2.5 V | MILITARY | 1800 CLBS, 48000 GATES | 2.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.2 ns | 1800 | 48000 | 16.51 mm | 16.51 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA300-CQ208M | Microchip Technology | Datasheet | 623 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | 208-CQFP (75x75) | APA300 | 1 | 5 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 158 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | Actel | 7.713328 oz | -55°C ~ 125°C (TC) | APA300 | 2.3V ~ 2.7V | 2.5 V | 73728 | 300000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-CQ208M | Microchip Technology | Datasheet | 640 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | A42MX36 | 73 MHz | 1 | MICROSEMI CORP | A42MX36-CQ208M | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 176 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, | SQUARE | FLATPACK, GUARD RING | Active | QFP | Active | 20 | 5.19 | N | No | This product may require additional documentation to export from the United States. | 3.3 V | 3.3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | A42MX36 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 208 | S-CQFP-F208 | Not Qualified | 3.3 V | MILITARY | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 1184 | 1822 | 2.7 ns | 2438 | 2414 | 54000 | 29.21 mm | 29.21 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX2000-FG896 | Microchip Technology | Datasheet | 456 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-896 | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 649 MHz | 27 | MICROSEMI CORP | AX2000-FG896 | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 586 I/O | 32256 LAB | 21504 LE | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.56 | N | No | 1.575 V | 1.425 V | 1.5 V | Actel | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | AX2000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | 896 | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | - | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | 21504 | STD | - | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||
| Mfr Part No AX500-2FG484 | Microchip Technology | Datasheet | 2044 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX500 | 60 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 317 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-2FG256 | Microchip Technology | Datasheet | 1843 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AX250 | 870 MHz | 90 | MICROSEMI CORP | AX250-2FG256 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 138 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | e0 | TIN LEAD/TIN LEAD SILVER | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 248 | 2816 CLBS, 250000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | 0.74 ns | 2816 | 4224 | 250000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA600-FG484I | Microchip Technology | Datasheet | 688 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | APA600 | 60 | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 370 I/O | Tray | Active | N | 8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85 | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA600 | 85 °C | -40 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 23 mm | 23 mm | No | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No eX128-PTQG64 | Microchip Technology | Datasheet | 24 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-64 | YES | 64-TQFP (10x10) | 64 | EX128 | 357 MHz | 160 | MICROSEMI CORP | EX128-PTQG64 | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 46 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.59 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.012720 oz | 0°C ~ 70°C (TA) | Tray | eX128 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G64 | 2.5 V | COMMERCIAL | 6000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 256 | 6000 | 0.7 ns | 6000 | 1.4 mm | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-1CQ208B | Microchip Technology | Datasheet | 519 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | YES | 208-CQFP (75x75) | 208 | A54SX32 | 278 MHz | 1 | MICROSEMI CORP | A54SX32A-1CQ208B | 278 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 174 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Active | Active | 20 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A54SX32A | e0 | 3A001.A.2.C | TIN LEAD | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 174 | Not Qualified | 2.5 V | 2.5,3.3/5 V | MILITARY | 174 | 2880 CLBS, 48000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | MIL-STD-883 Class B | 1.1 ns | 2880 | 2880 | 48000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No eX256-FTQG100 | Microchip Technology | Datasheet | 11 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | 81 | 512 | EX256 | 178 MHz | 12000 | 90 | eX | MICROSEMI CORP | 512 | EX256-FTQG100 | + 70 C | Microchip Technology | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 81 I/O | - | 512 | 512 LE | 8000 | 2.7(V) | 2.3(V) | 2.5(V) | 0C to 70C | 70C | 0C | Commercial | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | TQFP | Active | 0.22UM | Active | Yes | No | 40 | 2.02 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.023175 oz | 0°C ~ 70°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 2.5 V | COMMERCIAL | 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 512 | 12000 | 1.4 ns | 12000 | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA450-FG484A | Microchip Technology | Datasheet | 1621 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | APA450 | 60 | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 344 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 2.375V ~ 2.625V | 2.5 V | 110592 | 450000 | STD | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No eX256-PTQG100I | Microchip Technology | Datasheet | 1994 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | EX256 | 357 MHz | 90 | MICROSEMI CORP | EX256-PTQG100I | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 81 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.59 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.023175 oz | -40°C ~ 85°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | INDUSTRIAL | 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 512 | 12000 | 0.7 ns | 12000 | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-FG484M | Microchip Technology | Datasheet | 408 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX250 | 60 | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 248 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-2FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 870 MHz | 40 | MICROSEMI CORP | AX1000-2FG676 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 418 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e0 | TIN LEAD | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 870 MHz | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 740 ps | 740 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 870 MHz | 18144 | 12096 | 2 | 12096 | 0.74 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX16-TQG176I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TQFP-176 | YES | 176-TQFP (24x24) | 176 | A54SX16 | 240 MHz | 40 | MICROSEMI CORP | A54SX16-TQG176I | 240 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 147 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176 | QFP176,1.0SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 3.6 V | 3 V | 3.3 V | Actel | -40°C ~ 85°C (TA) | Tray | A54SX16 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G176 | 147 | Not Qualified | 3.3 V, 5 V | 3.3,5 V | INDUSTRIAL | 147 | 1452 CLBS, 16000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 1452 | 0.9 ns | 1452 | 1452 | 16000 | 1.4 mm | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-1FG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX1000 | 763 MHz | 27 | MICROSEMI CORP | AX1000-1FG896M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 516 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX72A-CQ256B | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | Surface Mount | CQFP-256 | YES | 256-CQFP (75x75) | 256 | A54SX72 | 217 MHz | 1 | MICROSEMI CORP | A54SX72A-CQ256B | 217 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 213 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, | SQUARE | FLATPACK | Active | Active | NOT SPECIFIED | 5.18 | N | No | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A54SX72A | 3A001.A.2.C | IT CAN ALSO OPERATE WITH 3.3V AND 5V | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | NOT SPECIFIED | 0.5 mm | unknown | S-CQFP-F256 | Not Qualified | 2.5 V | MILITARY | 4024 CLBS, 108000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | MIL-STD-883 Class B | 1.4 ns | 4024 | 108000 | 36 mm | 36 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA300-BGG456M | Microchip Technology | Datasheet | 475 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA300 | 180 MHz | 24 | MICROSEMI CORP | APA300-BGG456M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 290 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -55°C ~ 125°C (TC) | Tray | APA300 | 3A001.A.2.C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No eX256-TQG100I | Microchip Technology | Datasheet | 3 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | EX256 | 250 MHz | 90 | MICROSEMI CORP | EX256-TQG100I | 250 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 81 I/O | 512 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.29 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.023175 oz | -40°C ~ 85°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | INDUSTRIAL | - | 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 512 | 12000 | STD | - | 1 ns | 12000 | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA1000-CQ208M | Microchip Technology | Datasheet | 648 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | YES | 208-CQFP (75x75) | 208 | APA1000 | 180 MHz | 1 | MICROSEMI CORP | APA1000-CQ208M | 5 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 158 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TC) | APA1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 158 | 1000000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | MIL-STD-883 Class B | 56320 | 1000000 | 29.21 mm | 29.21 mm |
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