The manufacturer is 'Microchip'
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Microchip
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Housing Material | Weight | Number of Terminals | Angle | Approvals | Base Product Number | Brand | Cable Style | Cable Types | Case Size | Case Style | Clock Frequency-Max | Connections | Enclosure | Factory Pack QuantityFactory Pack Quantity | Grip Type | Ihs Manufacturer | Jacket Material | Manufacturer | Manufacturer Part Number | Maximum Cable Diameter (mm) | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Cable Diameter (mm) | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Number of Outlets | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Range | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Connector Type | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | RPM | Bearing Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Overall Length | Product Category | Strain Relief | Phase | IP Rating | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No M1A3PE3000-1PQG208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | CSA;cURus;CE | M1A3PE3000 | 350 MHz | MICROSEMI CORP | IDEC | LD9Z-6ALW-SC | Microchip Technology | 3 | 147 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.6 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3E | e3 | Matte Tin (Sn) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-FGG484K | Microchip | Datasheet | 1601 |
| Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | AFS600 | 350 MHz | MICROSEMI CORP | Brady | MRO315P | 1.575 V | Microchip Technology | 1.425 V | 3 | 172 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.79 | Yes | 1.5000 V | 0 to 85 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 172 | Not Qualified | 1.5,3.3 V | 172 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS1500-1FGG676 | Microchip | Datasheet | 1859 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | M1AFS1500 | MICROSEMI CORP | ILME | M1AFS1500-1FGG676 | 1.575 V | Microchip Technology | 1.425 V | 3 | 252 | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1.5e+06 | 1.28205 GHz | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-2FGG484I | Microchip | Datasheet | 607 | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | Microchip Technology / Atmel | 350 MHz | 60 | MICROSEMI CORP | Altech | 738-428 | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 341 | 35000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Details | Yes | 1.575 V | 1.14 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | ProASIC3E | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 516096 | 3000000 | 2 | - | 75264 | 75264 | 3000000 | FPGA - Field Programmable Gate Array | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-2TQG144 | Microchip | Datasheet | 1650 |
| Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 144-TQFP (20x20) | 144 | A54SX32 | 313 MHz | MICROSEMI CORP | Turck | U-90298 | 2.75 V | Microchip Technology | 2.25 V | 3 | 113 | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.25 | Yes | 2.75 V | 2.25 V | 2.5 V | 2.5000 V | 0 to 70 °C | SX-A | e3 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | Not Qualified | 2.5,3.3/5 V | COMMERCIAL | 113 | 2880 CLBS, 48000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 2 | 0.9 ns | 2880 | 2880 | 48000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX16A-2PQG208I | Microchip | Datasheet | 1697 |
| Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | A54SX16 | 294 MHz | MICROSEMI CORP | Cutler Hammer, Div of Eaton Corp | DD367NWKW-00V3 | Microchip Technology | 3 | 175 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ | QFP208,1.2SQ | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.25 | Yes | 2.75 V | 2.25 V | 2.5 V | 2.5000 V | -40 to 85 °C | SX-A | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 175 | Not Qualified | 2.5,3.3/5 V | INDUSTRIAL | 175 | 1452 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 1452 | 2 | 1 ns | 1452 | 1452 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600L-1FGG144I | Microchip | Datasheet | 2220 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Arrow Hart - Cooper Wiring Devices | 738B-BOX | 1.26 V | Microchip Technology | 1.14 V | 3 | 97 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-1FG676 | Microchip | Datasheet | 2293 |
| Min: 1 Mult: 1 | Foot Mount,Rigid | 676-BGA | 676-FBGA (27x27) | CSA, UL | AX500 | Totally Enclosed Fan Cooled | Lincoln Electric | LM60036 | 1.575 V | Microchip Technology | 1.425 V | 336 | Tray | Active | 1.5000 V | 0 to 70 °C | Axcelerator | General Purpose | Cast Iron | 1.425V ~ 1.575V | 1,200 RPM | Ball | 73728 | 500000 | 8064 | 1 | 24.92 | 3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS1500-1FG676 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | UL | M1AFS1500 | Cat 5e | MICROSEMI CORP | TPE | Turck | U-97917 | 1.575 V | Microchip Technology | 1.425 V | 3 | 252 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | Fusion® | e0 | RJ45 | Tin/Lead (Sn/Pb) | Teal | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | No | 225 | 1 mm | compliant | S-PBGA-B676 | Not Qualified | OTHER | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1 | 38400 | 1500000 | No | 16 Feet | 25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX09-PQG160I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 160-BQFP | YES | 160-PQFP (28x28) | Aluminum | 160 | A42MX09 | 117 MHz | MICROSEMI CORP | Grace Technologies | P-D4P1#2P11#2R2-K3RX | 5.5 V | Microchip Technology | 3 V | 3 | 101 | None | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | SQUARE | FLATPACK | Active | Active | 40 | 5.27 | Yes | 3.6 V | 3 V | 3.3 V | 3.3, 5 V | -40 to 85 °C | MX | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | INDUSTRIAL | 684 CLBS, 14000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | STD | 2.5 ns | 684 | 14000 | IP65 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-FGG676 | Microchip | Datasheet | 636 |
| Min: 1 Mult: 1 | Surface Mount | 676-BGA | 676-FBGA (27x27) | AX500 | Turck | U-90539 | Microchip Technology | 336 | Tray | Active | 1.5000 V | 0 to 70 °C | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX24-2PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A42MX24 | 114.75 MHz | MICROSEMI CORP | Microsemi Corporation | A42MX24-2PQ208I | Microchip Technology | 3 | 176 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | Obsolete | 30 | 5.25 | Compliant | No | 3.6 V | 3 V | 3.3 V | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | 5 V | INDUSTRIAL | 5.5 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P125-TQG144 | Microchip | Datasheet | 16 | - | Min: 1 Mult: 1 | Surface Mount | TQFP-144 | 144-TQFP (20x20) | A3P125 | Microchip Technology / Atmel | 60 | Miscellaneous | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | MSL 3 - 168 hours | 100 I/O | 1500 LE | Tray | Active | Details | 1.575 V | 1.425 V | 36864 bit | ProASIC3 | 1.5000 V | 0.046530 oz | 0 to 70 °C | Tray | A3P125 | Programmable Logic ICs | 1.425V ~ 1.575V | 1.5 V | 2 mA | - | FPGA - Field Programmable Gate Array | 36Kbit | 125000 | STD | - | FPGA - Field Programmable Gate Array | 1.4 mm | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-FG484I | Microchip | Datasheet | 2092 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | MICROSEMI CORP | Miscellaneous | A3P600-FG484I | 1.575 V | Microchip Technology | 1.425 V | 3 | 235 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.53 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA075-FG144I | Microchip | Datasheet | 1941 |
| Min: 1 Mult: 1 | Surface Mount | 144-LBGA | 144-FPBGA (13x13) | APA075 | Hammond Power Solutions | SG3 | Microchip Technology | 100 | Tray | Active | 2.5000 V | -40 to 85 °C | ProASICPLUS | 2.3V ~ 2.7V | 27648 | 75000 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS1500-2FGG676I | Microchip | Datasheet | 669 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | Polyamide | 400.011771 mg | 676 | Straight | M1AFS1500 | Round | Bushing Grip with Strain Relief | MICROSEMI CORP | Altech | 5316301 | 8 mm | Microchip Technology | 8 mm | 3 | 252 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | Non-Metallic | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1.5e+06 | 1.47059 GHz | 2 | 38400 | 38400 | 1500000 | IP68 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-FG676I | Microchip | Datasheet | 1864 |
| Min: 1 Mult: 1 | Surface Mount | 676-BGA | 676-FBGA (27x27) | AX500 | Miscellaneous | 1.575 V | Microchip Technology | 1.425 V | 336 | Tray | Active | 1.5000 V | -40 to 85 °C | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-2FG256I | Microchip | Datasheet | 2392 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | Stainless Steel | AX250 | Grace Technologies | P-D4R2-M5R3 | 1.575 V | Microchip Technology | 1.425 V | 138 | (1) 120V Receptacle | Tray | Active | 1.5000 V | -40 to 85 °C | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX02-FVQG80 | Microchip | Datasheet | 33 |
| Min: 1 Mult: 1 | Surface Mount | 80-TQFP | YES | 80-VQFP (14x14) | Aluminum | 80 | A40MX02 | 48 MHz | MICROSEMI CORP | Grace Technologies | P-D4R3-K3R3 | 5.25 V | Microchip Technology | 3 V | 3 | 57 | (1) 120V Receptacle | 70 °C | Tray | PLASTIC/EPOXY | TQFP | TQFP, | SQUARE | FLATPACK, THIN PROFILE | Active | Active | 40 | 5.26 | Yes | 3.6 V | 3 V | 3.3 V | 3.3, 5 V | 0 to 70 °C | MX | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.65 mm | compliant | S-PQFP-G80 | Not Qualified | COMMERCIAL | 295 CLBS, 3000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | F | 3.7 ns | 295 | 3000 | IP65 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-2FGG676I | Microchip | Datasheet | 400 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771 mg | AFS1500 | 2.5 | Lower Mount | 1/4 NPT | NOSHOK | 25-400-60-psi/kPa | Microchip Technology | 252 | Tray | Active | 0-60 psi | Compliant | 1.5000 V | -40 to 85 °C | Fusion® | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1.5e+06 | 1.47059 GHz | 2 | 38400 | 1.73 mm | 27 mm | 27 mm | No |
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M1A3PE3000-1PQG208I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AFS600-FGG484K
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
388.615580
-
M1AFS1500-1FGG676
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1A3PE3000-2FGG484I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A54SX32A-2TQG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
420.407518
-
A54SX16A-2PQG208I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
302.831826
-
A3P600L-1FGG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX500-1FG676
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
276.926399
-
M1AFS1500-1FG676
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A42MX09-PQG160I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX500-FGG676
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
558.255184
-
A42MX24-2PQ208I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P125-TQG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P600-FG484I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
120.567989
-
APA075-FG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
260.573672
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M1AFS1500-2FGG676I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX500-FG676I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
276.926399
-
AX250-2FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
261.579195
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A40MX02-FVQG80
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
105.504300
-
AFS1500-2FGG676I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
646.537416